CTE TABLE BGA Search Results

CTE TABLE BGA Result Highlights (5)

Part	Manufacturer	Description
84512-202	Amphenol Communications Solutions	100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
10022671-102LF	Amphenol Communications Solutions	528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
84501-001LF	Amphenol Communications Solutions	300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
55714-102LF	Amphenol Communications Solutions	81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
84520-002LF	Amphenol Communications Solutions	400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free

CTE TABLE BGA Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
106 10k 804 Abstract: 106F 213B Text: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &	Original		PDF
JEDEC JESD22-B117 Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet Text: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4	Original		PDF
PCN0712 Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array	Original	PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100	PDF
PCN0708 Abstract: hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing encapsulant material changes on the ball-grid array BGA Pb-free packages assembled in Amkor Korea and	Original	PCN0708 PCN0708, CRP-3300NH CB0260AT CRP-3900 CB062 PCN0708 hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E	PDF
AUS308 Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using	Original	CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal	PDF
Untitled Abstract: No abstract text available Text: Electrical Characteristics 12.1 Signal Specifications 12.1.1 Unused Pins 12 For reliable operation, always connect unused inputs to an appropriate signal level. Unused A G TL+ inputs should be connected to V 7 7 . Unused active low 3.3 V-tolerant inputs should be	OCR Scan		PDF
Altera Flip Chip BGA warpage Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD Text: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: kcchange@tsmc.com	Original		PDF
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles	PDF
Untitled Abstract: No abstract text available Text: 128K x 36 3.3V Synchronous ZBT SRAM 2.5V I/O, Burst Counter Pipelined Outputs Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT71V2546S/XS Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read	Original	IDT71V2546S/XS IDT71V2546 71V2548 150MHz	PDF
cte table bga Abstract: datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate	Original	SPRA471A cte table bga datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow	PDF
Untitled Abstract: No abstract text available Text: 128K x 36 3.3V Synchronous ZBT SRAM 2.5V I/O, Burst Counter Pipelined Outputs Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT71V2546S/XS Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read	Original	IDT71V2546S/XS 150MHz	PDF
12x12 bga thermal resistance Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE	Original	SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack	PDF
Untitled Abstract: No abstract text available Text: 128K x 36 3.3V Synchronous ZBT SRAMs 2.5V I/O, Burst Counter Pipelined Outputs Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT71V2556S/XS IDT71V2556SA/XSA Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read	Original	IDT71V2556S/XS IDT71V2556SA/XSA IDT71V2556 71V2558 200MHz. 150MHz	PDF

c 6090 Abstract: cte table epoxy substrate TMS320VC549 TMS320VC549GGU package cte Text: Application Report SPRA471C - April 2003 High-Density Design With MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications ABSTRACT The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real	Original	SPRA471C c 6090 cte table epoxy substrate TMS320VC549 TMS320VC549GGU package cte	PDF
IDT71V2556 Abstract: IDT71V2558 IDT71V3556 IDT71V3558 Text: PRELIMINARY IDT71V2556, IDT71V2558 IDT71V3556, IDT71V3558 128K x 36, 256K x 18, 3.3V SYNCHRONOUS SRAMS WITH ZBT FEATURE, 2.5V or 3.3V I/O, BURST COUNTER, AND PIPELINED OUTPUTS FEATURES: The IDT71Vx556/58 contain data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used	Original	IDT71V2556, IDT71V2558 IDT71V3556, IDT71V3558 IDT71Vx556/58 100-lead 119-lead IDT71V2556 IDT71V2556 IDT71V2558 IDT71V3556 IDT71V3558	PDF
L4878 Abstract: IDT71V2557 IDT71V2559 IDT71V3557 IDT71V3559 Text: PRELIMINARY IDT71V2557,IDT71V2559 IDT71V3557, IDT71V3559 128K x 36, 256K x 18, 3.3V SYNCHRONOUS SRAMS WITH ZBT FEATURE, BURST COUNTER AND FLOW-THROUGH OUTPUTS FEATURES: • 128K x 36, 256K x 18 memory configurations. • Supports high performance system speed - 100 MHz	Original	IDT71V2557 IDT71V2559 IDT71V3557, IDT71V3559 100-lead 119-lead IDT71V2557 IDT71V3557 L4878 IDT71V2559 IDT71V3557 IDT71V3559	PDF
texas instruments reliability report Abstract: cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate	Original	SPRA471A texas instruments reliability report cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU	PDF
IDT71V2556 Abstract: IDT71V2558 IDT71V3556 IDT71V3558 Text: PRELIMINARY IDT71V2556, IDT71V2558 IDT71V3556, IDT71V3558 128K x 36, 256K x 18, 3.3V SYNCHRONOUS SRAMS WITH ZBT FEATURE, 2.5V or 3.3V I/O, BURST COUNTER, AND PIPELINED OUTPUTS FEATURES: The IDT71Vx556/58 contain data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used	Original	IDT71V2556, IDT71V2558 IDT71V3556, IDT71V3558 IDT71Vx556/58 100-lead 119-lead IDT71V2556 IDT71V2556 IDT71V2558 IDT71V3556 IDT71V3558	PDF
Untitled Abstract: No abstract text available Text: KM736V799 128Kx36 Synchronous SRAM Document Title 128Kx36-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No 0.0 0.1 History Draft Date Remark Initial d ra ft A pril . 14. 19 98 P re lim in a ry C h a n g e U n d e rs h o o t s p e c A pril . 20. 19 98	OCR Scan	KM736V799 128Kx36 128Kx36-Bit 100-TQFP-1420A 50REF	PDF
Loctite hysol 501 Abstract: LOCTITE HYSOL FP4549 Epotek 600-2 h20E FP4549 laser Displacement linear ccd nikon ROGERS DUROID Loctite hysol IPACK2005 Text: Proceedings ofofIPACK2005 Proceedings IPACK2005 ASME InterPACK '05 ASME InterPACK '05 JulyJuly 17-22, San Francisco, California, USA 17-22, San Francisco, California, USA IPACK2005-73258 IPACK2005-73258 HIGH RESOLUTION CHARACTERIZATION OF MATERIALS USED IN PACKAGES	Original	IPACK2005 IPACK2005-73258 Loctite hysol 501 LOCTITE HYSOL FP4549 Epotek 600-2 h20E FP4549 laser Displacement linear ccd nikon ROGERS DUROID Loctite hysol IPACK2005	PDF
FR4 epoxy dielectric constant 4.4 Abstract: FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003 Text: HF Transmission Introduction This document deals with HF Transmission issues in high-speed and broadband applications using Atmel ADCs and DACs. It stresses the hardware choices to be made to reach an optimum tradeoff between high-speed, broadband performances and system	Original	352A-BDC-10/03 FR4 epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003	PDF
CBGA 255 motorola Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in	Original	AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin	PDF
UG 74 a Abstract: No abstract text available Text: IDT71V2546S/XS 128K x 36, 256K x 18 3.3V Synchronous ZBT SRAMs IDT71V2548S/XS IDT71V2546SA/XSA 2.5V I/O, Burst Counter IDT71V2548SA/XSA Pipelined Outputs Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ Address and control signals are applied to the SRAM during one clock	Original	IDT71V2546S/XS IDT71V2548S/XS IDT71V2546SA/XSA IDT71V2548SA/XSA IDT71V2546/48 UG 74 a	PDF

CTE TABLE BGA Search Results

CTE TABLE BGA Result Highlights (5)

CTE TABLE BGA Datasheets Context Search

underfill

106 10k 804

JEDEC JESD22-B117

PCN0712

PCN0708

AUS308

Untitled

Altera Flip Chip BGA warpage

ceramic rework

Untitled

cte table bga

Untitled

12x12 bga thermal resistance

Untitled

c 6090

IDT71V2556

L4878

texas instruments reliability report

IDT71V2556

Untitled

Loctite hysol 501

FR4 epoxy dielectric constant 4.4

CBGA 255 motorola

UG 74 a