256-pin BGA
Abstract: 24 pin MATRIX led matrix circuits 256-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)
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BGA-256P-M01
256-pin
BGA-256P-M01)
BGA256002SC-2-1
wi256-pin
256-pin BGA
24 pin MATRIX
led matrix circuits
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led matrix circuits
Abstract: 256-pin Plastic BGA BGA-256P-M02
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)
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BGA-256P-M02
256-pin
BGA-256P-M02)
BGA256004SC-2-1
led matrix circuits
256-pin Plastic BGA
BGA-256P-M02
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256-pin BGA
Abstract: led matrix circuits 256-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)
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BGA-256P-M04
256-pin
BGA-256P-M04)
B256009SC-1-3
256-pin BGA
led matrix circuits
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256-pin Plastic BGA
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ
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BGA-256P-M01
256-pin
BGA-256P-M01)
BGA256002SC-2-1
o256-pin
256-pin Plastic BGA
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BGA-256P-M02
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)
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BGA-256P-M02
256-pin
BGA-256P-M02)
BGA256004SC-2-1
BGA-256P-M02
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c051004
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension. 27.00±0.20(1.063±.008)SQ
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BGA-256P-M04
50mil
256-pin
BGA-256P-M04)
BGA256001SC-1-2
c051004
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Untitled
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.
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BGA-256P-M04
256-pin
BGA-256P-M04)
B256009SC-1-4
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C1995
Abstract: 256-PIN 256-pin Plastic BGA
Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M01 Lead pitch 50mil Pin matirx 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ Note: The actual shape of corners may differ from the dimension.
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BGA-256P-M01
50mil
256-pin
BGA-256P-M01)
BGA256002SC-2-1
C1995
256-pin Plastic BGA
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BGA-256P-M02
Abstract: C1995 256-PIN
Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.
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BGA-256P-M02
50mil
256-pin
BGA-256P-M02)
BGA256004SC-2-1
BGA-256P-M02
C1995
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256-pin Plastic BGA
Abstract: BGA-256P-M21
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21
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BGA-256P-M21
256-pin
BGA-256P-M21)
BGA256021Sc-3-3
256-pin Plastic BGA
BGA-256P-M21
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ep2c20
Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Text: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced
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100-Pin
144-Pin
208-Pin
240-Pin
256-Pin
324-Pin
400-Pin
484-Pin
672-Pin
ep2c20
EPC2
EP1C12
EP2C5
EP2C15A
EP2C35
EP2C50
EPC16
EPCS16
EPCS64
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676 BGA package tray
Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)
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BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
385-pin
400-pin
676 BGA package tray
tray bga
BGA package tray
jedec bga tray
NEC 2415
tray bga 27
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f6 diode
Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Text: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27
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X288R-50A-1
S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
f6 diode
P352
transistor 6c
transistor h9
BGA 176 ball package
256-pin BGA
BGA 176 ball package datasheet
bga 208 PACKAGE
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JEDEC TRAY DIMENSIONS
Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
Text: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.
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FBGA17
256-pin
SSD-A-H7511
JEDEC TRAY DIMENSIONS
PACKAGE TRAY
jedec bga tray
tray jedec BGA
tray bga
JEDEC tray standard
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337 BGA
Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)
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BGA21
21ESP
256-pin
272-pin
292-pin
320-pin
337-pin
SSD-A-H7071-3
337 BGA
tray bga
256-pin BGA
Transistor 337
tray datasheet bga
BGA PACKAGE 2015
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Untitled
Abstract: No abstract text available
Text: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S y A1 e S φb φ x1 M S A B φ x2 M S S DIMENSIONS 27.00±0.20 D1 24.00
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256-PIN
27x27)
P256F1-127-MN7-1
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Untitled
Abstract: No abstract text available
Text: 256 PIN PLASTIC BGA 27x27 A S B C R H K φM D Y WV U T R P N M L K J H G F E D C B A P Index mark L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.
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S256S1-B6-1
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Untitled
Abstract: No abstract text available
Text: 256-PIN PLASTIC BGA 27x27 A B S C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D Y WV U T R P N M L K J H G F E D C B A P Index mark J R I H K L φM S F S E G M NOTE Each ball centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.
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256-PIN
27x27)
S256S1-127-B6-2
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Untitled
Abstract: No abstract text available
Text: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S S y A1 e S φb φ x1 M S A B φ x2 M S DIMENSIONS 27.00±0.20 D1 24.00
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256-PIN
27x27)
P256F1-127-MN7
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Untitled
Abstract: No abstract text available
Text: 256 PIN PLASTIC BGA 27x27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of
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27x27)
Y256S1-B6
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1
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17x17
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of BGA Staggered pins
Abstract: of BGA Staggered Pins package C10943X
Text: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up
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S272S2-C6-1
S416S2-H6
S480S2-K6-1
S580S2-K6
S672S2-K6-1
C10943X)
of BGA Staggered pins
of BGA Staggered Pins package
C10943X
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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QFP12
QFP13
QFP15
QFP14
12X12X1
14X20X2
14X14X1
SOP48
CF RM sot89
SOP38
14X14X2
epson QFP 216
45x45 mm bga
14x14x2.7
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