SF-BGA228B-B-11
Abstract: BGA228B 1.4mm pitch BGA
Text: D Package Code: BGA228B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA228B
FR4/G10
SF-BGA228B-B-11
BGA228B
1.4mm pitch BGA
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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2032VE
Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
Text: Product Bulletin December 1998 #PB1107 Lattice Introduces Advanced Chip Array and Fine Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA ball grid array packages for its ISP logic devices. The first
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PB1107
2000VE
2032VE
2128VE
208-Ball
1-888-ISP-PLDS
BGA OUTLINE DRAWING
PB1107
Lattice Package Dia
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SF-BGA100C-B-62
Abstract: No abstract text available
Text: 10mm [0.394"] Top View 1.4mm [0.055"] Ordering Information: 1.4mm [0.055"] Solder Ball Alloy Part Number Suffix Sn63Pb37 0.8mm typ. -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 7.2mm square [0.283"] Side View Detail A Detail A 2 2.83mm [0.112"]
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Sn63Pb37
254mm/0
203mm
254mm0
FR4/G10
SF-BGA100C-B-62
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BGA-56 DATASHEET
Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3
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bga 7x7
Abstract: G6006
Text: DESCR IPTO R LTR. DATE A NEW DRAWING APPROVED 3 /0 0 H U Al B A L L P A D C O R N E R Al BALLPAD CORNER 7 0.80 r^ 6 5 4 3 2 1 o oo o o o \ A E ^ o oo o o o o o o o Ed « o o o o oo oo oo oo o o o o oooo c oo oo oo oo D E F G tk 0.80 •1.10 REF TOP VIEW 1.40±0.10
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OCR Scan
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5M-1994
G6006â
bga 7x7
G6006
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BGA and QFP Package mounting
Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,
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BGA reflow guide
Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
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TN1076
1-800-LATTICE
BGA reflow guide
JEDEC SMT reflow profile
BGA PROFILING
304-PQFP
reballing
fine BGA thermal profile
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oki naming format
Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by
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ED-7401-2
oki naming format
DIP42-P-600-2
HQFP208-P-4040-0
R400
S115
0.65mm pitch BGA
PLCC DIMENTIONS
oki marking 20 soj
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Marvell 8686
Abstract: W2CBW003 W2SW0001 802.11 sensitivity dbm W2CBW003-001 W2CBW003-T SC2443 samsung bluetooth OFDM receiver 802.11 Marvell
Text: W2CBW003 - Specifications TM W2CBW003 - 802.11 b/g +Bluetooth System-in-Package The W2SW0001 is a complete 802.11 b/g plus Bluetooth v2.0 + EDR radio solution based on the industry standard Marvell 8686 and Cambridge Silicon Radio architectures. Designed for handheld or portable warehousing/logistics, medical,
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W2CBW003
W2SW0001
SC2443,
15dBm
Marvell 8686
802.11 sensitivity dbm
W2CBW003-001
W2CBW003-T
SC2443
samsung bluetooth
OFDM receiver
802.11 Marvell
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NC7SZ74
Abstract: 16862 FSTU16211 FSTU162211 FSTU162450 FSTU16345 FSTU16861 FSTU3125 FSTU32160 FSTU32160A
Text: Fairchild Interface & Logic Notebook Solutions Superior Performance Solutions Low Voltage Logic Switches TinyLogic Optoelectronics Smaller Packaging Solutions MicroPak™ Ball Grid Array BGA Analog Discrete Interface & Logic Applications Docking station bus switch isolation
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S30ML01GP
Abstract: S30ML512P S29PL127N S29PL-N S30ML-P S75PL127NBF S75PL-N S30ML01 tray matrix bga
Text: S75PL-N MirrorBit ORNAND™ MCPs Stacked Multi-Chip Product MCP S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM S75PL-N MirrorBit™ ORNAND™ MCPs Cover Sheet
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S75PL-N
S29PL-N:
S30ML-P:
S30ML01GP
S30ML512P
S29PL127N
S29PL-N
S30ML-P
S75PL127NBF
S30ML01
tray matrix bga
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Untitled
Abstract: No abstract text available
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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IDT70V3379S
133MHz
133MHz
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Untitled
Abstract: No abstract text available
Text: CY7C1380DV25 CY7C1382DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation
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CY7C1380DV25
CY7C1382DV25
18-Mbit
36/1M
250-MHz
200-MHz
167-MHz
100-pin
119ball
165-bption
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Untitled
Abstract: No abstract text available
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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133MHz
133MHz
IDT70V3379S
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4833
Abstract: 70V3379 A12L A13L A14L IDT70V3379 IDT70V3379S
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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133MHz
133MHz
IDT70V3379S
4833
70V3379
A12L
A13L
A14L
IDT70V3379
IDT70V3379S
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4833
Abstract: A14L 70V3379 A12L A13L IDT70V3379 IDT70V3379S
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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133MHz
133MHz
IDT70V3379S
4833
A14L
70V3379
A12L
A13L
IDT70V3379
IDT70V3379S
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X0607
Abstract: No abstract text available
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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IDT70V3379S
133MHz
133MHz
X0607
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Untitled
Abstract: No abstract text available
Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.
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IDT70V3379S
133MHz
133MHz
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NAND512-M
Abstract: BGA149
Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mbit, 512 Mbit (x8/ x16) NAND Flash + 1 die of 256 Mbit (x16) SDR
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NAND256-M
NAND512-M,
NAND01G-M
256/512Mb/1Gb
x8/x16,
256/512Mb
x16/x32,
TFBGA107
TFBGA149
LFBGA137
NAND512-M
BGA149
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BGA bga 10x13
Abstract: NAND FLASH BGA st nand flash application note BGA137 MCP NAND DDR NAND512-M NAND01G-M NAND256-M NAND256R3M0
Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR
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NAND256-M
NAND512-M,
NAND01G-M
256/512Mb/1Gb
x8/x16,
256/512Mb
x16/x32,
BGA bga 10x13
NAND FLASH BGA
st nand flash application note
BGA137
MCP NAND DDR
NAND512-M
NAND01G-M
NAND256-M
NAND256R3M0
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TFBGA137
Abstract: BGA137 BGA bga 10x13 MCP NAND DDR NAND FLASH BGA zc 409 NAND512-M NAND01G-M NAND256-M NAND256R3M0
Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP Features • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR LPSDRAM
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NAND256-M
NAND512-M,
NAND01G-M
256/512Mb/1Gb
x8/x16,
256/512Mb
x16/x32,
TFBGA107
TFBGA149
LFBGA137
TFBGA137
BGA137
BGA bga 10x13
MCP NAND DDR
NAND FLASH BGA
zc 409
NAND512-M
NAND01G-M
NAND256-M
NAND256R3M0
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Untitled
Abstract: No abstract text available
Text: CY7C1386DV25 CY7C1387DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200 and 167 MHz • Registered inputs and outputs for pipelined operation
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CY7C1386DV25
CY7C1387DV25
18-Mbit
36/1M
250-MHz
200-MHz
167-MHz
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BGA149
Abstract: TFBGA149 BGA107
Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR
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NAND256-M
NAND512-M,
NAND01G-M
256/512Mb/1Gb
x8/x16,
256/512Mb
x16/x32,
TFBGA107
TFBGA149
BGA149
BGA107
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