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    PCN0708

    Abstract: hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing encapsulant material changes on the ball-grid array BGA Pb-free packages assembled in Amkor Korea and


    Original     		PCN0708 PCN0708, CRP-3300NH CB0260AT CRP-3900 CB062 PCN0708 hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E PDF