74LS04D
Abstract: mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C
Text: TEXAS INSTRUMENTS Final Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab July 22, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) has qualified Mitsubishi
|
Original
|
125mm
85C85
260deg
74LS04D
mitsubishi lot code
HBM 00-01
74ls04d datasheet
TI Ji Bipolar
LINEAR TECHNOLOGY date code
JI Bipolar
500 mold compound
JI Linear Bipolar Products
TL 170C
|
PDF
|
F741583
Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001
|
Original
|
EN-4085S2K3
96mils
L3/260C
UL94-V0
TMS471R1F138
85C/85
3/260C
F741583
sp3721d
d741667bpgf
F741583PGF
f721501apgf
tnetv901apag
F711862PGE
F721730EPBK
f721905pag
F731891PDV
|
PDF
|
TMS57002DPHA
Abstract: TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993
Text: Texas Instruments Incorporated Transfer the Assembly Production for the TMS57002DPHA Device from HIJI to TIPI and the Transfer the Wafer Fab Source from MIHO5 to HFAB SAMPLE REQUEST / FINAL NOTIFICATION LETTER PCN# 20020411001 May 28, 2002 Dear Customer: The following notes apply to this correspondence:
|
Original
|
TMS57002DPHA
TMS57002
identification trace code texas
50C40
F312993PAG
TMS57002DPH
F312185PJM
tms57002d
hitachi assembly date code
F312993
|
PDF
|
shinetsu
Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold
|
Original
|
KMC-288
KMC-288
KMC-166
SN74ACT16241DGG
JESD22
KMC-166
SN74ACT16841DGG
SN74ABT16823DGV
shinetsu
KMC288
SLL-28
EN-4088Z
TEXAS INSTRUMENTS, Mold
EPIC-1S
|
PDF
|
50B40
Abstract: EN-4088Z KMC-166 SN74GTL16612 SN74GTL16612A SN74GTL16616 TEXAS INSTRUMENTS, Mold Compound ASL2B mold compound
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74GTL16612A GTL/GTL+ B-Port Output Edge Control Circuits Optimized for Distributed Load Applications August 27, 1999 Abstract Texas Instruments has qualified the SN74GTL16612A redesign of the SN74GTL16612
|
Original
|
SN74GTL16612A
SN74GTL16612
SN74GTL16612
95MHz.
85MHz.
GTL16612
GTL16612A
50B40
EN-4088Z
KMC-166
SN74GTL16616
TEXAS INSTRUMENTS, Mold Compound
ASL2B
mold compound
|
PDF
|
10KACN
Abstract: LVC112A EN-4088Z SN74LVC112AD
Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of SOIC Narrow Body D and SSOP (DL) in all pin variations to TI Mexico Assembly/Test Facility (TMX) December 3, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the SOIC and
|
Original
|
SN74ABT16823DL
5297B
10KACN
LVC112A
EN-4088Z
SN74LVC112AD
|
PDF
|
ABT16245A
Abstract: 8041016 EN-4088Z texas instruments lot trace code SN74ABT16245 dimensions 4088 sn74abt EN4088Z SN74ABT162244 SN74ABT162245
Text: TEXAS INSTRUMENTS Qualification Notification for Selected SN74ABT/ABTH Device Redesigns December 14, 1998 Abstract Texas Instruments Standard Linear and Logic is issuing this notification to qualify the redesign of four devices in the ABT technology. These devices were redesigned for a die shrink
|
Original
|
SN74ABT/ABTH
62245DL
ABTH16245DL
ABTH162245DL
ABT16245A
8041016
EN-4088Z
texas instruments lot trace code
SN74ABT16245 dimensions
4088
sn74abt
EN4088Z
SN74ABT162244
SN74ABT162245
|
PDF
|
SHINKO
Abstract: KMC-166 EN-4065 EN-4088Z 50B40
Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of TVSOP and TSSOP in all pin variations to TI Mexico Assembly/Test Facility TMX September 5, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the TVSOP and
|
Original
|
TMLVCH162830DBB
SN74ALVCH162830DBB
SHINKO
KMC-166
EN-4065
EN-4088Z
50B40
|
PDF
|
EPIC-1ZS
Abstract: 50C24 50C24.1 SN74CBT16244 SN74CBT3125 SN74CBT3126 SN74CBT3306 SN74CBT6800 SN74CBT6800A SN74CBTD3306
Text: TEXAS INSTRUMENTS Qualification Notification for Select ’SN74CBT’ Technology Devices August 12,1999 Abstract Texas Instruments has qualified die revisions and die shrinks for several device types in the SN74CBT technology family. These devices were redesigned in order to optimize yields and increase capacity. This
|
Original
|
SN74CBT'
SN74CBT
CBT6800
CBT6800A
74CBT6800
74CBT6800
74CBT6800A
EPIC-1ZS
50C24
50C24.1
SN74CBT16244
SN74CBT3125
SN74CBT3126
SN74CBT3306
SN74CBT6800
SN74CBT6800A
SN74CBTD3306
|
PDF
|
CD4000
Abstract: CD4011BE harris sec 743 CD4013BE CD4020BE Datasheet CD4060BE CD4067BE CD40106BE CD40110BE CD4011BE
Text: TEXAS INSTRUMENTS Final Notification of the CD4K-H Process Qualification for Acquisition of Harris Semiconductor CD4000 Logic Business May 10, 1999 Abstract Texas Instruments Standard Linear and Logic Products SLL is pleased to announce the successful completion of the CD4K-H process qualification for the CD4000 products acquired from Harris
|
Original
|
CD4000
CD4514BE
CD4070BM
CD4000
CD4514BM
CD4071BE
CD4515BE
CD4071BER3812
CD4011BE harris
sec 743
CD4013BE
CD4020BE Datasheet
CD4060BE
CD4067BE
CD40106BE
CD40110BE
CD4011BE
|
PDF
|
TL062p
Abstract: TL084IDR TL084ACDR TL082BCDR TL082BCP TL084ACD TL082ACP TL082BCD TL084IN TL084BCD
Text: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB October 7, 1997 Abstract Texas Instruments Standard Linear and Logic has completed qualification for wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. Reference
|
Original
|
TL072IP3
TL074ACJ
TL074BCDR
TL074IDR10
TL081ACDR
TL081BCDR
TL081CDR10
TL081ID
TL082ACD
TL082ACP
TL062p
TL084IDR
TL084ACDR
TL082BCDR
TL082BCP
TL084ACD
TL082ACP
TL082BCD
TL084IN
TL084BCD
|
PDF
|
PC2400
Abstract: QMI-505MT QMI505 5310A EN-4088Z QMI505MT SN74F32 SN74F32N RH42
Text: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for PDIP Product March 18, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount compound
|
Original
|
505MT
EN-4088Z
QMI-505MT
PC2400
QMI505
5310A
QMI505MT
SN74F32
SN74F32N
RH42
|
PDF
|
transistor MN1
Abstract: NAND Qualification Reliability HC00D SN74HC00 texas instruments lot trace code EN-4088Z HC00 HCT00 SN74HCT00 S01-06800
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74HC00 and SN74HCT00, Die Revision K August 20, 1997 Abstract Texas Instruments qualified the SN74HC00 and SN74HCT00 die revision K, to replace the SN74HC00 die revision F and the SN74HCT00 die revision G. Die revision K is a product
|
Original
|
SN74HC00
SN74HCT00,
SN74HCT00
S01-06800
transistor MN1
NAND Qualification Reliability
HC00D
texas instruments lot trace code
EN-4088Z
HC00
HCT00
|
PDF
|
LT1013CP
Abstract: LT1013
Text: TEXAS INSTRUMENTS Informational Notification for the Qualification of LT1013 Die Revision H September 30, 1998 Abstract Texas Instruments Inc., Standard Linear and Logic products SLL has completed a redesign/shrink of the LT1013 device. This device is manufactured in the Sherman Wafer Fab (SFAB) using qualified JI
|
Original
|
LT1013
LT1013
QTS-10436
LT1013CP
|
PDF
|
|
|
TL431CLP
Abstract: plaskon on 5295 transistor LMISR4 Texas Instruments Philippines 2374A TL431 2374ab Linear Technology PCN TO 92 leadframe
Text: TEXAS INSTRUMENTS Final Notification for TO-92 Package to be Built at PSI Technologies, Inc. in Manila, Philippines June 3, 1997 Abstract As previously notified in April by PCN 5295, Texas Instruments Standard Linear and Logic Products SLL has qualified the PSI Technologies, Inc. subcontractor plant in the Philippines to
|
Original
|
TL431CLP
TL431CLP
plaskon
on 5295 transistor
LMISR4
Texas Instruments Philippines
2374A
TL431
2374ab
Linear Technology PCN
TO 92 leadframe
|
PDF
|
LM393P
Abstract: TI Ji Bipolar leadframe JI Bipolar 01003 LM393 TS-095 16 PIN PDIP TEXAS INSTRUMENTS
Text: TEXAS INSTRUMENTS Informational Notification for the Qualification of the 8 Pin IDLF Leadframe July 31, 1998 Abstract Texas Instruments Inc., Standard Linear and Logic products SLL is converting from the conventionally designed 8 pin PDIP leadframe to the interdigitated leadframe (IDLF) design for the TI
|
Original
|
LM393P
LM393P
TI Ji Bipolar
leadframe
JI Bipolar
01003
LM393
TS-095
16 PIN PDIP TEXAS INSTRUMENTS
|
PDF
|
SN74CBT16233
Abstract: eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16233, Die Revision B October 29, 1998 Abstract Texas Instruments has qualified a die revision for the CBT16233, die revision ‘B’. This device was redesigned in order to incorporate improved ESD protection circuitry.
|
Original
|
SN74CBT16233,
CBT16233,
SN74CBT16233
eiaj datecode
relco
CBT16233
EN-4088Z
SN74CBT16233DL
ASL2B
|
PDF
|
tanaka gold wire
Abstract: tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW
Text: TEXAS INSTRUMENTS Qualification Notification of the Change from 0.95 mil Conventional Gold Bonding Wire to 0.80 mil Tanaka GPG Gold Alloy Bonding Wire for SLL Product June 23, 1997 Abstract Texas Instruments Standard Linear and Logic Products SLL has qualified the 0.80 mil Tanaka GPG
|
Original
|
S01-06486
S01-06563
tanaka gold wire
tanaka wire
tanaka bonding wire
tanaka GPG wire
tanaka wire 15 mils
tanaka
EN-4088Z
SN74LS244
SN74LS244DW
|
PDF
|
Precon
Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication
|
Original
|
150mm
125mm
DiH20Rn
260deg
Precon
857916
ACT245
EN-4088Z
SN74ACT245N
EPIC-1S
|
PDF
|
JI Bipolar
Abstract: 5331a
Text: TEXAS INSTRUMENTS Final Notification for 2 Pin KTP Package to be Built at PSI Technologies, Inc. in Manila, Philippines September 15, 1998 Abstract Texas Instruments Inc, Standard Linear and Logic Products SLL has completed qualification of PSI Technologies, Inc. subcontractor site in Manila, Philippines to build the 2 pin
|
Original
|
|
PDF
|
TL783CKC
Abstract: QTS06450
Text: TEXAS INSTRUMENTS Final Notification for the Addition of BIDFET Process to the Sherman Wafer Fabrication Site and Die Revision for TL783CIN July 27, 1998 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the BIDFET process. The
|
Original
|
TL783CIN
TL783CIN
QTS06450
TL783CKC
|
PDF
|
PMC-90
Abstract: PMC-90 leadframe material MP150SG pmc90 MP150s poongsan pmc 26 mold compound "leadframe material" DIP 20 plaskon poongsan pmc
Text: TEXAS INSTRUMENTS Final Notification of New Mold Compound for TO-220 Packages; New Source for Leadframes and Au Wire May 7, 1998 Abstract Texas Instruments has qualified a new mold compound for the TO-220 packages. This new compound will be used in addition to the previously qualified compounds, and add flexibility to our
|
Original
|
O-220
UA7808CKC,
PMC-90
PMC-90 leadframe material
MP150SG
pmc90
MP150s
poongsan pmc 26
mold compound
"leadframe material" DIP 20
plaskon
poongsan pmc
|
PDF
|
CBT16211A
Abstract: EPIC-1ZS EN-4088Z SN74CBT16209 SN74CBT16210 SN74CBT16211 SN74CBT16211A SN74CBT16211DL
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16211A, Die Revision D September 16, 1997 Abstract Texas Instruments has qualified a device revision for the SN74CBT16211A, die revision ‘D’ to replace the SN74CBT16211, die revision ‘B’. This device was redesigned in order to improve the ESD
|
Original
|
SN74CBT16211A,
SN74CBT16211,
SN74CBT16211
SN74CBT16211A
CBT16211A,
CBT16211,
CBT16211
CBT16211A
CBT16211A
EPIC-1ZS
EN-4088Z
SN74CBT16209
SN74CBT16210
SN74CBT16211DL
|
PDF
|
SN75LP185A
Abstract: EN-4088Z SN75LPE185 SN75LPE185DW
Text: TEXAS INSTRUMENTS Final Notification for the SN75LP185A/SN75LPE185 Devices May 22, 1998 Abstract Texas Instruments has redesigned the SN75LP185 and SN75LPE185 to remove waivers currently associated with these devices. A data sheet change will occur on the SN75LP185 so it will be called the
|
Original
|
SN75LP185A/SN75LPE185
SN75LP185
SN75LPE185
SN75LP185A.
SN75LP185A
SN75LP185A,
SN75LP185,
EN-4088Z
SN75LPE185DW
|
PDF
|
