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    BGA reflow guide

    Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
    Text: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		PDF TN1076 1-800-LATTICE BGA reflow guide pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga

    BGA reflow guide

    Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
    Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		PDF TN1076 1-800-LATTICE BGA reflow guide JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile

    lcmxo2-1200

    Abstract: LCMXO2-4000 DDR3 pcb layout guide DDR3 sodimm pcb layout schematic isp Cable lattice hw-dln-3c LCMXO2-640 An8077 LCMXO2-7000 vhdl spi interface wishbone LFXP2-8E
    Text: 2 W O LD NE hX-ALL P acO-IT MTHE D Product Selector Guide November 2010 FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLS CONTENTS •■ Advanced Packaging. 4


    Original     		PDF LatticeMico32, I0211 lcmxo2-1200 LCMXO2-4000 DDR3 pcb layout guide DDR3 sodimm pcb layout schematic isp Cable lattice hw-dln-3c LCMXO2-640 An8077 LCMXO2-7000 vhdl spi interface wishbone LFXP2-8E

    FtBGA

    Abstract: 256-FTBGA 132csBGA ispMACH 4A5 132-ucBGA 1048E 484-fpBGA TQFP 132 PACKAGE ispMACH 4A3 POWR607
    Text: LEAD-FREE AND HALOGEN-FREE PACKAGING FROM LATTICE RoHS Compliant Packaging Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment.


    Original     		PDF