Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DAEWON TRAY Search Results

    DAEWON TRAY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38327WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation

    DAEWON TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    daewon

    Abstract: DAEWON drawing
    Text: u Chapter 7 Trays Organic Pin Grid Array: 453-Pin OGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 60°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging C


    Original     		PDF 453-Pin daewon DAEWON drawing

    daewon

    Abstract: Trays DAEWON drawing 453-Pin
    Text: u Chapter 7 Trays Ceramic Pin Grid Array: 321-Pin, 453-Pin CGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 65°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging Co.


    Original     		PDF 321-Pin, 453-Pin daewon Trays DAEWON drawing

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


    Original     		PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    DAEWON tray 48

    Abstract: daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FAA 064 322.6 315.0 * 2.54 R. 4 PLACES VACUUM PICKUP CELLS 10 PLACES (6 CENTER CELLS, 4 SIDE CELLS) 5.62* X 7.62 SEE DETAIL "D" Z Y SEE DETAIL "E" X X 112.0 135.9* ±0.25 92.1 * 16.00 B 12.7 * 11.95 CHAMFER


    Original     		PDF 3417-1a 27458b 3467b 26040h DAEWON tray 48 daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    daewon

    Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1


    Original     		PDF 26048i 3412-2a 26396f FBD63 12F-0814-D19 3412-2b daewon TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19

    daewon

    Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"


    Original     		PDF 3472b 26946h f27839b-opt2 daewon 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11

    12B-0608-F19

    Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
    Text: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X


    Original     		PDF 0X45M 3466b 26022i 12B-0608-F19 DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A

    daewon tray

    Abstract: daewon TRAY MPPO 56LD MPPO DAEWON 100 3468B
    Text: ‹ Chapter 5 Trays Shrink Small Outline Package: SSO 056 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 8 PLACES 6.35 * X Y 7.62 Z (4 CENTER CELLS, 4 SIDE CELLS) SEE DETAIL "E" X X 105.90 ±0.25 135.9* 92.1 * 21.18 B 12.7 * 25.70 15.00 16.15 CHAMFER


    Original     		PDF 3468b 26254d daewon tray daewon TRAY MPPO 56LD MPPO DAEWON 100

    daewon

    Abstract: DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLB 044, VDA 044, VDD 044, NLB 056, NSB 056 3416 \ f27328a \ 12-13-07 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 17 Oct 2008 5-63


    Original     		PDF f27328a f29719a f29858a daewon DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO

    3469b

    Abstract: daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-35 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048


    Original     		PDF 28809b 3469b 26637c daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU

    daewon

    Abstract: FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: TLD 064, FEA 084, FED 084, FMC 084, TLD 084, TSD 084, FWA 084, FMC 107, FMC 115, FOA 115, FWA 115, FEA 137, FMC 137, FTF 137, TLD 137, TSD 137 322.6 315.0 * 2.54 R. 4 PLACES 5.62 * X SEE DETAIL "D" VACUUM PICKUP CELLS


    Original     		PDF 31ext 28391a 28806a daewon FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084

    daewon

    Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook


    Original     		PDF f27326 3474b 27327d daewon DAEWON FBGA LAA064 FBGA 137 DAEWON LAA

    daewon

    Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044


    Original     		PDF f28384b VDJ044 28805c 3477b 27776c daewon VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA

    daewon

    Abstract: DAEWON tray 48 3471A daewon tray DAEWON FBGA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLA 048, NSA 048, VDC 048, NLA 060, MTA 133, NLC 133 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 10 PLACES BUMPS 8 PLACES Y (2 CENTER CELLS, 8 SIDE CELLS) 6.35 * SEE DETAIL "D" X 7.62 Z SEE DETAIL "E"


    Original     		PDF 29718b 29716a daewon DAEWON tray 48 3471A daewon tray DAEWON FBGA

    daewon

    Abstract: CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB
    Text: Product Change Notification PCN #: 809 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


    Original     		PDF 31X31 21154-AB 21154-BB daewon CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		PDF AN-659-1 FC-BGA T0812012 daewon tray

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		PDF AN-657-1 KS-886H Kostat tray

    DAEWON tray drawing

    Abstract: TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261
    Text: R E V IS IO N S REV 01 02 DESCRIPTION MPPO 150‘C TRAY ADDED NEW PACKAGE, AC/ACG 100 & NOTES DATE 0 2 /2 1 /0 5 0 6 /0 1 /0 6 APPRO VED K K Thee KK Thee 6.35 S E E D ETA IL 'D ' !-»! 0.20 »3=DIAfzWI -10.20 M IAI X (M 7.62 m 311.15 - • +0.25 -0.13


    OCR Scan     		PDF 11x11 MSC17011 P7-134- MSC-1702 DAEWON tray drawing TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261

    DAEWON tray drawing

    Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
    Text: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I


    OCR Scan     		PDF P7-246-000) 15X15 -30VS MSC17011 P7-139- MSC-1707 DAEWON tray drawing TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032

    CABGA 8X8

    Abstract: DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon
    Text: REVISIONS REV 00 01 DESCRIPTION IN IT IA L R ELEASE A DDED NEW PAC KA G E - — 6,35 DATE 0 1 /1 4 /0 5 APPROVED QUAN LUU 0 4 /2 2 /0 9 KK Thee B F /B F G 81 h0-l Q.gQ H I aTxWI — 7,62 -|Q.gQ(H)|A|Z(l 311.15- +0.25 -0.13 -1 3 2 .0 8 • +0.25 -0.13


    OCR Scan     		PDF 83-lOVS P7-176-000 MSC-1777 MSC17011 CABGA 8X8 DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon

    DAEWON tray drawing

    Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
    Text: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.


    OCR Scan     		PDF 5M-1994. DAEWON tray drawing TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9