ipc 610D
Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
Text: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related
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AN9047
IPC-SM-7525A,
JESD22-B102D,
FPF1007,
FPF1008,
FPF1009,
FPF2140,
FPF2142,
FPF2143,
FPF2144,
ipc 610D
IPC-SM-7525A
IPC-7525
IPC610D
JSTD001D
Intel reflow soldering profile BGA
IPC-4101B
Lead Free reflow soldering profile BGA
J-STD-001C
IPC-A-610D
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torque of screw for pcb
Abstract: bga socket dowel pin SG-BGA-6074
Text: Top View without heatsink GHz BGA Socket - Direct mount, solderless Bottom View Holes tapped in backing plate for mounting socket base (x4). 63.245mm 1.91mm 63.245mm Side View 1 Side View (exploded) 42.5mm 2mm 7 1 Heat Sink Lid: Anodized 6061 Aluminum. Single piece construction. Bottom of heat sink has
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245mm
525mm
torque of screw for pcb
bga socket
dowel pin
SG-BGA-6074
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16x16 bga
Abstract: 16X16 SF-BGA256G-B-11
Text: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA256G
FR4/G10
16X16
SF-BGA256G-B-11
16x16 bga
16X16
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14X14
Abstract: SF-BGA196D-B-11 pitch 0.4mm BGA
Text: C Package Code: BGA196D D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.50mm [0.531"] 0.50mm [0.020"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"]
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BGA196D
FR4/G10
14X14
SF-BGA196D-B-11
14X14
pitch 0.4mm BGA
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BGA Solder Ball compressive force
Abstract: bga solder ball shear
Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA
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10067807-101LF
10076728-101LF
10067811-101LF
ELXAIRMXBGA0109ELT
BGA Solder Ball compressive force
bga solder ball shear
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SG-BGA-7098
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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525mm
FR4/G10,
475mm.
725mm
025mm
SG-BGA-7098
125mm.
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SG-BGA-7097
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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525mm
FR4/G10,
475mm.
725mm
025mm
SG-BGA-7097
125mm.
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pinball
Abstract: No abstract text available
Text: Surface Mount Pin-Ball BGA/LGA Sockets for 1.00mm & 1.27mm Pitch Packages FEATURES: • BGA/LGA sockets for 1.00mm & 1.27mm. • Any Footprint / any size. • 63-37 solder balls • Side-by-side stackable • Works with same footprint as existing PC Board
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17grams
pinball
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KSZ8041
Abstract: LM2576 MTBF vcsel spice model MIC4129 mic44r22 ksz8692 MICREL MIC marking DFB laser diode spice model KSZ9021RLI KSZ8041TLI
Text: Military Catalog May 2009 Dear Valued Customer, Micrel is an enduring DSCC certified company that has, for many years, provided Mil-Std-883B products in hermetic ceramic packages. We have also provided products governed by source controlled drawings SCD where baseline control is important. Our in-house, U.S.-based wafer
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Mil-Std-883B
M0014-051409
KSZ8041
LM2576 MTBF
vcsel spice model
MIC4129
mic44r22
ksz8692
MICREL MIC marking
DFB laser diode spice model
KSZ9021RLI
KSZ8041TLI
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LGA socket
Abstract: No abstract text available
Text: Surface Mount BGA and LGA Socket for 1.00mm & 1.27mm Pitch Packages FEATURES: • BGA/LGA sockets for 1.00mm & 1.27mm. • Any Footprint / any size. • 63-37 solder balls • Side-by-side stackable • Works with same footprint as existing PC Board • Reliable Spring Probe Technology
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17grams
LGA socket
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94vo fr4
Abstract: 157 BGA socket adapter bga
Text: ADVANCED Ball Grid Array Socketing System INTERCONNECTIONS ® 5EnergyWay,P . BGAAdapters BGA Ball Grid Array BGA Adapter BGA Adapter Solder
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Box1019
RI02893USATel
Fax401-823-8723
1FGAXXX638X
Type-647
Page155
94vo fr4
157 BGA socket
adapter bga
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IPC-SM-785
Abstract: 84501 GR-1217-CORE 74221 84500 74213 Telcordia 74390 8453 back to board connector
Text: BOARD-TO-BOARD CONNECTORS MEG-ARRAY HIGH SPEED MEZZANINE CONNECTORS FEATURES RoHS Compliant Lead-Free Ball Grid Array (BGA) termination for process friendly attachment .050" x .050" BGA interface pitch optimizes routing and electrical performance Stack Heights available from 4mm to
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GR-1217-CORE
NPS-25298-2
IPC-SM-785
84501
74221
84500
74213
Telcordia
74390
8453
back to board connector
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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eutectic 157
Abstract: advanced 94vo fr4
Text: SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE BGA LGA ADVANCED
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BGA-TECH04
eutectic 157
advanced
94vo fr4
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter
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C36000)
ASTM-B-16
63Sn/37Pb
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SG-BGA-6165
Abstract: AA116
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 12.225mm Ball guide prevents over compression of elastomer
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225mm
725mm.
5M-1994.
SG-BGA-6165
AA116
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pcb warpage in ipc standard
Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1
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AN-1028
AN-1029.
pcb warpage in ipc standard
JEDEC J-STD-033A
J-STD-033A
LGA rework
JSTD033A
reflow profile FOR LGA COMPONENTS
AN1028
8015 j
AN-1028
AN-1029
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SG-BGA-6018
Abstract: PCB Layout
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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225mm
5M-1994.
SG-BGA-6018
PCB Layout
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SG-BGA-7110
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer
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225mm
475mm.
725mm.
Ultem1000)
SG-BGA-7110
725mm
025mm
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idc 20 pin data ribbon connector
Abstract: flat ribbon cable 2mm 14 pin 2x7 Oupiin through-hole idc 14 pin data ribbon connector 14 pin data ribbon connector Centronics 14 pin female connector XCF00S Oupiin spartan 3a JTAG 2mm
Text: ds114.fm Page 1 Wednesday, September 29, 2004 1:46 PM R DS114 v1.5 September 29, 2004 MultiPRO Desktop Tool Advance Product Specification Features In-System Programming/Configuration • • • • • • • • • Supported by iMPACT download software (v5.1i SP3
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ds114
DS114
20-Pin
XCF00S/P"
HW-MP-FS48
HW-MP-VO48
idc 20 pin data ribbon connector
flat ribbon cable 2mm 14 pin 2x7
Oupiin through-hole
idc 14 pin data ribbon connector
14 pin data ribbon connector
Centronics 14 pin female connector
XCF00S
Oupiin
spartan 3a
JTAG 2mm
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x112
Abstract: SG-BGA-7024 x112 st
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer
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225mm
SG-BGA-7024
725mm
025mm
x112
x112 st
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SG-BGA-6100
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6100
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array Socketing System ADVANCED INTERCONNECTIONS 5 Energy Way, P.0. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 •Email advintcorp@aol.com • Internet http://www.advintcorp.com BGA Adapters Features:
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ASTM-B-16
Type-638
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Untitled
Abstract: No abstract text available
Text: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications
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OCR Scan
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CustomC36000)
ASTM-B-16
63Sn/37Pb
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