shinetsu
Abstract: TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material KMC288 KMC166 SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold
Text: TEXAS INSTRUMENTS Initial Notification for the qualification of Shinetsu-KMC288 Mold Compound at the Malaysia and Mexico Assembly/Test Facilities December 11, 1997 Abstract Texas Instruments, Standard Linear and Logic group, is qualifying Shinetsu KMC288 mold
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Shinetsu-KMC288
KMC288
KMC166
shinetsu
TEXAS INSTRUMENTS, Mold Compound
Compound
Texas Instruments packaging material
SN74CBT16211
SN74HCT245
TEXAS INSTRUMENTS, Mold
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shinetsu
Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold
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KMC-288
KMC-288
KMC-166
SN74ACT16241DGG
JESD22
KMC-166
SN74ACT16841DGG
SN74ABT16823DGV
shinetsu
KMC288
SLL-28
EN-4088Z
TEXAS INSTRUMENTS, Mold
EPIC-1S
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QMI505
Abstract: MALAYSIA Texas Instruments, epoxy 5316b QMI-505MT 83D8JNK
Text: TEXAS INSTRUMENTS Informational Notification for the Moisture Sensitivity Level of the 64 Pin TSSOP and 80 Pin TVSOP October 8, 1998 Abstract Texas Instruments Standard Linear and Logic SLL is pleased to announce the qualification of the 64 pin TSSOP and 80 pin TVSOP packages as moisture level 1 for SLL products. The production of
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QMI505MT
QMI505M
5316B
QMI505
MALAYSIA
Texas Instruments, epoxy
5316b
QMI-505MT
83D8JNK
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texas instruments lot trace code
Abstract: EN-4088Z 505MT TEXAS INSTRUMENTS, Mold Compound 5310A
Text: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TSSOP Product August 19, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505MT
EN-4088Z
5310C
texas instruments lot trace code
TEXAS INSTRUMENTS, Mold Compound
5310A
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MALAYSIA
Abstract: No abstract text available
Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of 64 pin TSSOP and 80 pin TVSOP variations to Texas Instruments Malaysia Assembly/Test Facility MLA June 22, 1998 Abstract Texas Instruments Standard Linear and Logic (SLL) is pleased to announce the qualification of
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QMI505MT
QMI505M
MALAYSIA
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F741583
Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001
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EN-4085S2K3
96mils
L3/260C
UL94-V0
TMS471R1F138
85C/85
3/260C
F741583
sp3721d
d741667bpgf
F741583PGF
f721501apgf
tnetv901apag
F711862PGE
F721730EPBK
f721905pag
F731891PDV
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CEL-9240
Abstract: CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P
Text: July 23, 2009 CN-072309 Customer Notification M02067L-09-T Package Change Dear Valued Customer: This notification is for the purpose of informing you of a package change from the 4mm BCC package to the 4mm QFN package. Purpose ASE has informed us that the mold compound used for the non-RoHS BCC packages has been discontinued.
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CN-072309
M02067L-09-T
900ppm,
1500ppm.
CEL-9240
CEL9240HF10
EN4900F
sumitomo crm
en4900
CEL9240HF10AKG
1076DS
ase qfn
EN-4900
KMC288P
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texas instruments lot trace code
Abstract: EN-4088Z TEXAS INSTRUMENTS, Mold Compound 5310A QMI505
Text: TEXAS INSTRUMENTS Errata to the Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TSSOP Product September 3, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505MT
EN-4088Z
5310D
texas instruments lot trace code
TEXAS INSTRUMENTS, Mold Compound
5310A
QMI505
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02
Ext686
MM74HCT00MTCX
MM74HCT05MTC
MM74HCT08MTCX
MM74HCT14MTC
MM74HCT240MTCX
QMI519
KEG3000D
QMI-519
ra3906
GR828FC
Kyocera mold compound
Hitachi Datecode
KE-G300
KE-G3000
Henkel
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