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    0.4MM PITCH QFP Search Results

    0.4MM PITCH QFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HM2R88PA8108N2LF Amphenol Communications Solutions Millipacs®, Back Plane Connectors, 2mm Hard Metric Series 8 Row Right Angle Press-Fit Female, Type E with 200 Signal Pins with 4mm Pitch Shield Visit Amphenol Communications Solutions
    10162416-002RHLF Amphenol Communications Solutions DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Standard, 10u\\ Goldplating Visit Amphenol Communications Solutions
    10162416-001RHLF Amphenol Communications Solutions DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Standard, G/F plating Visit Amphenol Communications Solutions
    10157422-002RHLF Amphenol Communications Solutions DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Reverse, 10u\\ Goldplating Visit Amphenol Communications Solutions
    10162416-005RHLF Amphenol Communications Solutions DDR5 SODIMM, Storage and Server Connector, Right Angle, Surface Mount, 262 Position, 0.5mm Pitch, 4mm Height, Standard, 30u\\ Goldplating Visit Amphenol Communications Solutions

    0.4MM PITCH QFP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    A 0540

    Abstract: QFE120SC SF-QFE120SC-L-01
    Text: Surface mountable QFP emulator foot; leadless version, sized to fit on 120 position 0.4mm. pitch land pattern. Ironwood Spec: QFE120SC. 0.4mm Typ. 0.600" 0.600" 0.018" 0.050" 0.250" 0.063" A compatible target board land dimensions A< 0.540" B> 0.660" B Substrate: FR4/G10, 0.0625"±0.007" thick.


    Original     		QFE120SC. FR4/G10, SF-QFE120SC-L-01 SF-QFE120SC-L-01 Date8/15/97 A 0540 QFE120SC PDF

    IC51-2564-1668

    Abstract: a 1668 LS-QFE256SA-Z-01 socket Yamaichi ic51 qfp IC51
    Text: 0.075" X 0.008" SMT pad Top View 0.4mm typ. 1 Bottom View 0.075" 0.352" 1.215" 0.4mm pitch 1.920" 1.920" 1.272" 1.452" Side View 1.652" 0.122" 0.250" 1.852" 0.018" dia. typ. 2 Description: Land socket 256 position QFP surface mount pads to 256 position male terminal pins Yamaichi ZIF socket footprint, IC51-2564-1668 .


    Original     		IC51-2564-1668) LS-QFE256SA-Z-01 LS-QFE256SA-Z-iew LS-QFE256SA-Z-01 Fr4/G10 finish10µ IC51-2564-1668 a 1668 socket Yamaichi ic51 qfp IC51 PDF

    B1448

    Abstract: A1702 ipc 620 BOX21151 SF-QFE80SD-L-01F
    Text: RoHS COMPLIANT 15.7mm [0.620"] top and bottom pad width only see side view for side pad width 15.7mm [0.620"] 13.7mm SQR. [0.540"] 0.4mm typ. [0.017"] Top View 0.050" pitch typ. 0.5mm dia. typ. [0.018"] 2 6.4mm±0.254mm [0.250"±0.010"] Side View 1 0.4mm [0.016"]


    Original     		254mm SF-QFE80SD-L-01F BOX21151 B1448 A1702 ipc 620 PDF

    ICP-120-2

    Abstract: No abstract text available
    Text: IC149 Series SMT QFP/TQFP - 120 Pins (30x30) 0.4mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):


    Original     		IC149 30x30) 100Veff 700Veff IC149 ICP-120-2 PDF

    YAMAICHI ic357

    Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV Dep51-820-2 KS-9376 YAMAICHI ic357 IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004 PDF

    IC51-1284-1433

    Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV IC51-0644-820-4 IC51-820-2 KS-9376 IC51-1284-1433 IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158 PDF

    cxd 158

    Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		10mA/20mV cxd 158 ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003 PDF

    Untitled

    Abstract: No abstract text available
    Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite


    OCR Scan     		QFP64 QFP80 QFP100 BQFP100 TQFP100 QFP120 TQFP120 BQFP132 QFP160 PDF

    Untitled

    Abstract: No abstract text available
    Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite


    OCR Scan     		QFP64 QFP80 QFP100 BQFP100 TQFP120 BQFP132 25mils QFP160 QFP184 PDF

    QFP 128 lead .5mm

    Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
    Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series


    Original     		12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M PDF

    CA-QFE128SD-M-S-01

    Abstract: No abstract text available
    Text: 17.78mm [0.700"] 0.4mm Pitch 17.78mm [0.700"] Top View 0.23mm [0.009"] typ. 13.46mm [0.530"] 17.02mm [0.670"] 1 Side View 6.35mm [0.250"] 4.76mm [0.188"] 3 2 13.21mm [0.520"] female interface UGA12/128A 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


    Original     		UGA12/128A) FR4/G10 CA-QFE128SD-M-S-01 PDF

    PA-QFE128SD-P-S-01

    Abstract: QFE128SD
    Text: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 finish10µ QFE128SD) 14x14 PA-QFE128SD-P-S-01 QFE128SD PDF

    qfp 0.4mm

    Abstract: SC-82AB
    Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-10-21 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm


    Original     		O-220 O-220F 778mm OT-89 SC-82AB SC-88A OT-23 qfp 0.4mm SC-82AB PDF

    SC-82AB

    Abstract: No abstract text available
    Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-05-06 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm


    Original     		O-220 O-220F 778mm OT-89 SC-82AB SC-88A OT-23 GX27mm SC-82AB PDF

    CU-106A

    Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
    Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT


    Original     		PDF

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


    Original     		32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact


    OCR Scan     		PDF

    100405-1

    Abstract: TQPACK100SD Eletech Electronics AXS4643R195C AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046
    Text: Appendix A Reference Dimensional Drawing for Common 64-pin 0.8mm-pitch QFP Foot Pattern Package type name Manufacturer's name and package classification 64P6N-A Renesas MCU package type name IC61-0644-052 IC61-0644-053 Yamaichi Electronics Co., Ltd. IC socket type name


    Original     		64-pin 64P6N-A IC61-0644-052 IC61-0644-053 IC61-0644-088 AXS4643R195C AXS4643R195C TQPACK080SD TQPACK080SB 100405-1 TQPACK100SD Eletech Electronics AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046 PDF

    78K3

    Abstract: uPD78365A uPD78355 uPD78368A uPD784025
    Text: 1/2 16 BIT MICROCONTROLLERS 78K3 AND 78K4 SERIES • A DIVERSE RANGE OF 16 BIT MICROCONTROLLERS • UP TO 256K OF MASK PROGRAMABLE ROM AND 12.5K OF RAM • SEVERAL MICROCONTROLLERS HAVE MULTIPLE ADC CHANNELS AND 2 DAC CHANNELS • AVAILABLE IN QFP PACKAGES FOR OPERATION AS LOW AS 1.8V


    Original     		PD78310A 64QFP PD78312A PD78320 74QFP6 PD78322 PD783235 64QFPG 78K3 uPD78365A uPD78355 uPD78368A uPD784025 PDF

    MB2147-01

    Abstract: F2MC-16
    Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71021-2E F2MC-16 FAMILY EMULATOR QFP-100P PROBE HEADER MB2147-580 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100P *1 probe header MB2147-580 for the F2MC *2 -16 family emulator. The QFP-100P probe header is used by the probe header to connect the F2MC-16L/LX emulator


    Original     		SS01-71021-2E F2MC-16 QFP-100P MB2147-580 QFP-100P MB2147-580) F2MC-16L/LX MB2147-01) MB2147-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		100x10 PDF

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		100x10 PDF

    pitch 0.4mm BGA

    Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
    Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology


    Original     		100x10 100x10-6/k pitch 0.4mm BGA BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka PDF

    0.3mm pitch BGA

    Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm
    Text: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available


    Original     		Spreadspg189-328 Spreadspg189-328 100x10-6/K 0.3mm pitch BGA pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm PDF