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    Hysol

    Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
    Text: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding


    Original     		PDF MG52F MG52F this116/0 Hysol MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL SN74ACT16543

    EPIC-1ZS

    Abstract: sn74cbt3384dw relco a016 CBT16209 CBT16212 SN74CBT16209 SN74CBT16209A SN74CBT16212 SN74CBT16212A
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16209A, Die Revision E and SN74CBT16212A, Die Revision D April 1, 1998 Abstract Texas Instruments has qualified a device revision for the CBT16212A, die revision ‘D’ and the SN74CBT16209A, die revision ‘E’. These devices were redesigned in order to incorporate improved


    Original     		PDF SN74CBT16209A, SN74CBT16212A, CBT16212A, CBT16212, CBT16212 CBT16212A EPIC-1ZS sn74cbt3384dw relco a016 CBT16209 CBT16212 SN74CBT16209 SN74CBT16209A SN74CBT16212 SN74CBT16212A