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    BGA34 Search Results

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    BGA34 Price and Stock

    Schneider Electric BGA34045Y

    MOLDED CASE CIRCUIT BRKR 480Y/27
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    DigiKey BGA34045Y Box 1
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    Schneider Electric BGA34090Y

    MOLDED CASE CIRCUIT BRKR 480Y/27
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    DigiKey BGA34090Y Box 1
    • 1 $1412.01
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    Schneider Electric BGA34110Y

    MOLDED CASE CIRCUIT BRKR 480Y/27
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    DigiKey BGA34110Y Box 1
    • 1 $1694.01
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    Schneider Electric BGA34040Y

    MOLDED CASE CIRCUIT BRKR 480Y/27
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    DigiKey BGA34040Y Box 1
    • 1 $1205
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    Schneider Electric BGA34020Y

    MOLDED CASE CIRCUIT BRKR 480Y/27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA34020Y Box 1
    • 1 $1205
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    BGA34 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    P-BGA345-23x23-1

    Abstract: PRBG0345FB-A
    Text: JEITA Package Code P-BGA345-23x23-1.00 RENESAS Code PRBG0345FB-A Previous Code 345FHP MASS[Typ.] 2.1g φb A A φx M S AB ZD A1 e e B D y S Index mark Laser mark S ZE E AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 101112131415161718192021


    Original     		P-BGA345-23x23-1 PRBG0345FB-A 345FHP PRBG0345FB-A PDF

    MS-034

    Abstract: sot828 SOT828-1
    Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline BGA340: plastic ball grid array package; 340 balls; body 23 x 23 x 1.7 mm SOT828-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e ∅v M b ∅w M AB AA Y W V U T R P N M L K J H G F E


    Original     		BGA340: OT828-1 MS-034 MS-034 sot828 SOT828-1 PDF

    SF-BGA340A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA340A C 26.67mm [1.050"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X Top View reference only 26.67mm [1.050"] 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 0.64mm


    Original     		BGA340A FR4/G10 SF-BGA340A-B-11 PDF

    PRBG0345FA-A

    Abstract: No abstract text available
    Text: JEITA Package Code P-BGA345-23x23-1.00 RENESAS Code PRBG0345FA-A D MASS[Typ.] 1.7g A b A D1 B Previous Code 345F7X-A S AB ZD e AA Y W V U T R P N M L K J H G F E D C B A ZE E1 E e A1 y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Reference


    Original     		P-BGA345-23x23-1 PRBG0345FA-A 345F7X-A PRBG0345FA-A PDF

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


    Original     		KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor PDF

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX PDF

    TLC nand

    Abstract: jz4760 ingenic D16-DDR tlc nand flash 1080P CCIR656 IEEE745 mobile color LCD DISPLAY PINOUT nand flash tlc
    Text: JZ4760 Mobile Application Processor Data Sheet Release Date: Jan. 05, 2011 JZ4760 Mobile Application Processor Data Sheet Copyright 2005-2010 Ingenic Semiconductor Co. Ltd. All rights reserved. Disclaimer This documentation is provided for use with Ingenic products. No license to Ingenic property rights is


    Original     		JZ4760 JZ4760 12MHz) TLC nand ingenic D16-DDR tlc nand flash 1080P CCIR656 IEEE745 mobile color LCD DISPLAY PINOUT nand flash tlc PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    BA100 diode

    Abstract: BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode
    Text: KADxx0300B - Txxx MCP MEMORY Document Title Multi-Chip Package MEMORY 128M Bit Two Dual Bank 64M Bit NOR Flash Memory / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark August 9, 2002 Preliminary 0.0 Initial Draft 0.1 Revised (UtRAM)


    Original     		KADxx0300B 2Mx16) 69-Ball 10MAX BA100 diode BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode PDF

    BA107

    Abstract: ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA107 ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941 PDF

    BA114

    Abstract: BA107 samsung ba92 BA122
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA114 BA107 samsung ba92 BA122 PDF

    BA961

    Abstract: BA43 48FBGA samsung nor flash ba107
    Text: K8D6x16UTM / K8D6x16UBM NOR FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA961 BA43 samsung nor flash ba107 PDF

    STLC90114

    Abstract: BGA416 STLC90115 TQFP100 TS615 23X23
    Text: ZipperWire Chipset for VDSL Modem Zipper-DMT VDSL can deliver up to 100Mbits/s over phone line STMicroelectronics Zipper-DMT technology, already demonstrated in prototype form, brings the symmetrical bandwidth of Very high bitrate Digital Subscriber Line VDSL up to


    Original     		100Mbits/s 100Mbit/s frequencies89 FLZIPPER/0602 STLC90114 BGA416 STLC90115 TQFP100 TS615 23X23 PDF

    SAMSUNG MCP

    Abstract: KBB05A500 transistor BA29 BA102 NAND FLASH BGA transistor ba47 Pre-programming nand samsung UtRAM Density BA841 BGA-100
    Text: KBB0xA500M - T402 MCP MEMORY Document Title Multi-Chip Package MEMORY 64M Bit 8Mx8/4Mx16 Dual Bank NOR Flash *2 / 128M Bit (8Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft October 15, 2002


    Original     		KBB0xA500M 8Mx8/4Mx16) 8Mx16) 4Mx16) 150uA 100uA 200uA 80-Ball 80x12 SAMSUNG MCP KBB05A500 transistor BA29 BA102 NAND FLASH BGA transistor ba47 Pre-programming nand samsung UtRAM Density BA841 BGA-100 PDF

    KBB0XA300M

    Abstract: transistor ba47 SAMSUNG MCP BA108 BA102 BA99 NAND FLASH BGA BGA34 BGA22 t402
    Text: Preliminary MCP MEMORY KBB0xA300M - T402 Document Title Multi-Chip Package MEMORY 64M Bit 8Mx8/4Mx16 Dual Bank NOR Flash *2 / 128M Bit (8Mx16) NAND Flash / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark October 15, 2002 Preliminary


    Original     		KBB0xA300M 8Mx8/4Mx16) 8Mx16) 2Mx16) 80-Ball 80x12 transistor ba47 SAMSUNG MCP BA108 BA102 BA99 NAND FLASH BGA BGA34 BGA22 t402 PDF

    BA107

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX BA107 PDF

    GS-22-008 EUROPEAN DIRECTIVES

    Abstract: w25q32b w25q32
    Text: ADSP-BF609 EZ-KIT Lite Evaluation System Manual Revision 1.0, March 2012 Part Number 82-000269-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 a Copyright Information 2012 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written


    Original     		ADSP-BF609 No-11N ADP1715 DO-214AA OD-523 GSOT03 OT23-3 1-800-ANALOGD A0269-2011 GS-22-008 EUROPEAN DIRECTIVES w25q32b w25q32 PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF