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    BGA 310 Search Results

    BGA 310 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 310 Price and Stock

    Carling Technologies VDB2UJPB-GAC63-100

    Rocker Switches VDB2UJPBGAC63100
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics VDB2UJPB-GAC63-100
    • 1 $29.84
    • 10 $26.73
    • 100 $25.08
    • 1000 $24.31
    • 10000 $24.31
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    BGA 310 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA 310 Infineon Technologies Silicon bipolar MMIC amplifier Original PDF
    BGA310 Siemens RF-Transistors, MMICs, RF-Diodes, AF-Diodes, AF-Schottky Diodes and RF-Schottky Diodes Guide Original PDF
    BGA310 Siemens Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 9 dB typical gain at 1.0 GHz 9 dBm typical P-1dB at 1.0 GHz 3 dB-bandwidth: DC to 2.4 GHz) Original PDF
    BGA310 Siemens Silicon Bipolar MMlC-Amplifier Scan PDF

    BGA 310 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


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    EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF

    EP20K100E

    Abstract: t25 4 j5
    Text: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8


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    EP20K100E 144-Pin 208-Pin 240-Pin 324-Pin 356-Pin PT-EP20K100E-1 t25 4 j5 PDF

    transistor A7

    Abstract: G28F640J5 A5D2 Apr98
    Text: CIC-56µ µBGA-48D-A6-YAM 56-Bump µ BGA to a 48-Pin DIP Apr-98 µ BGA DEVICES: EXAMPLES PIN CONFIGURATION: G28F320J5 G28F640J5 SOCKET: Yamaichi NP291-07210-AC08338 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $310.00 $279.00 $263.50 $232.50 TYPICAL DIMENSIONS:


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    CIC-56 BGA-48D-A6-YAM 56-Bump 48-Pin Apr-98 G28F320J5 G28F640J5 NP291-07210-AC08338 transistor A7 G28F640J5 A5D2 Apr98 PDF

    Untitled

    Abstract: No abstract text available
    Text: ESMT Preliminary M53D128168A Revision History Revision 1.0 16 Nov. 2007 - Original Revision 1.1 (02 Jan. 2008) - Change BGA package - Modify tIS Revision 1.2 (16 Jan. 2008) - Add 8x10mm BGA package Elite Semiconductor Memory Technology Inc. Publication Date : Jan. 2008


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    8x10mm M53D128168A M53D128168A PDF

    AE23

    Abstract: EP20K100E
    Text: EP20K100E I/O Pins ver. 1.1 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP PQFP PQFP FineLine 1 (1) (1) BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8


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    EP20K100E 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin AE23 PDF

    micron BGA SDRAM

    Abstract: 64MX4 MT48LC64M4A2FB-75 BGA OUTLINE DRAWING
    Text: ISSD64M8PBB 512Mb 64Mbits x 8 SDRAM BGA Memory Stack GENERAL DESCRIPTION Irvine Sensors Corporation has developed the next generation of stacked memory that fits within the identical JEDEC monolithic outline as a single BGA chip. The 512Mbit Stacked-SDRAM is a high-speed


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    ISSD64M8PBB 512Mb 64Mbits 512Mbit 512Mbit 256Mbit 32Mbit MT48LC64M 025mm. micron BGA SDRAM 64MX4 MT48LC64M4A2FB-75 BGA OUTLINE DRAWING PDF

    AE23

    Abstract: EP20K100E AF-1
    Text: EP20K100E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – – – – 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA FineLine BGA BGA


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    EP20K100E 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin AE23 AF-1 PDF

    AH35

    Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
    Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    EP20K1000C 652-Pin 672-Pin 020-Pin AH35 AA10 AM11 AN10 AN11 817 g24 b34 844 AB30 af31 PDF

    AA10

    Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
    Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    EP20K600C 652-Pin 672-Pin 020-Pin AA10 AE10 AF10 AG10 AJ10 AK10 AF31 PDF

    R2880

    Abstract: PAD20 PAD31 PIO46 BCD adder use rom
    Text: R2880 Data Sheet - BGA FAST ETHERNET RISC PROCESSOR RDC RISC DSP Communication RDC Semiconductor Co., Ltd http://www.rdc.com.tw TEL: 886-3-666-2866 FAX: 886-3-563-1498 R2880 Data Sheet - BGA Preliminary Version 0.1 March 2, 2004 1 RDC R2880 RISC DSP Communication


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    R2880 R2880 PAD20 PAD31 PIO46 BCD adder use rom PDF

    VPS05178

    Abstract: BGA 310
    Text: BGA 310 Silicon Bipolar MMIC-Amplifier 3  Cascadable 50 -gain block  9 dB typical gain at 1.0 GHz 4  9 dBm typical P -1dB at 1.0 GHz  3 dB-bandwidth: DC to 2.4 GHz 2 1 RF IN RF OUT/Bias 1 VPS05178 3 Circuit Diagram 2, 4 GND EHA07312 Type Marking BGA 310


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    VPS05178 EHA07312 OT-143 Oct-26-1999 VPS05178 BGA 310 PDF

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


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    CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576 PDF

    MT46V16M16

    Abstract: DQ0-DQ15 62-ball DDR333 ISDD128M4PBB MT46V32M8 MT46V64M4 PC2700 A0-A12
    Text: ISDD128M4PBB ISDD64M8PBC ISDD32M16PBD *ADVANCED INFORMATION 512 Mb DDR SDRAM BGA Memory Stack GENERAL DESCRIPTION Irvine Sensors Corporation has developed the next generation of stacked memory that fits within the identical monolithic outline as a single BGA chip. The 512Mb Stacked DDR SDRAM is a high-speed


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    ISDD128M4PBB ISDD64M8PBC ISDD32M16PBD 512Mb 512Mbit 256Mb A0-A12 MT46V16M16 DQ0-DQ15 62-ball DDR333 ISDD128M4PBB MT46V32M8 MT46V64M4 PC2700 A0-A12 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .


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    100-Pin 100-Ball 120-Pin 128-Pin 133-Pin 144-Ball 160-Pin 176-Pin PDF

    JS28F256P33

    Abstract: PC28F256P33 PC28F256P33BF RC28F256P33 RC28F256P33BF JS28F256P33BF JS28F256P33TF PC48F4400P0TB0E PC28F256P33B PC28F256P33TF
    Text: Numonyx AxcellTM Flash Memory P3365nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ „ „ High performance: — 95ns initial access time for Easy BGA — 105ns initial access time for TSOP — 25ns 16-word asynchronous-page read mode — 52MHz (Easy BGA) with zero wait states,


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    P3365nm) 256-Mbit, 512-Mbit 256M/256M) 105ns 16-word 52MHz 512-word 32-KByte JS28F256P33 PC28F256P33 PC28F256P33BF RC28F256P33 RC28F256P33BF JS28F256P33BF JS28F256P33TF PC48F4400P0TB0E PC28F256P33B PC28F256P33TF PDF

    JEDEC JESD22-B117

    Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet
    Text: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4


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    PDF

    AG10

    Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
    Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    020-Pin 672-Pin TRACEPKT10 TRACEPKT11 AG10 AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528 PDF

    B8530

    Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
    Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


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    020-Pin 672-Pin TRACEPKT10 TRACEPKT11 B8530 OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 PDF

    stencil tension

    Abstract: AN1028 AN-1028 BHARAT pcb warpage* in smt reflow
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s iPOWIR BGA Packages Table of Contents Page Introduction . 1


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    AN-1028 stencil tension AN1028 AN-1028 BHARAT pcb warpage* in smt reflow PDF

    106 10k 804

    Abstract: 106F 213B
    Text: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &


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    PDF

    AA23

    Abstract: AC25 EP20K160E
    Text: EP20K160E I/O Pins ver. 1.4 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8


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    EP20K160E 144-Pin 208-Pin 240-Pin 356-Pin 484-Pin AA23 AC25 PDF

    AA23

    Abstract: AC25 EP20K160E
    Text: EP20K160E I/O Pins ver. 1.3 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8


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    EP20K160E 144-Pin 208-Pin 240-Pin 356-Pin 484-Pin AA23 AC25 PDF

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


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    AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029 PDF

    AA10

    Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA


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    EP20K200E 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet PDF