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    SBT-BGA-7003 Search Results

    SBT-BGA-7003 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    70033-008LF Amphenol Communications Solutions Din Accessory Shroud Hybrid 24 Contacts Visit Amphenol Communications Solutions
    70033-006LF Amphenol Communications Solutions Din Accessory Shroud Hybrid 60 Contacts Visit Amphenol Communications Solutions
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    SBT-BGA-7003 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SBT-BGA-7003 Ironwood Electronics Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.15; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.35; Max Package Code: Part Description: Stamped pin Burn-in socket Original PDF