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    1.4MM PITCH BGA Search Results

    1.4MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    1.4MM PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SF-BGA228B-B-11

    Abstract: BGA228B 1.4mm pitch BGA
    Text: D Package Code: BGA228B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA228B FR4/G10 SF-BGA228B-B-11 BGA228B 1.4mm pitch BGA

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    2032VE

    Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
    Text: Product Bulletin December 1998 #PB1107 Lattice Introduces Advanced Chip Array and Fine Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA ball grid array packages for its ISP logic devices. The first


    Original     		PDF PB1107 2000VE 2032VE 2128VE 208-Ball 1-888-ISP-PLDS BGA OUTLINE DRAWING PB1107 Lattice Package Dia

    SF-BGA100C-B-62

    Abstract: No abstract text available
    Text: 10mm [0.394"] Top View 1.4mm [0.055"] Ordering Information: 1.4mm [0.055"] Solder Ball Alloy Part Number Suffix Sn63Pb37 0.8mm typ. -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 7.2mm square [0.283"] Side View Detail A Detail A 2 2.83mm [0.112"]


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA100C-B-62

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    BGA and QFP Package mounting

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
    Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,


    Original     		PDF

    BGA reflow guide

    Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
    Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		PDF TN1076 1-800-LATTICE BGA reflow guide JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile

    oki naming format

    Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
    Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by


    Original     		PDF ED-7401-2 oki naming format DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj

    Marvell 8686

    Abstract: W2CBW003 W2SW0001 802.11 sensitivity dbm W2CBW003-001 W2CBW003-T SC2443 samsung bluetooth OFDM receiver 802.11 Marvell
    Text: W2CBW003 - Specifications TM W2CBW003 - 802.11 b/g +Bluetooth System-in-Package The W2SW0001 is a complete 802.11 b/g plus Bluetooth v2.0 + EDR radio solution based on the industry standard Marvell 8686 and Cambridge Silicon Radio architectures. Designed for handheld or portable warehousing/logistics, medical,


    Original     		PDF W2CBW003 W2SW0001 SC2443, 15dBm Marvell 8686 802.11 sensitivity dbm W2CBW003-001 W2CBW003-T SC2443 samsung bluetooth OFDM receiver 802.11 Marvell

    NC7SZ74

    Abstract: 16862 FSTU16211 FSTU162211 FSTU162450 FSTU16345 FSTU16861 FSTU3125 FSTU32160 FSTU32160A
    Text: Fairchild Interface & Logic Notebook Solutions Superior Performance Solutions Low Voltage Logic Switches TinyLogic Optoelectronics Smaller Packaging Solutions MicroPak™ Ball Grid Array BGA Analog Discrete Interface & Logic Applications Docking station bus switch isolation


    Original     		PDF

    S30ML01GP

    Abstract: S30ML512P S29PL127N S29PL-N S30ML-P S75PL127NBF S75PL-N S30ML01 tray matrix bga
    Text: S75PL-N MirrorBit ORNAND™ MCPs Stacked Multi-Chip Product MCP S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM S75PL-N MirrorBit™ ORNAND™ MCPs Cover Sheet


    Original     		PDF S75PL-N S29PL-N: S30ML-P: S30ML01GP S30ML512P S29PL127N S29PL-N S30ML-P S75PL127NBF S30ML01 tray matrix bga

    Untitled

    Abstract: No abstract text available
    Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.


    Original     		PDF IDT70V3379S 133MHz 133MHz

    Untitled

    Abstract: No abstract text available
    Text: CY7C1380DV25 CY7C1382DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation


    Original     		PDF CY7C1380DV25 CY7C1382DV25 18-Mbit 36/1M 250-MHz 200-MHz 167-MHz 100-pin 119ball 165-bption

    tray matrix bga

    Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
    Text: u Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Revision Status Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A 3/1/03 1-1 u Chapter 1 Codes and Carrier Options REVISION STATUS


    Original     		PDF

    4833

    Abstract: 70V3379 A12L A13L A14L IDT70V3379 IDT70V3379S
    Text: Š HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.


    Original     		PDF 133MHz 133MHz IDT70V3379S 4833 70V3379 A12L A13L A14L IDT70V3379 IDT70V3379S

    4833

    Abstract: A14L 70V3379 A12L A13L IDT70V3379 IDT70V3379S
    Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.


    Original     		PDF 133MHz 133MHz IDT70V3379S 4833 A14L 70V3379 A12L A13L IDT70V3379 IDT70V3379S

    X0607

    Abstract: No abstract text available
    Text: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.


    Original     		PDF IDT70V3379S 133MHz 133MHz X0607

    Untitled

    Abstract: No abstract text available
    Text: Š HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.


    Original     		PDF IDT70V3379S 133MHz 133MHz

    NAND512-M

    Abstract: BGA149
    Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mbit, 512 Mbit (x8/ x16) NAND Flash + 1 die of 256 Mbit (x16) SDR


    Original     		PDF NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 256/512Mb x16/x32, TFBGA107 TFBGA149 LFBGA137 NAND512-M BGA149

    BGA bga 10x13

    Abstract: NAND FLASH BGA st nand flash application note BGA137 MCP NAND DDR NAND512-M NAND01G-M NAND256-M NAND256R3M0
    Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR


    Original     		PDF NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 256/512Mb x16/x32, BGA bga 10x13 NAND FLASH BGA st nand flash application note BGA137 MCP NAND DDR NAND512-M NAND01G-M NAND256-M NAND256R3M0

    TFBGA137

    Abstract: BGA137 BGA bga 10x13 MCP NAND DDR NAND FLASH BGA zc 409 NAND512-M NAND01G-M NAND256-M NAND256R3M0
    Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP Features • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR LPSDRAM


    Original     		PDF NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 256/512Mb x16/x32, TFBGA107 TFBGA149 LFBGA137 TFBGA137 BGA137 BGA bga 10x13 MCP NAND DDR NAND FLASH BGA zc 409 NAND512-M NAND01G-M NAND256-M NAND256R3M0

    Untitled

    Abstract: No abstract text available
    Text: CY7C1386DV25 CY7C1387DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200 and 167 MHz • Registered inputs and outputs for pipelined operation


    Original     		PDF CY7C1386DV25 CY7C1387DV25 18-Mbit 36/1M 250-MHz 200-MHz 167-MHz

    BGA149

    Abstract: TFBGA149 BGA107
    Text: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR


    Original     		PDF NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 256/512Mb x16/x32, TFBGA107 TFBGA149 BGA149 BGA107

    bga 7x7

    Abstract: G6006
    Text: DESCR IPTO R LTR. DATE A NEW DRAWING APPROVED 3 /0 0 H U Al B A L L P A D C O R N E R Al BALLPAD CORNER 7 0.80 r^ 6 5 4 3 2 1 o oo o o o \ A E ^ o oo o o o o o o o Ed « o o o o oo oo oo oo o o o o oooo c oo oo oo oo D E F G tk 0.80 •1.10 REF TOP VIEW 1.40±0.10


    OCR Scan     		PDF 5M-1994 G6006â bga 7x7 G6006