Contextual Info: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72V261 IDT72V271 In teg ra ted D e v ic e T e c h n o lo g y , l i e . FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family 16,384 x 9-bit storage capacity IDT72V261

Contextual Info: CMOS SUPERSYNC FIFO 8,192 x 18 16,384 x 18 PRELIMINARY IDT72255LA IDT72265LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72255LA 8 ,1 9 2 x 1 8 IDT72265LA 1 6 ,3 8 4 x 1 8 • Pin-compatible with the IDT72275/72285 SuperSync FI FOs

72261LA

Abstract: 72271LA IDT72261LA IDT72271LA 72261LA15
Contextual Info: CMOS SUPERSYNC FIFO 16,384 x 9 32,768 x 9 PRELIMINARY IDT72261LA IDT72271LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72261LA 16,384 x 9 IDT72271LA 32,768 x 9 • Pin-compatible with the IDT72281/72291 SuperSync FIFOs

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices

88-ball

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices

marking code micron label

Contextual Info: 128Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D ADVANCE‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA

MT28C256

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package

q001

Abstract: M29W256GH
Contextual Info: 256Mb: 3V Embedded Parallel NOR Flash Features Parallel NOR Flash Embedded Memory M29W256GH, M29W256GL Features • VPP/WP# pin protection – Protects first or last block regardless of block protection settings • Software protection – Volatile protection

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package

Contextual Info: CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72261 IDT72271 Integrated Device Technology, Inc. DESCRIPTION: FEATURES: • • • • • • • • • • • • • • • • 16,384 x 9-bit storage capacity IDT72261 32,768 x 9-bit storage capacity (IDT72271)

on 4673 equivalent

Abstract: 72V271LA IDT72V261LA IDT72V271LA
Contextual Info: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384 x 9 32,768 x 9 PRELIMINARY IDT72V261LA IDT72V271LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72V261LA 16,384 x 9 IDT72V271LA 32,768 x 9 • Pin-compatible with the IDT72V281/72V291 and

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18S MT28C256564W18S Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices

marking code micron label

Abstract: INTEL flash part MARKING
Contextual Info: PRELIMINARY‡ 128Mb MULTIBANK BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D PREVIEW‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA

IDT72255

Abstract: IDT72265
Contextual Info: CMOS SUPERSYNC FIFO 8,192 x 18, 16,384 x 18 IDT72255 IDT72265 Integrated Device Technology, Inc. FEATURES: • • • • • • • • • • • • • • • • 8,192 x 18-bit storage capacity IDT72255 16,384 x 18-bit storage capacity (IDT72265)

Contextual Info: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9 32,768 x 9 PRELIMINARY IDT72V261 LA IDT72V271 LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72V261 LA 1 6 ,3 8 4 x 9 IDT72V271 LA 3 2 ,7 6 8 x 9 • P in -c o m p a tib le w ith the ID T 7 2 V 2 8 1 /7 2 V 2 9 1 and

Contextual Info: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72V261 IDT72V271 Ivtegiated D evice Technology, l i e . FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family 16,384 x 9-bit storage capacity IDT72V261

a5aa

Contextual Info: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family IDT72V261 IDT72V271 for exceptionally low power consumption. These FIFOs are

Contextual Info: 256Mb: 3V Embedded Parallel NOR Flash Features Parallel NOR Flash Embedded Memory M29W256GH, M29W256GL Features • VPP/WP# pin protection – Protects first or last block regardless of block -protection settings • Software protection – Volatile protection

Contextual Info: CMOS SUPERSYNC FIFO 8 ,1 9 2 x 1 8 ,1 6 ,3 8 4 x 1 8 FEATURES: • • • • • • • • • • • • • • • • 8,192 x 18-bit storage capacity IDT72255 16,384 x 18-bit storage capacity (IDT72265) 10ns read/write cycle time (8ns access time)

Contextual Info: CMOS SUPERSYNC FIFO 16,384x9 32,768 x 9 PRELIMINARY IDT72261 LA IDT72271 LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72261 LA 1 6 ,3 8 4 x 9 IDT72271 LA 3 2 ,7 6 8 x 9 • Pin-compatible with the IDT72281/72291 SuperSync FIFOs

marking code micron label

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18S MT28C256564W18S Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package

W18 SMD MARKING CODE

Abstract: w18 SMD INFINEON PART MARKING W18 64 smd marking code micron label 60ns2
Contextual Info: PRELIMINARY‡ 128Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D PREVIEW‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA

Contextual Info: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices