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Catalog Datasheet	MFG & Type	PDF	Document Tags
study of alloy Abstract: Cu6Sn5 63Sn37Pn 63Sn37Pb Text: Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao, Luu Nguyen, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 * National Semiconductor Corporation, Santa Clara, CA 95052 Abstract Aging effects and creep behavior along with	Original	PDF

Catalog Datasheet

MFG & Type

PDF

Document Tags

study of alloy

Abstract: Cu6Sn5 63Sn37Pn 63Sn37Pb
Text: Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao*, Luu Nguyen*, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 * National Semiconductor Corporation, Santa Clara, CA 95052 Abstract Aging effects and creep behavior along with

Original

PDF