reflow soldering profile BGA
Abstract: reflow temperature bga BGA PROFILING bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already
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reflow soldering profile BGA
Abstract: BGA PROFILING solder joint bga warpage bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed
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reflow temperature rohs bga
Abstract: 0.65mm pitch BGA
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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0.65mm pitch BGA
Abstract: ASTM-B-488 157 BGA socket
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 0.8mm, 1.0mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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SY68730ZC
Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
Text: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18
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KS8695PX
KSZ8695PX
KS8721BL
KS8995M
KS8995X
KS8995E
SY68730ZC
MIC29302BT
SY68730
sy10s897
0343a
KS8721BL
Unisem
tsmc cmos
tsmc cmos 0.35
KSZ8695PX
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Surface Insulation Resistance FR 4 PCB
Abstract: No abstract text available
Text: MAXIMUM solutions MILL-MAX 1mm & .050” GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm and .050” grid footprints. For socketing BGA devices, a Socket is reflow
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VRMS/150
Surface Insulation Resistance FR 4 PCB
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bga rework
Abstract: BGA-3501-SN 3500-SN reflow temperature bga metcal RBHB Process-Control rework
Text: Precision Systems for the Electronics Bench New! Metcal Single Head BGA Rework System The Economical Solution to BGA Rework BGA 3500-SN Series Single Head BGA Rework System When your BGA rework needs are simpler and don't require a specialized vision system, the economical BGA 3500-SN series is the system for your work bench. With the dependability of Metcal
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3500-SN
300mm
380mm)
BGA-3501-SN
BGA-3502-SN
bga rework
BGA-3501-SN
reflow temperature bga
metcal
RBHB
Process-Control
rework
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sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen
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BGA Solder Ball compressive force
Abstract: bga solder ball shear
Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA
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10067807-101LF
10076728-101LF
10067811-101LF
ELXAIRMXBGA0109ELT
BGA Solder Ball compressive force
bga solder ball shear
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Surface Insulation Resistance FR 4 PCB
Abstract: alloy 25 BeCu
Text: MAXIMUM solutions MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS Mill-Max’s 0.8mm BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are also available to fit 1mm and .050” grid footprints.
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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BGA-3000
Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop
Text: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions
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BGA-3590
CSP-3500
BGA-3500
D-64521
BGA-3000
Metcal CSP 3502
Metcal BGA-3591
metcal bga-3000
METCAL MX-500 circuit
BGA-3591
BGA-3592
reflow temperature bga laptop
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QFP Package 128 lead .5mm
Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Text: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm
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26X26
27X27mm
PC-BGA/QFP-SX72A-Z-01
A54Sx72A-CQ256
A54SX72A-FG484
SI-SX72-ACQ256SFG484
QFP Package 128 lead .5mm
QFP 128 lead .5mm
BGA reflow guide
SI-SX72-ACQ256SFG484
BGA 256 PACKAGE thermal resistance
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BGA reflow guide
Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to
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ADV0115
Abstract: improves EP20K200E EP20K300E
Text: CUSTOMER ADVISORY ADV0115 EP20K200E and EP20K300E 652-Ball BGA Package Improvement Change Description: The EP20K200E and EP20K300E 652-Ball BGA packages will be re-enforced with a stiffener added to the top of the package. Reason For Change: This change improves EP20K200E and EP20K300E 652-Ball BGA package coplanarity
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ADV0115
EP20K200E
EP20K300E
652-Ball
ADV0115
improves
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Untitled
Abstract: No abstract text available
Text: BGA 4-Pin, Optical Transceiver Sensitivity, Absorptive Low Pass Filter Series FL7B5BC*S Series This specification applies to distributed passive element filter networks in a surface mountable BGA 6-pin package. The Filter performs an absorptive, low pass function that attenuates high frequencies with low phase dispersion . The high bandwidth BGA
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3MUSO17931
10Gbps
100pS
FL02M653
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Transceiver 20 GHz
Abstract: No abstract text available
Text: BGA 6-Pin, Optical Transceiver Sensitivity, Absorptive Low Pass Filter Series FL7B5BH*S Series This specification applies to distributed passive element filter networks in a surface mountable BGA 6-pin package. The Filter performs an absorptive, low pass function that attenuates high frequencies with low phase dispersion . The high bandwidth BGA
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10Gbps
100pS
FL02M651
Transceiver 20 GHz
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entek Cu-56
Abstract: thick bga die size Cu-56 stencil tension BGA "direct replacement" bga rework "ball collapse" height
Text: APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array BGA package family. These recommendations were derived from work done by the Universal BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium. The
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FF1152
Abstract: FG256 BF957
Text: R Package Specifications This section contains specifications for the following Virtex-II packages: 450 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 451 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 452 • "FG456 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 453
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CS144
FG256
FG456
FG676
BG575
BG728
FF896
FF1152
FF1517
BF957
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35 x 35 PBGA, 580 100 balls
Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8
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C13550EJ1V0PF00
35 x 35 PBGA, 580 100 balls
Enplas drawings
HG7900
BGA Ball Crack
153pin
NEC stacked CSP 2000
PEAK TRAY bga
BGA-35
Lead Free reflow soldering profile BGA
NEC stacked CSP
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