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    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA


    Original     		PDF DM941226AA DM941230AG DS2502 DM941230AG DM941226AA

    dallas date code ds1230

    Abstract: 25091 e8 sot223 24446
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC


    Original     		PDF DS1621 DS1869 DK815282AAB DJ824247ABA DM846764AA DS2502 DS87C520 DN901118AAB DK935356AAB dallas date code ds1230 25091 e8 sot223 24446

    TI date code

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG


    Original     		PDF DM941230AG DM941226AA DS2502 DM941226AA DM941230AG TI date code

    DALLAS DS80C320

    Abstract: 25863
    Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1232L DS1232 DK933191AAJ HRS87C520 DS87C520 DE013425AAD J-STD-020 30C/60% DALLAS DS80C320 25863

    DS-1000

    Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH927108AJC J-STD-020 30C/60% DS-1000 DS1302 DIE REVISION DH020 25409

    dallas date code ds1230

    Abstract: dallas ds1230 25919 DS1230
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:


    Original     		PDF DS1621 DE940040AAC DS5002 DS87C520 DM925587AAF DK935356AAB DK933191AAJ DE952427AAD DE014522ADB dallas date code ds1230 dallas ds1230 25919 DS1230

    dallas date code ds1230

    Abstract: dallas date code dallas ds1230 code 25807
    Text: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K


    Original     		PDF DS5002 DS87C520 DM925587AAF DN901118AAB DK935356AAB J-STD-020 DM929359AB DS1232 DS1233 dallas date code ds1230 dallas date code dallas ds1230 code 25807

    74 HTC 00

    Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH927108AJC DK935356AAB J-STD-020 30C/60% 74 HTC 00 74 HTC 08 DS1302 DIE REVISION Hyundai 9944