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Catalog Datasheet	MFG & Type	Document Tags	PDF
JESD22-B111 Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5 Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA	Original		PDF

Catalog Datasheet

MFG & Type

Document Tags

PDF

JESD22-B111

Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5
Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA

Original

PDF