CSP192 Search Results

CSP192 Datasheets (4)

Part	Manufacturer	Description	Type	PDF
CSP192-30TG	Advanced Interconnections	192 POS MOLDED PGA SOCKET	Original	PDF
CSP192-45GG	Advanced Interconnections	192 POS MOLDED PGA SOCKET	Original	PDF
CSP192-45TG	Advanced Interconnections	192 POS MOLDED PGA SOCKET	Original	PDF
CSP192-45TT	Advanced Interconnections	192 POS MOLDED PGA SOCKET	Original	PDF

CSP192 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
QFP 128 lead .5mm Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series	Original	PDF	12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M

Catalog Datasheet

MFG & Type

PDF

Document Tags

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Original

PDF

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Original

PDF

QFP 128 lead .5mm

Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series

Original

PDF

12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M