DALLAS DS80C320
Abstract: 25863
Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DS1232
DK933191AAJ
HRS87C520
DS87C520
DE013425AAD
J-STD-020
30C/60%
DALLAS DS80C320
25863
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dallas date code ds1230
Abstract: 25091 e8 sot223 24446
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC
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DS1621
DS1869
DK815282AAB
DJ824247ABA
DM846764AA
DS2502
DS87C520
DN901118AAB
DK935356AAB
dallas date code ds1230
25091
e8 sot223
24446
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DS1233 a5
Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC
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DS1621
DK815282AAB
DK906731AAC
DS1869
DJ821534ABB
DJ824252AAC
DJ824247ABA
DS1233 a5
e8 sot223
9915
dallas 25010
DN819
densit
DS1232L
ds1232l datasheet
DS1869
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TI date code
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG
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DM941230AG
DM941226AA
DS2502
DM941226AA
DM941230AG
TI date code
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dallas date code ds1230
Abstract: dallas ds1230 25919 DS1230
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:
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DS1621
DE940040AAC
DS5002
DS87C520
DM925587AAF
DK935356AAB
DK933191AAJ
DE952427AAD
DE014522ADB
dallas date code ds1230
dallas ds1230
25919
DS1230
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74 HTC 00
Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
DK935356AAB
J-STD-020
30C/60%
74 HTC 00
74 HTC 08
DS1302 DIE REVISION
Hyundai 9944
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