BGA 176 ball package datasheet
Abstract: BGA 176 ball package BGA 176 datasheet BGA176
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC To Top / Package Lineup / Package Index BGA-176P-M01 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plastic mold BGA-176P-M01 176-pin plastic FBGA (BGA-176P-M01)
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BGA-176P-M01
176-pin
BGA-176P-M01)
B176001S-1C-1
BGA 176 ball package datasheet
BGA 176 ball package
BGA 176 datasheet
BGA176
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BGA-176P-M02
Abstract: 176-PIN BGA 176 ball package datasheet BGA 176 ball package 176pin
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC BGA-176P-M02 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plastic mold BGA-176P-M02 176-pin plastic FBGA (BGA-176P-M02) 12.00±0.10(.472±.004)SQ
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BGA-176P-M02
176-pin
BGA-176P-M02)
B176002S-1C-1
BGA-176P-M02
BGA 176 ball package datasheet
BGA 176 ball package
176pin
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BGA 256 PACKAGE power dissipation
Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced
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00-mm
27-mm
XC9500
BGA 256 PACKAGE power dissipation
BGA 64 PACKAGE thermal resistance
xilinx CS144 thermal resistance
FG676
BG560
BGA and CSP
BGA-1156
fine BGA thermal profile
cte table flip chip substrate
BG432
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bga 1296
Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
Text: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E
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XC2V1000
XC2V1500
XC2V2000
XC2V3000
XC2V4000
XC2V6000
XC2V8000
XC2V250
XC2V500
XCV100E
bga 1296
XC2V80
LVDSEXT25
BLVDS-25
LVDSEXT-25
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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fcBGA PACKAGE thermal resistance
Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America
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nec 44 pin LQFP
Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
nec 44 pin LQFP
BGA and QFP Package
256-pin BGA drawing
14 pin ic
28-pin QFP
nec 44-pin qfp
44-Pin QFN
65A1
nec 44-pin LQFP
ic packages
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35 x 35 PBGA, 580 100 balls
Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,
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1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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Unit2607
REJ01K0003-0300
1000-pin bga 0,8 mm
HQFP1414-64
HLQFP 176 Package
BGA and QFP Package mounting
HLQFP1414-100
MO-235 FOOTPRINT
QFN 64 8x8 footprint
footprint WSON
LFPAK footprint Renesas
"General Catalog"
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BGA-56 DATASHEET
Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3
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CCGA
Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:
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SF-BGA176A-B-11
Abstract: BGA176
Text: D Package Code: BGA176A C 21.59mm [0.850"] See BGA pattern code to the right for actual pattern layout Y 15.24mm [0.600"] X Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1
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BGA176A
18X13
SF-BGA176A-B-11
BGA176
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BGA 328
Abstract: No abstract text available
Text: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,
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44-Lead
48-Lead
80-Lead
BGA 328
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CE51484
Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.
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CG/CE46
CG/CE51
S-19176
ASIC-TB-20033-9/95
CE51484
micron 100 ball BGA
BGA256
BGA 256 PACKAGE power dissipation
CG51114
BGA352
BGA576
CE51364
CG51284
BGA-576
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f6 diode
Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Text: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27
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X288R-50A-1
S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
f6 diode
P352
transistor 6c
transistor h9
BGA 176 ball package
256-pin BGA
BGA 176 ball package datasheet
bga 208 PACKAGE
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Untitled
Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals
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CAT16-PREVIEW06
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frg 200
Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals
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crystal 447
Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals
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12x12 bga thermal resistance
Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE
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SZZA005
thoseI1450
12x12 bga thermal resistance
SZZA005
micro pitch BGA
A113
TMS320VC549
TMS320VC549GGU
BGA Ball Crack
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im4a3-64
Abstract: lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea
Text: Lattice Socket Adapter Listing Rev 4.30 Socket Adapters are the interface between programming hardware such as the Lattice Model 300 desktop programmer , and Lattice programmable devices. This document shows which Lattice Socket Adapters support which Lattice programmable products. Lattice Socket Adapters are
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28-pin
im4a3-64
lattice im4a3
im4a3
im4a3-128
im4a3-192
lfe3-35ea
IM4A3-256
iM4A3-384
LFXP2-8E
lfe3-70ea
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BGA reflow guide
Abstract: No abstract text available
Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket FRG, 1.27mm pitch Guide Box and Base Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch)
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BGA reflow guide
Abstract: C17200
Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket FRG, 1.27mm pitch Guide Box and Base Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch)
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BGA and QFP Package mounting
Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,
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diagrams hitachi ecu
Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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D-85622
REJ01K0003-0200Z
diagrams hitachi ecu
SMD Transistor
exposed QFP 128
784-pin
HQFP1414-64
QFN Thermal Resistance vs. Mounting Pad Area
LFPAK footprint Renesas
LFPAK footprint
QFP PACKAGE thermal resistance
"General Catalog"
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