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LeaderTech 51-CBSA-3.75X3.75X0.5 RF SHIELD 3.75" X 3.75" T/H
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DigiKey	51-CBSA-3.75X3.75X0.5	Bulk			20	1 - 10 - 100 $24.36 1000 $24.36 10000 $24.36	Buy Now
LeaderTech 50-CBSA-3.75X3.75X0.5 RF SHIELD 3.75" X 3.75" SMD
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DigiKey	50-CBSA-3.75X3.75X0.5	Bulk			20	1 - 10 - 100 $24.36 1000 $24.36 10000 $24.36	Buy Now
LeaderTech 52-CBSA-3.75X3.75X0.5 RF SHIELD 3.75" X 3.75" T/H
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DigiKey	52-CBSA-3.75X3.75X0.5	Bulk			20	1 - 10 - 100 $24.36 1000 $24.36 10000 $24.36	Buy Now
LeaderTech 53A-CBSA-3.75X3.75X0.5 RF SHIELD 3.75" X 3.75" T/H
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DigiKey	53A-CBSA-3.75X3.75X0.5	Bulk			20	1 - 10 - 100 $24.36 1000 $24.36 10000 $24.36	Buy Now
LeaderTech 54-CBSA-3.75X3.75X0.5 RF SHIELD 3.75" X 3.75" T/H
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DigiKey	54-CBSA-3.75X3.75X0.5	Bulk			20	1 - 10 - 100 $24.36 1000 $24.36 10000 $24.36	Buy Now

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37.5X37.5 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Motorola multimeter Abstract: multimeter probes MPC8260 digital multimeter diagram digital multimeter circuit Text: Application Note AN2271/D Rev. 0, 3/2002 MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the MPC8260 is a 480 ball, 37.5x37.5mm TBGA (tape ball grid array) that provides excellent	Original	AN2271/D MPC8260 Motorola multimeter multimeter probes digital multimeter diagram digital multimeter circuit	PDF
CU1100 Abstract: BGA 15X15 CMBA054949 T725 Text: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :	Original	CMBA054949 CMBA054949 CU1100 UL94-V0) 15x15 CU1100 BGA 15X15 T725	PDF
PRBG0784DA-A Abstract: No abstract text available Text: JEITA Package Code P-HBGA784-37.5x37.5-1.27 RENESAS Code PRBG0784DA-A Previous Code 784F7D D MASS[Typ.] 13.0g A A ZD A1 b S AB e Reference Symbol C 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 y S Index mark ZE AH AG AF AE AD	Original	P-HBGA784-37 PRBG0784DA-A 784F7D PRBG0784DA-A	PDF
PRBG0564DA-A Abstract: No abstract text available Text: JEITA Package Code P-BGA564-37.5x37.5-1.27 RENESAS Code PRBG0564DA-A D MASS[Typ.] 6.2g A A D1 ZD A1 b S AB e y S Index mark S ZE AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 564F7X-B Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28	Original	P-BGA564-37 PRBG0564DA-A 564F7X-B PRBG0564DA-A	PDF
CMBA023737 Abstract: MBH37 MBH37.5002 37.5x37.5 Text: MBH3750021 Series = CMBA023737 MBH37.50021= 1373263 Model : CMBA023737 Series For 37.5x37.5 Chip set BGA Heat Sink Specification CMBA023737 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm	Original	MBH3750021 CMBA023737 MBH37 CMBA023737 UL94-V0) 15x15 MBH37.5002 37.5x37.5	PDF
BGA 15X15 Abstract: CMBA024949 T725 Text: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :	Original	CMBA024949 CMBA024949 UL94-V0) 15x15 BGA 15X15 T725	PDF
PRBG1296FA-A Abstract: No abstract text available Text: RENESAS Code PRBG1296FA-A Previous Code 1296F7K D 1 b ZD A1 S AB AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C y S 3 Index mark e e 3C B A E1 E A D1 MASS[Typ.] 13.0g S ZE JEITA Package Code P-HBGA1296-37.5x37.5-1.00	Original	PRBG1296FA-A 1296F7K P-HBGA1296-37 PRBG1296FA-A	PDF
FP4451 Abstract: Theta JB hysol adhesive JC15-1 698-100AB DCDA37480-M014-001 G38-87 R1004 304-TBGA Aavid Thermalloy cold plate Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 7/10/1998 Revised 7/31/98 Package: 480 37.5x37.5 mm TBGA 29 x 29 Array Case: 1152-01 Frame: ASAT Drawing Nbr. E04480002-0-50 DCDA37480-M014-001	Original	E04480002-0-50 DCDA37480-M014-001) R1004 FP4451 G38-87 21426-ICB 35x35 FP4451 Theta JB hysol adhesive JC15-1 698-100AB DCDA37480-M014-001 R1004 304-TBGA Aavid Thermalloy cold plate	PDF
PRBG1296FB-A Abstract: No abstract text available Text: JEITA Package Code P-HBGA1296-37.5x37.5-1.00 RENESAS Code PRBG1296FB-A Previous Code 1296F7M D Under development 1 A A ZD b A1 e S AB AT AP AM AK AH AF AD AB Y V T P M K H F D B ZE AR AN AL AJ AG AE AC AA W U R N L J G E C A E1 E e 3C D1 B MASS[Typ.] 16.0g	Original	P-HBGA1296-37 PRBG1296FB-A 1296F7M PRBG1296FB-A	PDF
Untitled Abstract: No abstract text available Text: Version 1.6 2007 Features PEX 8548 General Features o 48-lane PCI Express switch - Integrated SerDes o Up to nine configurable ports x1, x2, x4, x8, x16 o 27mmx27mm, 686-ball PBGA package o 37.5mm x 37.5mm, 736-ball PBGA package o Typical Power: 4.9 Watts	Original	48-lane, PEX8548-SIL-PB-P1-1	PDF
broadcom BCM 4360 Abstract: broadcom BCM 4331 bcm 4330 programming Guide MPC8360ERM broadcom BCM 4335 BCM 4331 Broadcom BCM 4341 BCM 4334 lcd ibm pinout bcm 4339 Text: MPC8360E PowerQUICC II Pro Integrated Communications Processor Family Reference Manual MPC8360ERM Rev. 2 05/2007 How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370	Original	MPC8360E MPC8360ERM CH370 IEEE1588 MPC8358E broadcom BCM 4360 broadcom BCM 4331 bcm 4330 programming Guide broadcom BCM 4335 BCM 4331 Broadcom BCM 4341 BCM 4334 lcd ibm pinout bcm 4339	PDF
digital multimeter diagram Abstract: Motorola multimeter 2625 application note of digital multimeter multimeter probes MPC8260 digital multimeter circuit Text: Freescale Semiconductor, Inc. Application Note AN2271/D Rev. 0, 3/2002 Freescale Semiconductor, Inc. MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the	Original	AN2271/D MPC8260 digital multimeter diagram Motorola multimeter 2625 application note of digital multimeter multimeter probes digital multimeter circuit	PDF
motorola mc 1563 Abstract: MBX860 MPC8270ZUUPE MPC8270CZUQLD bsdl of 8270 MPC8270ZQ PBGA 256 reflow profile MPC823 user manual SBC8260 MPC8270CZQMIBA Text: Freescale Semiconductor, Inc. Technical Data MPC8280EC Rev. 1.0, 2/2004 Freescale Semiconductor, Inc. MPC8280 PowerQUICC II Family Hardware Specifications This document contains detailed information about power considerations, DC/AC electrical characteristics, and AC timing specifications for .13µm HiP7 members of the	Original	MPC8280EC MPC8280 MPC8280, MPC8275, MPC8270 MPC8280' MPC9850 MPC9850 MPC9855 MPC9855 motorola mc 1563 MBX860 MPC8270ZUUPE MPC8270CZUQLD bsdl of 8270 MPC8270ZQ PBGA 256 reflow profile MPC823 user manual SBC8260 MPC8270CZQMIBA	PDF
htc hd2 schematic Abstract: max1987 rG82855GM FW82801DBM RG82855 asus crb input voltage point lcd inverter board schematic TL494 ASUS sir s4 105a *6jk3 Text: 5 4 3 2 1 FILE LIST THERMAL A3/A6 BLOCK DIAGRAM D 05 POWER IMVP4 BANIAS 24.5W FAN 35 03 37 38 39 40 41 42 43 44 45 04 PSB C North Bridge DDR A3N 855GM 266 A3L 852GM 266 CPU Celeron/ Banias/ Dothan(400) Celeron/ Banias/ Dothan(400) Celeron/ Banias/ Dothan(400)	Original	855GM 852GM 855GM/GME 852GM/GMV/GME 855GME 852GME 852GMV ATA100 htc hd2 schematic max1987 rG82855GM FW82801DBM RG82855 asus crb input voltage point lcd inverter board schematic TL494 ASUS sir s4 105a *6jk3	PDF

AR5212 Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516 Text: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)	Original	ISL6225VCC AR5212 ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516	PDF
RG82855GME Abstract: Intel RG82855GME SIO-ITE8705 asus ELECTROLYTIC CAPACITOR 330uF 63V CT 9 ITE8705 78L12 LM358ADR2 tl494 KBC-M38857 Text: 5 4 3 2 1 FILE LIST D 01_BLOCK DIAGRAM CLOCK GEN A6G BLOCK DIAGRAM ICS 950815 POWER IMVP4 Page 23 Page 43,44,45,46,47,48,49,50 CPU THERMAL SENSOR BANIAS 24.5W Page 5 VGA POWER Page 3,4 PSB VRAM *4 Page 15,16 LVDS LCD DDR TERMINATION NORTH BRIDGE Page 17	Original	M11-P 855GME ALC650 R5C593 RTL81ness ohm/0603 ohm/0805 RG82855GME Intel RG82855GME SIO-ITE8705 asus ELECTROLYTIC CAPACITOR 330uF 63V CT 9 ITE8705 78L12 LM358ADR2 tl494 KBC-M38857	PDF
max1987 Abstract: US015 LM393 MDC ICH4 CPAR-A13 LM339 1u235 13LVDS 0603 104P CE34 Text: A B C D E FILE LIST 1 CARMEL LED BOARD THERMAL CLOCK GEN 05 34 BANIAS FAN Block Diagram 32 03 31 POWER IMVP4 04 35 POWER ON/OFF CKTS 41 33 PSB 2 26 13 LVDS LCD MCHM MONTARA -GM RGB 14 IO BOARD CRT 06 3 DC-DC JACK LAN PHY USB PORT MIC OP AC97 08 12 DDR DDR	Original	SI3456DV 2N7002 104P/X7R 100K/? max1987 US015 LM393 MDC ICH4 CPAR-A13 LM339 1u235 13LVDS 0603 104P CE34	PDF
multimeter probes Abstract: MPC8260 digital multimeter diagram digital multimeter circuit AN2271 Text: Freescale Semiconductor Application Note AN2271/D Rev. 0, 3/2002 Freescale Semiconductor, Inc. MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the	Original	AN2271/D MPC8260 multimeter probes digital multimeter diagram digital multimeter circuit AN2271	PDF
SKIIP 33 nec 125 t2 Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302 Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.	Original	734TL UWEB-MODEM-34 HCS412/WM TLV320AIC10IPFB 100MB NEON250 GA-60XM7E BLK32X40 BLK32X42 SKIIP 33 nec 125 t2 skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302	PDF
AC-27621 Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842 Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C	Original	NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842	PDF
socket 1155 Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294 Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:	Original	NP352 10mA/20mV NP352-1600-54-* NP352-160018 45x45 NP352-1849-35 NP352-106426 socket 1155 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294	PDF
BGA676 Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18	Original	BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X	PDF
pcb warpage in ipc standard Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387 Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.	Original		PDF
fcBGA PACKAGE thermal resistance Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5	Original	C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise	PDF

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37.5X37.5 Price and Stock

LeaderTech 51-CBSA-3.75X3.75X0.5

LeaderTech 50-CBSA-3.75X3.75X0.5

LeaderTech 52-CBSA-3.75X3.75X0.5

LeaderTech 53A-CBSA-3.75X3.75X0.5

LeaderTech 54-CBSA-3.75X3.75X0.5

37.5X37.5 Datasheets Context Search

Motorola multimeter

CU1100

PRBG0784DA-A

PRBG0564DA-A

CMBA023737

BGA 15X15

PRBG1296FA-A

FP4451

PRBG1296FB-A

Untitled

broadcom BCM 4360

digital multimeter diagram

motorola mc 1563

htc hd2 schematic

AR5212

RG82855GME

max1987

multimeter probes

SKIIP 33 nec 125 t2

AC-27621

socket 1155

BGA676

pcb warpage in ipc standard

fcBGA PACKAGE thermal resistance