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Laird, A DuPont Business KA150-2AC-33X33 Thermally Conductive Chip Pad; Thickness:0.16Mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300Mm; External Width:300Mm; Product Range:- \|Laird KA150-2AC-33X33
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	KA150-2AC-33X33	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
SMC Corporation of America ARP30K-03-3-X33US TAMPER PROOF PRECISION REGULATOR, ARP SERIES \| SMC Corporation ARP30K-03-3-X33US
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	ARP30K-03-3-X33US	Bulk		5 Weeks	1	1 $84.85 10 $84.85 100 $84.85 1000 $84.85 10000 $84.85	Get Quote
RIVETS C-133X33/64
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bisco Industries	C-133X33/64		1,040			1 - 10 - 100 - 1000 - 10000 -	Buy Now
Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 10 Heatsink: extruded; black; L: 33mm; W: 33mm; H: 10mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICK BGA 33 X 33 X 10		3		1	1 $1.89 10 $1.7 100 $1.31 1000 $1.31 10000 $1.31	Buy Now
Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 6 Heatsink: extruded; black; L: 33mm; W: 33mm; H: 6mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICK BGA 33 X 33 X 6		3		1	1 $1.77 10 $1.6 100 $1.23 1000 $1.23 10000 $1.23	Buy Now

33X33 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
n 332 ab Abstract: PRBG0961FA-A Text: JEITA Package Code P-HBGA961-33x33-1.00 RENESAS Code PRBG0961FA-A Previous Code 961F7K D A ZD A 1 D1 b S AB e A1 e 3C B MASS[Typ.] 7.5g AL AK AJ AH AG AF AE AD AC AB AA Y W U E1 T R P N M L K J H G F E D ZE E V C B A C 3 y S S Index mark 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31	Original	P-HBGA961-33x33-1 PRBG0961FA-A 961F7K n 332 ab PRBG0961FA-A	PDF
CMBA023333 Abstract: 33X33 Al6063 Text: MBH33002 Series=CMBA023333 Series MBH33002 = 1373260 Model : CMBA023333 Series For 33x33 Chip set BGA Heat Sink CMBA023333 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 33x33mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm	Original	MBH33002 CMBA023333 MBH33002 33x33 33x33mm UL94-V0) 15x15 Al6063	PDF
Untitled Abstract: No abstract text available Text: IC149 Series SMT QFP/TQFP - 132 Pins (33x33) 0.635mm pitch Part Number (for IC-use) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):	Original	IC149 33x33) 635mm 100Veff 700Veff IC149	PDF
33X3 Abstract: No abstract text available Text: IC149 Series SMT QFP/TQFP - 132 Pins (33x33) 0.635mm pitch Part Number (for IC-use) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):	Original	IC149 33x33) 635mm 100Veff 700Veff IC149 33X3	PDF
D-32 Abstract: QFP44-P-910-0 vfd tube Text: Dear customers, About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd. The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI Semiconductor Co., Ltd. on October 1, 2008.	Original		PDF
LC4064ZE Abstract: BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork Text: LatticeXP Family Handbook HB1001 Version 03.4, September 2010 LatticeXP Family Handbook Table of Contents September 2010 Section I. LatticeXP Family Data Sheet Introduction Features . 1-1	Original	HB1001 TN1050 TN1049 TN1082 TN1074 LC4064ZE BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork	PDF
PC8640 Abstract: openpic Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)	Original	PC8640 PC8640D Dual-e600 125Gbaud) 64-bit 0948C openpic	PDF
pci slot pinout Abstract: e2v GTX 120 PC8640 Text: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)	Original	PC8640 PC8640D Dual-e600 125Gbaud) 64-bit Chan49 0948E pci slot pinout e2v GTX 120	PDF
led edison rgb datasheet Abstract: EP5W-2S00 EPBW-4S00 RGB LED 20w EPAW-2S00 RGB LED 10w EPBB-4S00 VA02 power LED 5W 10w High Power LED Text: 5~20W Star RGB Star Ultra High Power LED EdiPower Star Approved By Designer Checker Approval Customer Date：2006/9/1 Version：1.0 Device No. : 3-RD-01-H0005 EDISON OPTO CORPORATION 4F, No. 800, Chung-Cheng Rd, Chung-Ho, Taipei 235, Taiwan Tel: 886-2-8227-6996	Original	Date2006/9/1 3-RD-01-H0005 220VAC 12VDC 24VDC led edison rgb datasheet EP5W-2S00 EPBW-4S00 RGB LED 20w EPAW-2S00 RGB LED 10w EPBB-4S00 VA02 power LED 5W 10w High Power LED	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Technical Data Document Number: MPC8568EEC Rev. 1, 10/2010 MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications Due to feature similarities, this document covers both the MPC8568E and MPC8567E features. For simplicity,	Original	MPC8568EEC MPC8568E/MPC8567E MPC8568E MPC8567E MPC8568	PDF
38S02 Abstract: ipad data sheet MSM38S0000 MSM98S MSM98S000 Text: DATA SHEET O K I A S I C P R O D U C T S 0.8µm Mixed 3-V/5-V MSM38S0000 Sea of Gates and MSM98S000 Customer Structured Arrays February 1995 TRADEMARKS AIX, DOS, PC, and Windows are trademarks, and IBM is a registered trademark of IBM Corporation Apollo, Domain, and DomainOS are trademarks of Apollo Computer, a subsidiary of Hewlett-Packard	Original	MSM38S0000 MSM98S000 1-800-OKI-6388 38S02 ipad data sheet MSM98S	PDF
L12xW3 Abstract: 33XXXXXX 28x28 BLO-28X1D0-02 BLO-33D0X1B1-02 L169 28x28mm Text: SINCE 1981 Absolute Maximum Ratings Chip Package Material/ Emitted Color Peak Wave Length p nm GaP/ GaP/ Hi-Eff Green 568 GaAlAs/ DH Red 660 Part No. 28x28mm Multi- BLO-28X1D0-02 Color Lens Appearance Pd If Vr (nm) (mw) (mA) Water Clear (V) Electro-optical	Original	28x28mm BLO-28X1D0-02 FullBLO-28D0G6B1-01 L12xW3 33XXXXXX 28x28 BLO-28X1D0-02 BLO-33D0X1B1-02 L169 28x28mm	PDF
Untitled Abstract: No abstract text available Text: LatticeECP/EC Family Handbook HB1000 Version 03.7, September 2012 LatticeECP/EC Family Handbook Table of Contents September 2012 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1	Original	HB1000 TN1008 TN1010 TN1018 TN1071 TN1074 TN1078	PDF
APU FCM Abstract: "ESP" RGMII SGMII 8572E Text: Freescale Semiconductor MPC8572EEC Rev. 1, 08/2008 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major functional units within the MPC8572E.	Original	MPC8572EEC MPC8572E APU FCM "ESP" RGMII SGMII 8572E	PDF

RGMII SGMII Abstract: PWB 826 service manual CRC-32 MPC8548 MPC8572E SHA-256 SHA-384 SHA-512 marking code AVN QorIQ dhrystone Text: Freescale Semiconductor Technical Data Document Number: MPC8572EEC Rev. 4, 06/2010 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major	Original	MPC8572EEC MPC8572E MPC8572E. MPC8572E 32-bit MPC8548 32-Kbyte RGMII SGMII PWB 826 service manual CRC-32 SHA-256 SHA-384 SHA-512 marking code AVN QorIQ dhrystone	PDF
Untitled Abstract: No abstract text available Text: BLUE POWER DIE BXCD 33 mil x 33 mil PRODUCT DATA SHEET DS-C17 The Bridgelux family of blue power die enables high performance and cost effective solutions to serve solid state lighting market. This next generation chip technology delivers improved efficiency and performance to enable increased light output for a variety of lighting, signaling	Original	DS-C17 33x33	PDF
LEXAN 121r - 21051 Abstract: lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A Text: 10. Electrical Partlist Option SEC Code Location Name Spec. Unit , PC -,-,0to+95C,560mA,-, HYS64T64020HDL,PC , DT,KR,CP3,IEC320 C5,250/250V,7/3A,BLK,1830mm,-,H05VV-F	Original	BA31-00024A BA39-00474A BA39-00493A S/80GB WLAN-802 L50000 L35mm L228mm LEXAN 121r - 21051 lexan 121r 21051 u574 Dell 90w-AC adapter B568 B552 ffc B591 12505hs14 BA42-00141A BA41-00497A	PDF
diode E1110 Abstract: lN4002 LN4003 ANA 618 20010 TDB 0123 km b3170 E1110 Diode UB8560D MAA723 moc 2030 Text: elektronik-bauelem ente I WT VD AVL 1 /8 7 Bl. 2 E r l ä u t e r u n g e n z u m I n h a l t und zu d e n A n g a b e n d e r B a u e l e m e n t e - V e r g l e i c h s l i s t e D ie B a u e l e m e n t e - V e r g l e i c h s l i s t e e n t h ä l t a l l e in d e r B i l a n z v e r a n t w o r t u n g d e s V E B K o m b i n a t	OCR Scan		PDF
mikroelektronik ddr Abstract: Halbleiterbauelemente DDR VEB mikroelektronik vqb 71 A910D VQB71 "halbleiterwerk frankfurt" diode sy-170 VQB 37 u112d Text: Halbleiter-Bauelemente Semiconductors Die vorliegende Übersicht enthält in gedrängter Form die wichtigsten Grenz- und Kenn daten der in der DDR gefertigten Halbleiterbauelem ente. Dem Anwender soll durch diese Übersicht die Auswahl der jeweils in Frage kommenden	OCR Scan		PDF
Untitled Abstract: No abstract text available Text: O K I Semiconductor MSM38S0000/MSM98S000 0.8\|im Mixed 3-V/5-V Sea of Gates and Customer Structured Arrays DESCRIPTION OKI's 0.8 tm ASIC products, specially designed for mixed 3-V /5-V applications, are now available in both Sea Of Gates (SOG and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S	OCR Scan	MSM38S0000/MSM98S000 MSM38S MSM98S 16-Mbit 38S/98S 44x44 35x35 28x28 33x33 38x38	PDF
"84 pin qfp" Abstract: S002B advantages for ic 7473 Lucent 2623 Text: Data Sheet November 1995 microelectronics group Lucent Technologies Bell Labs Innovations ATT2M01 100VG-AnyLAN Media Access Controller MAC Features and Benefits Description • Supports the proposed IEEE' 802.12 100VGAnyLAN specification (as ot January 1994).	OCR Scan	ATT2M01 100VG-AnyLAN 100VGAnyLAN ATT2X01 ATT2MD01, ATT2MD11, ATT2R01. 0D50D2b DG23112 "84 pin qfp" S002B advantages for ic 7473 Lucent 2623	PDF
TSTI01 Abstract: No abstract text available Text: Data Sheet October 1993 microelectronics group Lucent Technologies Bell Labs Innovations ATT2X01 Twisted-Pair Transceiver Chip Flying Dutchman Features Applications • 100 Mblts/s ■ High-speed local area networks ■ Single +5 V supply ■ The ATT2X01 can be used in all 100Base-VG net	OCR Scan	ATT2X01 44-pin 100Base-VG 0D50D2b DG23112 TSTI01	PDF
ATT2MD12 Abstract: att2x02 Text: Data Sheet August 1996 m ic ro e le c tro n ic s group Lucent Technologies Bell Labs Innovations ATT2X02 100VG-AnyLAN Twisted-Pair Transceiver Chip Features Description and Applications • Supports the IEEE" 802.12 100VG-AnyLAN speci fication. The ATT2X02 is a CMOS Integrated Circuit imple	OCR Scan	ATT2X02 100VG-AnyLAN 10Base-T ATT2MD12 ATT2R02 0D50D2b DG23112	PDF
relay lad1 Abstract: lad1 relay CNT17 OVF20 2451B LA01 sia to sms ATT1S04 LS259 54-057 Text: Data Sheet September 1995 m ic r o e le c t r o n ic s group Lucent Technologies Bell Labs Innovations Features • A highly integrated four-repeater architecture will sim plify the design of a wide range of N-port by M-segment circuit-switched hubs. The ATT1RX04	OCR Scan	ATT1RX04 ATT1RX04 05002b. relay lad1 lad1 relay CNT17 OVF20 2451B LA01 sia to sms ATT1S04 LS259 54-057	PDF

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33X33 Search Results

33X33 Price and Stock

Laird, A DuPont Business KA150-2AC-33X33

SMC Corporation of America ARP30K-03-3-X33US

RIVETS C-133X33/64

Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 10

Fischer Elektronik GmbH & Co KG ICK BGA 33 X 33 X 6

33X33 Datasheets Context Search

n 332 ab

CMBA023333

Untitled

33X3

D-32

LC4064ZE

PC8640

pci slot pinout

led edison rgb datasheet

Untitled

38S02

L12xW3

Untitled

APU FCM

RGMII SGMII

Untitled

LEXAN 121r - 21051

diode E1110

mikroelektronik ddr

Untitled

"84 pin qfp"

TSTI01

ATT2MD12

relay lad1