SBT-BGA-6002 Search Results
SBT-BGA-6002 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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| MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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SBT-BGA-6002 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SBT-BGA-6002 | Ironwood Electronics | Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size X (mm): 27; IC Size Y (mm): 27; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.4; IC Ball Height Max (mm): 0.6; IC Ball Diameter Max (mm): 0.7; Max Package Code: BGA676C; Part Description: Stamped pin Burn-in socket | Original |