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    300b tube

    Abstract: 90-FBGA-11 165-FBGA-1517 48-TSOP1-1220F 44-TSOP2-400BF-Lead-Free SAMSUNG MCP dram 0X13 SAMSUNG MCP 153 tray bga 64
    Text: Samsung Proprietary [ Shipping Quantity Information ] As of 2004-03-02 Divide DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM


    Original     		PDF FBGA-11 24-SOJ-300 -SOJ-300 -TSOP2-300AF -SOJ-300B 28-SOJ-300 28-SOJ-300A 28-SOJ-400 300b tube 90-FBGA-11 165-FBGA-1517 48-TSOP1-1220F 44-TSOP2-400BF-Lead-Free SAMSUNG MCP dram 0X13 SAMSUNG MCP 153 tray bga 64

    BGA OUTLINE DRAWING

    Abstract: mr4a16bmys351
    Text: MR4A16B FEATURES 1M x 16 MRAM • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP package


    Original     		PDF MR4A16B 20-years AEC-Q100 MR4A16B 216-bit MR4A16B, EST352 BGA OUTLINE DRAWING mr4a16bmys351

    Untitled

    Abstract: No abstract text available
    Text: MR4A16B 1M x 16 MRAM FEATURES • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20 years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352

    csp defects

    Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
    Text: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented


    Original     		PDF 150um) 20mils x20mil csp defects handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    aec-q100 package

    Abstract: MR4A16BCYS35R
    Text: MR4A16B 1M x 16 MRAM FEATURES • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20 years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B AEC-Q100 MR4A16B 216-bit 1-877-347-MRAM EST00352 aec-q100 package MR4A16BCYS35R

    K4S641632C

    Abstract: 54TSOP2 54-TSOP2-400AF
    Text: K4S641632C CMOS SDRAM 1M x 16Bit x 4 Banks Synchronous DRAM FEATURES GENERAL DESCRIPTION • • • • The K4S641632C is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS


    Original     		PDF K4S641632C 16Bit K4S641632C 54-TSOP2-400AF 54TSOP2 54-TSOP2-400AF

    Untitled

    Abstract: No abstract text available
    Text: MR4A16B 1M x 16 MRAM FEATURES • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20 years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352

    MR4A16B

    Abstract: MR4A16BCMA35 MR4A16BCYS35 54TSOP2 MR4A16BCYS35R 54-TSOP2 MR4A16BMA35R MR4A16BC aecq100
    Text: MR4A16B FEATURES 1M x 16 MRAM • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B 20-years AEC-Q100 MR4A16B 216-bit MR4A16B, EST352 MR4A16BCMA35 MR4A16BCYS35 54TSOP2 MR4A16BCYS35R 54-TSOP2 MR4A16BMA35R MR4A16BC aecq100

    speed control of dc motor using scr mini project

    Abstract: AUTOMATIC ROOM LIGHT CONTROLLER using ldr LED TV Screen working Theory AUTOMATIC ROOM LIGHT generator using ldr LZ9GG31 mother board lcd tv block diagram automatic WATER LEVEL pump CONTROL using ldr SA1111DEVMOD SA-1110 fpga based fire alarm system block diagram
    Text: Intel StrongARM* SA-1110 Microprocessor Development Board User’s Guide June 2000 Hardware Build Phase 5 Order Number: 278278-006 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF SA-1110 SA-1110 speed control of dc motor using scr mini project AUTOMATIC ROOM LIGHT CONTROLLER using ldr LED TV Screen working Theory AUTOMATIC ROOM LIGHT generator using ldr LZ9GG31 mother board lcd tv block diagram automatic WATER LEVEL pump CONTROL using ldr SA1111DEVMOD fpga based fire alarm system block diagram

    BGA Package 0.35mm pitch

    Abstract: 48BGA MR4A16B
    Text: MR4A16B 1M x 16 MRAM FEATURES • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20 years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352 BGA Package 0.35mm pitch 48BGA

    Untitled

    Abstract: No abstract text available
    Text: EV4A16B 1M x 16-bit 3.3V Asynchronous Magnetoresistive RAM Datasheet - Preliminary Specification Features • Single 3.3V Power Supply • Industrial Temperature Range –40°C to 110°C and • • • • • • Military Temperature Range (–55°C to 125°C)


    Original     		PDF EV4A16B 16-bit EV4A16B 216-bit wor08 1038Câ

    MR4A16BCYS35

    Abstract: No abstract text available
    Text: MR4A16B 1M x 16 MRAM FEATURES • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20 years at temperature • RoHS-compliant small footprint BGA and TSOP2 package


    Original     		PDF MR4A16B MR4A16B 216-bit MR4A16BCYS35

    SMC91C96

    Abstract: microcontroller interface with gsm module TR28023 LCX16244 keypad 4x4 assembly code 4x4 matrix keypad using ARM SMC C92 scan code keyboard 5x4 schematic GSM Modem USB UDA1341TS
    Text: Intel StrongARM* SA-1111 Microprocessor Development Module User’s Guide July 2000 Phase 5 Order No: 278281-004 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF SA-1111 SA-1111 SMC91C96 microcontroller interface with gsm module TR28023 LCX16244 keypad 4x4 assembly code 4x4 matrix keypad using ARM SMC C92 scan code keyboard 5x4 schematic GSM Modem USB UDA1341TS

    54TSOP2

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS CMOS DRAM PLASTIC THIN S M A LL OUT-LINE P A C K A G E TYPE II 44TSOP2-400F Unit : Millimeters #44 fl RFi fl ñR T lf HöHHb #1 0.005'to.oai & -M A X 1.20 18.41«o.io 0.725 «00S4 .y 0.047 1.00»o.io 0.039* 0 .00« TTnOTTOTPTÜTOOTÜ ,0 .605'


    OCR Scan     		PDF 44TSOP2-400F 50-TSOP2-400F 54-TSOP2-400F 86-TSOP2-400F 54TSOP2