The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00296628.pdf
Manufacturer
-
Partial File Text
Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen(* and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 0
Datasheet Type
Original
ECAD Model
DSASW00296628.pdf preview
Download Datasheet
User Tagged Keywords
6335F
8704B500
8704B5000
Cu OSP
Cu6Sn5
electroless nickel environmental test
heraeus
Heraeus paste ws
JESD22-B111
Olympus bx60
Sn37Pb-bumped