SF-BGA256J-B-01
Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Text: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
|
Original
|
PDF
|
FR4/G10
16x16
SF-BGA256J-B-01
FR4 substrate 1.6mm
SN63
FR4 1.6mm substrate
1.6mm pitch BGA
|
Untitled
Abstract: No abstract text available
Text: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.
|
Original
|
PDF
|
|
M1489
Abstract: M2423 socket 6.3mm BGA Package 14x14 m1489 a1 M1145 180C M1146 14x14 PCB 6.3mm Socket
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 10 9 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
|
Original
|
PDF
|
M2423
P8369A
P8370A
P8371A
R2613
14x14
SBT-BGA-7003
SBT-BGA-7003
M1489
M2423
socket 6.3mm
BGA Package 14x14
m1489 a1
M1145
180C
M1146
PCB 6.3mm Socket
|
7075-T6 aluminum
Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position
|
Original
|
PDF
|
7075-T6
SBT-BGA-7000
7075-T6 aluminum
high current pogo pin
aluminium 7075
180C
high current high temperature pogo pin
|
bga676
Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
|
Original
|
PDF
|
27x27mm,
26x26
SBT-BGA-6002
bga676
1mm pitch BGA socket
BGA-676
BGA 27X27 pitch
27X27MM
7075-T6 aluminum
180C
7075-T6
1mm pitch BGA
|
Untitled
Abstract: No abstract text available
Text: HIGH FREQUENCY SPRING PROBE TEST SOCKET FOR 0.5mm thru 0.8mm BGA FEATURES: • Solderless double-ended spring probes pressure mount to the test board and device solderball or pad. • Only .150” 3.81mm signal path. • Very low inductance and capacitance.
|
Original
|
PDF
|
|
aluminium 7075
Abstract: high current pogo pin FR4 0.8mm thickness BGA400 0.5mm pitch BGA BGA-400 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6505
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
|
Original
|
PDF
|
17x17mm,
20x20
SBT-BGA-6505
SBT-BGA-6505
aluminium 7075
high current pogo pin
FR4 0.8mm thickness
BGA400
0.5mm pitch BGA
BGA-400
7075-T6 aluminum
180C
7075-T6
|
SG-BGA-6061
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer
|
Original
|
PDF
|
225mm
SG-BGA-6061
|
IC 7142
Abstract: SG-BGA-7142 0.65mm pitch BGA
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer
|
Original
|
PDF
|
225mm
5M-1994.
16x22
SG-BGA-7142
IC 7142
0.65mm pitch BGA
|
SG-BGA-6033
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer
|
Original
|
PDF
|
225mm
19x19
SG-BGA-6033
|
35 x 35 PBGA, 580 100 balls
Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8
|
Original
|
PDF
|
C13550EJ1V0PF00
35 x 35 PBGA, 580 100 balls
Enplas drawings
HG7900
BGA Ball Crack
153pin
NEC stacked CSP 2000
PEAK TRAY bga
BGA-35
Lead Free reflow soldering profile BGA
NEC stacked CSP
|
PPC750FX
Abstract: 1mm pitch BGA socket thick bga die size 750FX SG-BGA-6051 0.125mm BGA
Text: GHz BGA Socket - Direct mount, solderless Features Top View Socket supports IBM PowerPC 750FX as well as other BGA devices. Directly mounts to target PCB needs tooling holes with included hardware. High speed, reliable elastomer connection. Minimum real estate required.
|
Original
|
PDF
|
750FX
225mm
725mm
025mm
SG-BGA-6051
125mm
PPC750FX
1mm pitch BGA socket
thick bga die size
0.125mm BGA
|
BGA reflow guide
Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to
|
Original
|
PDF
|
|
|
|
SF-BGA60G-B-62
Abstract: 1mm pitch BGA FR4 substrate 1.6mm
Text: 1.6mm 0.8mm typ. Detail A 1mm 0.89mm [0.035"] 2.83mm [0.112"] 13mm 1mm typ. 1mm Top View 8mm [0.315"] Detail A 2 2.48mm [0.098"] 1 3 0.36mm ± 0.05mm [0.014" ± 0.002"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force with 0.254mm/0.203mm dia. pin
|
Original
|
PDF
|
254mm/0
203mm
254mm0
FR4/G10
con37
SF-BGA60G-B-62
1mm pitch BGA
FR4 substrate 1.6mm
|
TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
|
Original
|
PDF
|
|
TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
|
Original
|
PDF
|
|
sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen
|
Original
|
PDF
|
|
BCN318
Abstract: 250v 1.0K capacitor 627T BB1020DT BB1020DT7 BB1110B BB1110TB BB2110DI BCN31Ladder 628 ladder
Text: bi441 short form 2007 dev.qxd 12 6/26/07 8:59 AM Page 12 Fixed Resistors BGA Networks BGA Network Model BB1110B/BB1110TB/BB2110DI BB1020DT Resistance Nominal, Ohms 20 to 100 475/121/425 Ball Size mm 0.64/0.76 0.64/0.76 Pitch (mm) 1.27, 1 1.27, 1 Absolute Tolerance (%)
|
Original
|
PDF
|
bi441
BB1110B/BB1110TB/BB2110DI
BB1020DT
BCN318
250v 1.0K capacitor
627T
BB1020DT
BB1020DT7
BB1110B
BB1110TB
BB2110DI
BCN31Ladder
628 ladder
|
4n35 optocoupler spice model
Abstract: L14F1 phototransistor datasheet MOC3043-M spice model H11F1 SPICE MODEL h11D1 spice MOC3010 spice L14F1 PHOTOTRANSISTOR slotted optocouplers DARLINGTON phototransistor l14f1 spice MOC3011
Text: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM
|
Original
|
PDF
|
TS-16949
ISO-14001,
4n35 optocoupler spice model
L14F1 phototransistor datasheet
MOC3043-M spice model
H11F1 SPICE MODEL
h11D1 spice
MOC3010 spice
L14F1 PHOTOTRANSISTOR
slotted optocouplers
DARLINGTON phototransistor l14f1
spice MOC3011
|
au38
Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a
|
Original
|
PDF
|
SS01-71060-1E
LQFP-64P
MB2198-304
MB2198-304)
BGA-660P
MB2198300)
MB2198-01)
MB2198-10)
MB91460
au38
ae38
diode ae38
Aj36
G37 IC
AJ-38
satellite a75
AH36
n38 transistor
MB2198-10
|
TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
|
Original
|
PDF
|
TB389
|
qfn Substrate design guidelines
Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid
|
Original
|
PDF
|
TB389
qfn Substrate design guidelines
j-std-001d
IPC-SM-782
MO-220
|
J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
PDF
|
TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
|
