Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP128 package SOT320-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP128
OT320-3
OT320-3
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AF200 microcontroller programmer
Abstract: SKwizard AF200 fujitsu STARTERkit mb90f MB90F520 minato 1890A J6 marking code MB90523 MB90570 QFP120
Text: QFP120 Flash-Test-Board Documentation Fujitsu Mikroelektronik GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany Revision: Date: 3.0 20/07/1998 Documentation Flash Test Board Contents Hardware description of QFP120 Flash-Test-Board _ 3
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QFP120
i19200
-SK16
-i19200
-i19200
-FF0000
FFA000
AF200 microcontroller programmer
SKwizard
AF200
fujitsu STARTERkit mb90f
MB90F520
minato 1890A
J6 marking code
MB90523
MB90570
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MO-112
Abstract: QFP120
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-1 c y X A 61 90 ZE 60 91 e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP120:
OT349-1
MO-112
MO-112
QFP120
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QFP-128
Abstract: QFP128 sot320
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP128:
OT320-2
OT320-2
QFP-128
QFP128
sot320
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Untitled
Abstract: No abstract text available
Text: QFP128-P-1420-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 1.19 TYP. 4 版/96.11.28
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QFP128-P-1420-0
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QFP128-P-2828-0
Abstract: QFP128 QFP-128 128P6
Text: 128P6-C Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D b2 ME 97 128 1 96 I2 Symbol HE E Recommended Mount Pad 65 32 33 64 A c A2 L1 y F b A1 e L Detail F A A1 A2 b c D E
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128P6-C
128pin
QFP128-P-2828-0
QFP128
QFP-128
128P6
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PQFP128
Abstract: PQFP-128 P-QFP-128-1 ZD 103 QFP128 PRQP0128KB-A
Text: JEITA Package Code P-QFP128-14x20-0.50 RENESAS Code PRQP0128KB-A Previous Code FP-128B/FP-128BV MASS[Typ.] 1.7g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 102 65 103 64 HE b1 Reference Symbol
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P-QFP128-14x20-0
PRQP0128KB-A
FP-128B/FP-128BV
7x20-0
PQFP128
PQFP-128
P-QFP-128-1
ZD 103
QFP128
PRQP0128KB-A
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QFP128-P-2828-0
Abstract: No abstract text available
Text: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996
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QFP128-P-2828-0
80-DK
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP120 package SOT349-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP120
OT349-2
OT349-2
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FLASH-CAN2-100P-M06
Abstract: socket Yamaichi IC149 064 FPT-120P-M13 IC149-100-114-B5 IC149-100-KS11113-1 MB2132-457 QFP100 QFP120 100RB179
Text: Probe cables and sockets ELECTRONIC DEVICES EUROPE QFP120 package: FPT-120P-M13 MB2132-448 Probe cable old (Evaluation Board: Flash-EVA-120P-M13) Socket for emulator only, from Yamaichi TQPACK 120/144SD (it is not possible to mount a µC in this) MB2132-468 Probe cable (new) (Evaluation board: Flash-EVA2-120P-M13)
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QFP120
FPT-120P-M13
MB2132-448
Flash-EVA-120P-M13)
120/144SD
MB2132-468
Flash-EVA2-120P-M13)
YQPACK120SD220
QFP100
FPT-100P-M06
FLASH-CAN2-100P-M06
socket Yamaichi IC149 064
FPT-120P-M13
IC149-100-114-B5
IC149-100-KS11113-1
MB2132-457
100RB179
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128P6
Abstract: QFP128 QFP128-P-2828-0
Text: 128P6-A Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 97 b2 128 1 96 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 65 32 33 64 A c A2 L1 y F b
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128P6-A
128pin
QFP128-P-2828-0
128P6
QFP128
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QFP120
Abstract: No abstract text available
Text: QFP120 LSI Assembly Units : mm • QFP120 90 31.2 28.0 61 60 31.2 28.0 91 120 31 1 H=3.5Max. The contents described herein are subject to change without notice. 30 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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QFP120
QFP120
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT383-1 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L detail X pin 1 index 120 31 30 1 v M A ZD wM
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QFP120:
OT383-1
OT383-1
MO-108-19
MO-108-1990
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sot349
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-2 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP120:
OT349-2
OT349-2
sot349
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Untitled
Abstract: No abstract text available
Text: 120P6N-C Plastic 120pin 28✕28mm body QFP EIAJ Package Code QFP120-P-2828-0.80 Weight g 4.49 Lead Material Alloy 42 MD e JEDEC Code – HD 91 b2 120 ME D 1 90 I2 30 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 61 31 60 A c A2 L1 y b F
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120P6N-C
120pin
QFP120-P-2828-0
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QFP128
Abstract: PA-QFE128SB-P-Z-03 QFP-128
Text: Top View Bottom View PCB only 1.733" 1.500" 2.488" 2.000" Side View 31.9mm sqr. -03W version (3 level, 0.025" Sqr. WW pin) 28.0mm sqr. 0.814" 1 0.187" 0.018" dia. typ. Description: Prototyping adaptor QFP128 position (0.8mm. pitch) ZIF socket to PGA male base pattern.
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QFP128
PA-QFE128SB-P-Z-03
FR4/G10
QFP-128
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Untitled
Abstract: No abstract text available
Text: QFP128-P-2828-0.80-BK Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ(≥5µm) 5.58 TYP. 3 版/96.11.28
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QFP128-P-2828-0
80-BK
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sot349
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT349-1 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP120:
OT349-1
OT349-1
sot349
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QFP128-P-1420-0
Abstract: qfp128p
Text: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996
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QFP128-P-1420-0
qfp128p
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AF200 microcontroller programmer
Abstract: SKwizard AF200 fujitsu STARTERkit mb90f FFA000 MB90523 MB90570 QFP120 Yokogawa MB90F570
Text: Documentation Flash Test Board QFP120 Flash-Test-Board Documentation Fujitsu Mikroelektronik GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany Revision: Date: 3.2 30/07/1999 Page 1 Documentation Flash Test Board Warranty and Disclaimer To the maximum extent permitted by applicable law, Fujitsu Mikroelektronik GmbH restricts its
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QFP120
FLASH-EVA2-120P-M13)
i19200
-SK16
-i19200
-i19200
-FF0000
FFA000
AF200 microcontroller programmer
SKwizard
AF200
fujitsu STARTERkit mb90f
MB90523
MB90570
Yokogawa
MB90F570
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MO-112
Abstract: QFP128 INDEX33 sot320
Text: PDF: 2003 Feb 19 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; lead angle 60o SOT320-3 c y X A 96 65 97 64 ZE e A E HE A2 (A 3) A1 θ θ1 wM Lp bp L detail X pin 1 index 33
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QFP128:
OT320-3
MO-112
MO-112
QFP128
INDEX33
sot320
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QFP128
Abstract: QFP128-P-2828-0
Text: QFP128-P-2828-0.80-DK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP128-P-2828-0
80-DK
QFP128
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Untitled
Abstract: No abstract text available
Text: QFP120—P—2828—0.80B Uniti nn 32, 0±0, 4 28, 0±0, 2 90 61 91 □60 CU o•H O 120 A O•H O 31 mm rami •¡¡¡¡mi 30 2. 4TYP una 0, 35±0, 1 m o . i s m Jon.2007
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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QFP12
QFP13
QFP15
QFP14
12X12X1
14X20X2
14X14X1
SOP48
CF RM sot89
SOP38
14X14X2
epson QFP 216
45x45 mm bga
14x14x2.7
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