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    30A12 Search Results

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    30A12 Price and Stock

    Conquer Electronics Co Ltd SEH 30A 125V (G)

    SMD FUSE, 30A, 125V, 4012
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SEH 30A 125V (G) Cut Tape 2,464 1
    • 1 $4.52
    • 10 $4.221
    • 100 $2.7132
    • 1000 $2.11025
    • 10000 $2.11025
    		Buy Now

    SL Power Electronics ME30A1203B01

    AC/DC WALL MOUNT ADAPTER 12V 30W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ME30A1203B01 Box 1,313 1
    • 1 $20.64
    • 10 $20.64
    • 100 $20.64
    • 1000 $20.64
    • 10000 $20.64
    		Buy Now
    Master Electronics ME30A1203B01
    • 1 $23.39
    • 10 $20.95
    • 100 $20.23
    • 1000 $19.62
    • 10000 $19.62
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    Sager ME30A1203B01 112 1
    • 1 $21.17
    • 10 $20.51
    • 100 $19.65
    • 1000 $19.65
    • 10000 $19.65
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    Mean Well SKM30A-12

    DC DC CONVERTER 12V 30W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SKM30A-12 Bulk 786 1
    • 1 $36.89
    • 10 $33.902
    • 100 $33.902
    • 1000 $33.902
    • 10000 $33.902
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    TME SKM30A-12 28 1
    • 1 $39.42
    • 10 $29.81
    • 100 $25.92
    • 1000 $25.92
    • 10000 $25.92
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    Mean Well DKA30A-12

    DC DC CONVERTER +/-12V 30W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DKA30A-12 Tube 373 1
    • 1 $27.02
    • 10 $24.838
    • 100 $24.838
    • 1000 $24.838
    • 10000 $24.838
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    TME DKA30A-12 915 1
    • 1 $37.3
    • 10 $28.1
    • 100 $24.5
    • 1000 $24.5
    • 10000 $24.5
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    Neutron USA DKA30A-12 50
    • 1 $59.99
    • 10 $59.99
    • 100 $59.99
    • 1000 $59.99
    • 10000 $59.99
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    SL Power Electronics TE30A1203B01

    AC/DC WALL MOUNT ADAPTER 12V 30W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey TE30A1203B01 Box 272 1
    • 1 $23.67
    • 10 $22.326
    • 100 $21.061
    • 1000 $20.57764
    • 10000 $20.57764
    		Buy Now
    Find more 30A12 price and stock on Findchips.com

    30A12 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Type PDF
    30A12-N15-C UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-N15-E UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-N4-C UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-N4-E UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-P15-C UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-P15-E UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-P30-C UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF
    30A12-P4-E UltraVolt IC CONV DC-DC SNGL OUT STEP UP 12VIN Original PDF

    30A12 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DPS512X8MKN3

    Abstract: No abstract text available
    Text: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 PRELIMINARY DESCRIPTION: The DPS512X8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable


    Original     		PDF 512Kx8, 30A129-11 DPS512X8MKN3 DPS512X8MKN3 600-mil-wide, 32-pin

    Untitled

    Abstract: No abstract text available
    Text: 2Mx16, 20 - 45ns, STACK 30A129-08 A 32 Megabit High Speed CMOS SRAM DPS2MX16MKn3 DESCRIPTION: The DPS2MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		PDF 2Mx16, 30A129-08 DPS2MX16MKn3 DPS2MX16MKn3 32-Megabits 500mV

    DPS2MK32MKV3

    Abstract: No abstract text available
    Text: 8Mx8/4Mx16/2Mx32, 20 - 45ns, PGA 30A128-18 A 64 Megabit High Speed CMOS SRAM DPS2MK32MKV3 PRELIMINARY DESCRIPTION: The DPS2MK32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip


    Original     		PDF 8Mx8/4Mx16/2Mx32, 30A128-18 DPS2MK32MKV3 DPS2MK32MKV3 500mV

    soj 36

    Abstract: DPS512M8MKJ DPS512M8KH
    Text: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512M8MKH/DPS512M8MKJ DESCRIPTION: The DPS512M8MKH/DPS512M8MKJ are 4,194,304 bit High Speed Satic Random Access Memory monolithics organised as 524,288 words by 8 bits. The DPS512M8MKH/DPS512M8MKJ uses 8 common


    Original     		PDF 512Kx8, 30A129-11 DPS512M8MKH/DPS512M8MKJ DPS512M8MKH/DPS512M8MKJ 36-pin 30A197-00 soj 36 DPS512M8MKJ DPS512M8KH

    DPS1MK32MKV3

    Abstract: No abstract text available
    Text: 4Mx8/2Mx16/1Mx32, 20 - 45ns, PGA 30A128-14 B 32 Megabit High Speed CMOS SRAM DPS1MK32MKV3 DESCRIPTION: The DPS1MK32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip


    Original     		PDF 4Mx8/2Mx16/1Mx32, 30A128-14 DPS1MK32MKV3 DPS1MK32MKV3 500mV

    Untitled

    Abstract: No abstract text available
    Text: 4Mx8/2Mx16/1Mx32, 90 - 120ns, PGA 30A126-22 D 32 Megabit FLASH EEPROM DPZ1MH32NV3 DESCRIPTION: The DPZ1MH32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers


    Original     		PDF 4Mx8/2Mx16/1Mx32, 120ns, 30A126-22 DPZ1MH32NV3 DPZ1MH32NV3

    MID-30A12

    Abstract: No abstract text available
    Text: T-1 PACKAGE PIN PHOTODIODE MID-30A12 Description Package Dimensions The MID-30A12 is a PIN photodiode mou- Unit : mm inches nted in a lensed , special dark plastic package.The lens- 3.00 (.118) ing effect of the package allows an acceptance half view angle of 10° that is measured from the optical axis to the


    Original     		PDF MID-30A12 MID-30A12 40MIN. 00MIN. 940nm)

    DPS512X32MKV3

    Abstract: No abstract text available
    Text: 2Mx8/1Mx16/512Kx32, 20 - 45ns, PGA 30A128-02 C 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 DESCRIPTION: The DPS512X32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip


    Original     		PDF 2Mx8/1Mx16/512Kx32, 30A128-02 DPS512X32MKV3 DPS512X32MKV3 500mV

    Untitled

    Abstract: No abstract text available
    Text: 4Mx8/2Mx16/1Mx8, 90 - 120ns, PGA 30A126-02 F 32 Megabit FLASH EEPROM DPZ1MX32NV3 DESCRIPTION: The DPZ1MX32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32


    Original     		PDF 4Mx8/2Mx16/1Mx8, 120ns, 30A126-02 DPZ1MX32NV3 DPZ1MX32NV3

    Untitled

    Abstract: No abstract text available
    Text: 4Mx16/2Mx32, 90 - 120ns, PGA 30A126-14 A 64 Megabit FLASH EEPROM DPZ2MW32NV3 DESCRIPTION: The DPZ2MW32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers


    Original     		PDF 4Mx16/2Mx32, 120ns, 30A126-14 DPZ2MW32NV3 DPZ2MW32NV3

    Untitled

    Abstract: No abstract text available
    Text: 1Mx8, 20 - 45ns, STACK/DIP 30A129-12 B 8 Megabit High Speed CMOS SRAM DPS1MX8MKN3 DESCRIPTION: The DPS1MX8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired


    Original     		PDF 30A129-12 600-mil-wide, 32-pin

    30A12

    Abstract: No abstract text available
    Text: 2Mx16, 20 - 45ns, STACK 30A129-28 B 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		PDF 2Mx16, 30A129-28 DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A12

    30A120CT

    Abstract: SBR30A120 SBR30A120CT
    Text: 30A120CT 30A120CTFP 30A SBR Super Barrier Rectifier NEW PRODUCT Features • • • • • • • Mechanical Data • Low Forward Voltage Drop Excellent High Temperature Stability Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability


    Original     		PDF SBR30A120CT SBR30A120CTFP O-220AB, ITO-220AB J-STD-020C MIL-STD-202, SBR30A120 30A120CT SBR30A120CT

    MC68EC030FE40C

    Abstract: MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030
    Text: MOTOROLA Order this document by MC68EC030/D SEMICONDUCTOR TECHNICAL DATA MC68EC030 Technical Summary Second-Generation 32-Bit Enhanced Embedded Controller The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for the requirements of embedded control applications. The MC68EC030 is optimized to maintain


    Original     		PDF MC68EC030/D MC68EC030 32-Bit MC68EC030 MC68030 MC68020, MC68030, MC68040 MC68EC030FE40C MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030

    UA145

    Abstract: No abstract text available
    Text: 8 Megabit High Speed CMOS SRAM DPS1MX8MKN3-A DESCRIPTION: The DPS1MX8MKN3-A High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate having side-brazed


    Original     		PDF 600-mil-wide, 32-pin 30A129-92 UA145

    30A120CT

    Abstract: marking code L2 marking L2 B2 marking code case MARKING A1 diode Marking code A2 marking CODE a2 MARKING CODE H1 MARKING CODE L1 marking H1
    Text: 30A120CT 30A120CTFP 30A SBR SUPER BARRIER RECTIFIER NEW PRODUCT Features • • • • • • Mechanical Data • • Low Forward Voltage Drop Excellent High Temperature Stability Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability


    Original     		PDF SBR30A120CT SBR30A120CTFP O-220AB O-220AB, ITO-220AB J-STD-020D MIL-STD-202, SBR30A120 DS31094 30A120CT marking code L2 marking L2 B2 marking code case MARKING A1 diode Marking code A2 marking CODE a2 MARKING CODE H1 MARKING CODE L1 marking H1

    sfc 2812

    Abstract: M68000 MC68010 MC68020 MC68030 MC68040 MC68EC030 MC88916 mc68ec030rp
    Text: Freescale Semiconductor, Inc. Order this document by MC68EC030/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA MC68EC030 Freescale Semiconductor, Inc. Technical Summary Second-Generation 32-Bit Enhanced Embedded Controller The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for


    Original     		PDF MC68EC030/D MC68EC030 32-Bit MC68EC030 MC68030 MC68020, MC68030, MC68040 sfc 2812 M68000 MC68010 MC68020 MC88916 mc68ec030rp

    AL437

    Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		PDF 8b/10b OIF-SPI4-02 ORSPI4-1FE1036IES ORSPI4-F1156IES ORSPI4-2FE1036CES ORSPI4-1FE1036CES ORSPI4-2F1156CES ORSPI4-1F1156CES AL437 L97c L235C L103T L41C L140C L94C l165c L239C L43C

    3UA12

    Abstract: No abstract text available
    Text: DENSE-PAC 64 Megabit FLASH EEPROM DPZ2MW32NV3 M I C R O S Y S T E M S DESCRIPTION: The D P Z 2 M W 3 2 N V 3 "V E R S A -S T A C K " m o d u le is a re v o lu tio n a ry new m e m ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C h ip Carriers


    OCR Scan     		PDF DPZ2MW32NV3 120ns A126-14 3UA12

    Untitled

    Abstract: No abstract text available
    Text: PA C 8 Megabit High Speed CM OS SRAM M i € R Ù S Y 'S-1 E M S DPS1MX8MKN3 DESCRIPTION: The DPS1.MX8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ mounted on a co-fired


    OCR Scan     		PDF 600-mil-wide, 32-pin

    Untitled

    Abstract: No abstract text available
    Text: 32 Megabit High Speed CMOS SRAM D E N S E -P A C DPS2MX16MKn3 Mí C RO SYSTEMS DESCRIPTION: The DPS2MX16MKn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC .


    OCR Scan     		PDF DPS2MX16MKn3 DPS2MX16MKn3 32-Megabits 500mV 30A129-08

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC M I C R O S Y S T E M 128 Megabit FLASH EEPROM S D P Z 8M X 16N V 3 DESCRIPTION: T h e D P Z 8 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b system u sin g D en se-Pac M ic ro sy ste m s' c e ra m ic S tackab le Le ad le ss C h ip C a rrie rs


    OCR Scan     		PDF 100ns 120ns 150ns 125-C 30A123-06

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF PS512X32M DPS512X32MKV3 surfa85 3QA128-02

    Untitled

    Abstract: No abstract text available
    Text: _ DENSE-PAC ñ n J 1' 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a


    OCR Scan     		PDF DPZ2MX16NV3 30A123-00 120ns