Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM DPZ2MX16NV3 DESCRIPTION: The DPZ2MX16NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ2MX16NV3
DPZ2MX16NV3
30A123-00
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Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM DPZ2MX16Nn3 DESCRIPTION: The DPZ2MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded
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DPZ2MX16Nn3
50-pin
32-Megabits
DPZ2MX16NY3
DPZ2MX16Nn3
30A117-04
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Dense-Pac Microsystems
Abstract: NC-641
Text: DENSE-PAC 32 Megabit FLASH EEPROM MICROSYSTEMS DPZ2MX16NV3 PRELIMINARY DESCRIPTION: The D PZ 2 M X 1 6 N V 3 "V E R S A - S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers
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DPZ2MX16NV3
X16NV3
120ns
Dense-Pac Microsystems
NC-641
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Untitled
Abstract: No abstract text available
Text: _ DENSE-PAC ñ n J 1' 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a
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OCR Scan
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PDF
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DPZ2MX16NV3
30A123-00
120ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O I Y S ï .Ir- y. s DESCRIPTION: The D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K ” m o d u le is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers
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DPZ2MX16NV3
30A123-00
100ns
120ns
150ns
-t-70
-t-125
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Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ2MX16NV3 DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers
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100ns
120ns
150ns
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Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ2MX16Nn3 D ESC RIPTIO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded
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OCR Scan
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PDF
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50-pin
32-Megabits
100ns
120ns
150ns
3QA117-04
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DP5Z
Abstract: No abstract text available
Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS
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128Kx8,
64Kx16,
256Kx8,
384Kx8,
DP5Z
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Untitled
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM D PZ2M X16N n3 M I G R O S Y S T Ji M S DESCRIPTION: The D P Z 2 M X l6 N n 3 "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, " J " leaded or gullwing leaded
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OCR Scan
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PDF
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50-pin
32-Megabits
DPZ2MX16Nn3
120ns
150ns
30A117-04
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