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    500 MOLD COMPOUND Search Results

    500 MOLD COMPOUND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    500 MOLD COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Amplifier SOT-89 c4

    Abstract: M513 MAAM-000071-001SMB MAAMSS0071 MAAMSS0071TR-3000
    Text: RoHS Compliant RF Driver Amplifier 500 - 2500 MHz MAAMSS0071 V1 Features Functional Schematic • Output Intercept Point of +37 dBm over a 20 dB Input Power Range • Broadband Operation • Lead-Free SOT-89 Package • 100% Matte Tin Plating over Copper • Halogen-Free “Green” Mold Compound


    Original     		PDF MAAMSS0071 OT-89 MAAMSS0071 Amplifier SOT-89 c4 M513 MAAM-000071-001SMB MAAMSS0071TR-3000

    P7060

    Abstract: KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750
    Text: TEXAS INSTRUMENTS Final Notification for PDIP/PLCC Package Mold Compound Change to Sumitomo EME6300HS September 20, 1996 Abstract Texas Instruments is making its final announcement of its implementation of the new mold compound material SUMITOMO EME6300HS in its manufacturing facility in TI Philippines, Inc.


    Original     		PDF EME6300HS EME6300HS) P7060 KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750

    EME 7320

    Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
    Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF 160-lead CY7C375I-AC EME 7320 Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress

    M24C16K

    Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
    Text: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This


    Original     		PDF QREE0016 MP8000 R99008) M24C16K M24C08L M24256N M24C16K Nitto MP8000 QREE0016 Nitto 601 so8

    shinetsu

    Abstract: TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material KMC288 KMC166 SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold
    Text: TEXAS INSTRUMENTS Initial Notification for the qualification of Shinetsu-KMC288 Mold Compound at the Malaysia and Mexico Assembly/Test Facilities December 11, 1997 Abstract Texas Instruments, Standard Linear and Logic group, is qualifying Shinetsu KMC288 mold


    Original     		PDF Shinetsu-KMC288 KMC288 KMC166 shinetsu TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold

    MP8000

    Abstract: MP-8000 Nitto MP8000 QREE0023 mold compound
    Text: QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO14 package Small Outline Package in Muar plan. This material


    Original     		PDF QREE0023 MP8000 R99008) M93CS66F M93CS66F MP-8000 Nitto MP8000 QREE0023 mold compound

    hitachi mold cel

    Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
    Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound


    Original     		PDF CEL9200 CEL9200 8361H CY7C109-VC 85C/85 CY7C107-VC hitachi mold cel 9200 hitachi cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H

    QMI 509 epoxy

    Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
    Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer


    Original     		PDF 32-lead 6600HR 28-44lead 635mils 01BLL-SI 610221877M CY62128BLL-SI QMI 509 epoxy SUMITOMO eme-6600hr SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR

    Hysol

    Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
    Text: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding


    Original     		PDF MG52F MG52F this116/0 Hysol MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL SN74ACT16543

    SMD M05 sot23

    Abstract: NE5531 nE352 A3 smd sot-343 transistor smd m05 SMD transistor M05 transistor smd code 404
    Text: 2013-2014 RF & Wireless Semiconductors P R O D U C T S b y A P P L I C AT I O N California Eastern Laboratories CEL is the exclusive sales and marketing partner in the Americas for products made by the Compound Semiconductor Devices Business Division (CSDBD) of Renesas Electronics Corporation, formerly


    Original     		PDF 2013/4M SMD M05 sot23 NE5531 nE352 A3 smd sot-343 transistor smd m05 SMD transistor M05 transistor smd code 404

    UA7808C

    Abstract: kc 5323
    Text: TEXAS INSTRUMENTS Initial Notification of New Mold Compound for TO-220 Packages; New Source for Leadframes and Au Wire February 4, 1998 Abstract Texas Instruments is qualifying a new mold compound for the TO-220 packages. This new compound will be used in addition to the previously qualified compounds, and add flexibility to our


    Original     		PDF O-220 UA7808C kc 5323

    Nitto

    Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 MP-8000 JEDEC22 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22
    Text: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack PQFP (CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF MP-8000 CY7C611) MP-8000 CY7C611A-NC JEDEC22 30C/60 Nitto MOLDING MATERIAL MP8000 Nitto MP 8000 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22

    NEC B1099

    Abstract: NEC b1098 str 6307 B1284 B1273 B1329 nec b1669 B1134 b1686 STR S 6307
    Text: BURNDY PRODUCTS BURNDYWeld BW-06 B BURNDYWeld™ Customer Service Open 8:00 am to 8:00 pm E.S.T. Monday — Friday Call Us At: 1-800-346-4175 FAX 1-800-346-9826 www.fciconnect.com 2 Customer Service: 1-800-346-4175 www.fciconnect.com BURNDYWeld™ TABLE OF CONTENTS


    Original     		PDF BW-06 YWeldTMWireMesh79 PATCUT129ACSR-18V NEC B1099 NEC b1098 str 6307 B1284 B1273 B1329 nec b1669 B1134 b1686 STR S 6307

    burndy Y750

    Abstract: burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20
    Text: BURNDY Grounding TABLE OF CONTENTS HYGROUND® IRREVERSIBLE COMPRESSION GROUNDING AND INSTALLATION TOOLING ® HYGROUND Features Type YGIB . . . . . . . . . . E-20 - E-21 and Benefits . . . . . . . . . E-5 - E-6 E-1 Type YGL-C . . . . . . . . . . . . . . . . E-7


    Original     		PDF KC22J12T13, EQC632C, B38-0330-00 burndy Y750 burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20

    sumitomo epoxy

    Abstract: 7C109A CY7C109 EME TI
    Text: Qualification Report January 1997 QTP# 95483, Version 1.0 SUMITOMO EME-9300 Low Alpha Molding Compound PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


    Original     		PDF EME-9300 CY7C109 32-pin, 400-mil CY7C109) 7C109A PassivaY7C109-VC CY7C109-VC sumitomo epoxy 7C109A CY7C109 EME TI

    Nitto

    Abstract: CY7C199 JESD22
    Text: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		PDF CY7C199 28-pin, 300-mil 7C199C 0075V) CY7C199-VC 85C/85 Nitto CY7C199 JESD22

    burndy Y35 Hypress owner manual

    Abstract: burndy Y39 Hypress owner manual Burndy Y35 hypress burndy Y35 burndy Y750 UL-467 Penetrox A Electric Joint Compound Y750 REVOLVER HYPRESS GBM STEP MOTOR burndy Y750HS user manual
    Text: GC-08 www.burndy.com CALL 1-800-346-4175 FOR YOUR LOCAL SALES REPRESENTATIVE BURNDY PRODUCTS BURNDY PRODUCTS Grounding Catalog Experience. Technology. Answers. Customer Service Dept. 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 Canada 1-800-361-6975 Quebec


    Original     		PDF GC-08 YGIBW28-613-2N YGIBW28-675-2N YGIBW34-338-2N YGIBW34-400-2N YGIBW34-462-2N YGIBW34-550-2N YGIBW34-613-2N YGIBW34-675-2N YGL29C2 burndy Y35 Hypress owner manual burndy Y39 Hypress owner manual Burndy Y35 hypress burndy Y35 burndy Y750 UL-467 Penetrox A Electric Joint Compound Y750 REVOLVER HYPRESS GBM STEP MOTOR burndy Y750HS user manual

    JEDEC JESD22-B116

    Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: G-0110-06 Product Affected: Date Effective: DATE: 12/14/2001 Package Family TSSOP, TQFP, TSOP March 15, 2002 Contact: Geoffrey Cortes Manager, Corporate Quality & Reliability


    Original     		PDF G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184

    009116

    Abstract: M513
    Text: MAAM-009116 High Dynamic Range IF Amplifier 50 - 1000 MHz Functional Block Diagram Features • • • • • • • • Rev. V2 Single +5 V Supply Voltage 18 dB Gain +22 dBm P1dB +40 dBm OIP3 2.4 dB Noise Figure Lead-Free SOT-89 Package Halogen-Free “Green” Mold Compound


    Original     		PDF MAAM-009116 OT-89 MAAM-009116 009116 M513

    Sumitomo G700K

    Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL

    ABLEBOND

    Abstract: No abstract text available
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086L, JESD78, ABLEBOND

    G700K

    Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026

    Nitto MP8000

    Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026

    Sumitomo G700K

    Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K