DSASW00296630.pdf

Manufacturer -
Partial File Text Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao*, Luu Nguyen**, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 ** National S
Type Original
ECAD Model

DSASW00296630.pdf preview Download Datasheet