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    DAEWON BGA Search Results

    DAEWON BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    DAEWON BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		PDF AN-657-1 KS-886H Kostat tray

    CM16C550P

    Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP
    Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP

    Intel StrataFlash Memory j3

    Abstract: BGA 6x6 tray daewon 273416 Intel 80321
    Text: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface


    Original     		PDF 64-bit/66MHz --64-bit/133MHz 32-bit 64-bit --PC200 VCC33 Intel StrataFlash Memory j3 BGA 6x6 tray daewon 273416 Intel 80321

    intel 80219

    Abstract: 80219 XScale 80219 daewon daewon tray BGA 6x6 tray PAR64 PC200 REQ64 CC2538
    Text: Intel 80219 General Purpose PCI Processor Datasheet Extended Temperature Support Product Features • ■ ■ ■ Core Features — Integrated Intel XScale® Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		PDF 64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 80219 XScale 80219 daewon daewon tray BGA 6x6 tray PAR64 PC200 REQ64 CC2538

    BGA 6x6 tray

    Abstract: daewon tray tray bga 6x6 PAR64 PC200 REQ64 daewon bga
    Text: Intel 80321 I/O Processor Datasheet Advance Information Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		PDF 64-bit/66MHz --64-bit/133MHz 32-bit 64-bit --PC200 VCC33 BGA 6x6 tray daewon tray tray bga 6x6 PAR64 PC200 REQ64 daewon bga

    PCE-5

    Abstract: Intel 80321 P5 microarchitecture CC2538 BGA 6x6 tray daewon AE23 PAR64 PC200 544LE
    Text: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface


    Original     		PDF 64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 PCE-5 Intel 80321 P5 microarchitecture CC2538 BGA 6x6 tray daewon AE23 PAR64 PC200 544LE

    intel 80219

    Abstract: XScale 80219
    Text: Intel 80219 General Purpose PCI Processor Datasheet Extended Temperature Support Product Features • ■ ■ ■ Core Features — Integrated Intel XScale® Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		PDF 64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 XScale 80219