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    SG-BGA-6061 Search Results

    SG-BGA-6061 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation
    7MMV4101S15BG Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    SG-BGA-6061 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SG-BGA-6061 Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 13.5; IC Size Y (mm): 5.5; IC Array X: 16; IC Array Y: 6; Max Pincount: 96; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.35; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.5; Max Package Code: BGA96C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) Original PDF