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    BGA 15X15 Search Results

    BGA 15X15 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    BGA 15X15 Price and Stock

    Fischer Elektronik GmbH & Co KG ICK BGA 15 X 15 X 14

    Heatsink: extruded; grilled; black; L: 15mm; W: 15mm; H: 14mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 15 X 15 X 14 354 1
    • 1 $3.28
    • 10 $3.04
    • 100 $2.69
    • 1000 $2.59
    • 10000 $2.59
    		Buy Now

    Fischer Elektronik GmbH & Co KG ICK BGA 15 X 15 X 6

    Heatsink: extruded; black; L: 15mm; W: 15mm; H: 6mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 15 X 15 X 6 1
    • 1 $3.13
    • 10 $3.13
    • 100 $2.49
    • 1000 $2.17
    • 10000 $2.17
    		Get Quote

    Fischer Elektronik GmbH & Co KG ICK BGA 15 X 15 X 10

    Heatsink: extruded; black; L: 15mm; W: 15mm; H: 10mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 15 X 15 X 10 1
    • 1 $3.15
    • 10 $2.86
    • 100 $2.21
    • 1000 $2.21
    • 10000 $2.21
    		Get Quote

    BGA 15X15 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 15X15 PDF

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1 PDF

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 PDF

    60068-2-14Na

    Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
    Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.


    Original     		E174442. 16x16 19x19 20x20 60068-2-14Na 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance PDF

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    CMBA023737

    Abstract: MBH37 MBH37.5002 37.5x37.5
    Text: MBH3750021 Series = CMBA023737 MBH37.50021= 1373263 Model : CMBA023737 Series For 37.5x37.5 Chip set BGA Heat Sink Specification CMBA023737 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		MBH3750021 CMBA023737 MBH37 CMBA023737 UL94-V0) 15x15 MBH37.5002 37.5x37.5 PDF

    19X19

    Abstract: CMBA021919 Malico BGA 15X15 RCA 014
    Text: CMBA021919Series=MBH19002 Series MBH19002-H12 MBH19002-H25 = 1373254 = 1373255 Model : CMBA021919 Series For 19x19 Chip set BGA Heat Sink CMBA021919 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 19x19mm Height : 12,15,18,21,23,28,33 mm


    Original     		CMBA021919Series MBH19002 MBH19002-H12 MBH19002-H25 CMBA021919 19x19 19x19mm UL94-V0) 15x15 Malico BGA 15X15 RCA 014 PDF

    CMBA023333

    Abstract: 33X33 Al6063
    Text: MBH33002 Series=CMBA023333 Series MBH33002 = 1373260 Model : CMBA023333 Series For 33x33 Chip set BGA Heat Sink CMBA023333 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 33x33mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		MBH33002 CMBA023333 MBH33002 33x33 33x33mm UL94-V0) 15x15 Al6063 PDF

    CMBA024242

    Abstract: No abstract text available
    Text: MBH425002 Series=CMBA024242 Series MBH425002-H12 MBH425002-H25 = 1373265 = 1373266 Model : CMBA024242 Series For 42.5x42.5 Chip set BGA Heat Sink Specification CMBA024242 Series 1.Material : Al 6063 2.Dimension : Foot print : 42.5x42.5mm Height :12,15,18,21,23,28,33 mm


    Original     		MBH425002 CMBA024242 MBH425002-H12 MBH425002-H25 UL94-V0) 15x15 PDF

    CU1100

    Abstract: BGA 15X15 CMBA054949 T725
    Text: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :


    Original     		CMBA054949 CMBA054949 CU1100 UL94-V0) 15x15 CU1100 BGA 15X15 T725 PDF

    g10 fr4 7mm

    Abstract: SG-BGA-7039 micron 100 ball BGA
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. 525mm 725mm 025mm SG-BGA-7039 125mm. g10 fr4 7mm micron 100 ball BGA PDF

    SG-BGA-7099

    Abstract: BGA 15X15
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		SG-BGA-7099 725mm 025mm BGA 15X15 PDF

    CMBA022727

    Abstract: MBH27002 27X27MM
    Text: MBH27002 Series=CMBA022727 MBH27002-H12 MBH27002-H25 = 1373256 = 1373257 Model : CMBA022727 Series For 27x27 Chip set BGA Heat Sink CMBA022727 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 27x27mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		MBH27002 CMBA022727 MBH27002-H12 MBH27002-H25 CMBA022727 27x27 27x27mm UL94-V0) 15x15 27X27MM PDF

    BGA 15X15

    Abstract: CMBA024949 T725
    Text: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :


    Original     		CMBA024949 CMBA024949 UL94-V0) 15x15 BGA 15X15 T725 PDF

    MBH29002

    Abstract: MBH29002-H12 CMBA022929 29x29mm
    Text: MBH29002 Series=CMBA022929 MBH29002-H12 MBH29002-H25 = 1373258 = 1373259 Model : CMBA022929 Series For 29x29 Chip set BGA Heat Sink CMBA022929 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 29x29mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		MBH29002 CMBA022929 MBH29002-H12 MBH29002-H25 CMBA022929 29x29 29x29mm UL94-V0) 15x15 MBH29002-H12 29x29mm PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*


    OCR Scan     		NP276 100MQ 100VDC 100VAC NP276-119 NP276- NP276-1 190BGA^ 27x27 PDF

    SG-BGA-6210

    Abstract: No abstract text available
    Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer


    Original     		225mm 725mm. 525mm 15x15 SG-BGA-6210 PDF

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 PDF

    CMBA023535

    Abstract: BGA 15X15 35x35 bga
    Text: Model : CMBA023535 Series For 35x35 Chip set BGA Heat Sink CMBA023535 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 35x35mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color


    Original     		CMBA023535 35x35 CMBA023535 35x35mm UL94-V0) 15x15 BGA 15X15 35x35 bga PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF