JMK107BBJ226MA-T
Abstract: GRM155R11C104K grm155b31a105ke15
Text: Power Management IC RD5T532x Product Specifications Rev. 1.3 2012.06.08 RICOH COMPANY, LTD. Electronic Devices Company This specification is subject to change without notice. Table of Contents 1. Outline. 6
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RD5T532x
JMK107BBJ226MA-T
GRM155R11C104K
grm155b31a105ke15
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ups PURE SINE WAVE schematic diagram
Abstract: mems microphone
Text: BelaSigna R262 Wideband Voice Capture and Noise Reduction Solution Introduction Key Features and Benefits • Drop−in Solution that Works without Special Tuning • Consistently Captures Voice Regardless of Acoustic Environment or • • • • • •
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BR262/D
ups PURE SINE WAVE schematic diagram
mems microphone
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WLCSP30
Abstract: ups PURE SINE WAVE schematic diagram
Text: BelaSigna R262 Wideband Voice Capture and Noise Reduction Solution Introduction Key Features and Benefits • Drop−in Solution that Works without Special Tuning • Consistently Captures Voice Regardless of Acoustic Environment or • • • • • •
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BR262/D
WLCSP30
ups PURE SINE WAVE schematic diagram
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90Pb 10Sn solder paste
Abstract: underfill with or without underfill Flip Chip Substrate nitto chip
Text: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028 Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright
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AN01028
SCA73
853503/01/pp20
90Pb 10Sn solder paste
underfill
with or without underfill
Flip Chip Substrate
nitto chip
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ups PURE SINE WAVE schematic diagram
Abstract: 3 phase ups PURE SINE WAVE schematic diagram R262 BR262W30A103E1G BR262W30 electret mems microphone preamplifier BR262 WLCSP-30 BR262W26A103E1G make three phase ups schematic diagram
Text: BelaSigna R262 Wideband Voice Capture and Noise Reduction Solution Introduction • Drop−in Solution that Works without Special Tuning • Consistently Captures Voice Regardless of Acoustic Environment or • • • • • • the Orientation of the Handheld Device While in Use
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BR262/D
ups PURE SINE WAVE schematic diagram
3 phase ups PURE SINE WAVE schematic diagram
R262
BR262W30A103E1G
BR262W30
electret mems microphone preamplifier
BR262
WLCSP-30
BR262W26A103E1G
make three phase ups schematic diagram
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BST-BMM150-DS001-01
Abstract: BMM150
Text: Data sheet BMM150 Geomagnetic Sensor Bosch Sensortec BMM150: Data sheet Document revision 1.0 Document release date April 25 , 2013 Document number BST-BMM150-DS001-01 Technical reference code s 0 273 141 157 Notes Data in this document are preliminary and subject to change without
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BMM150
BMM150:
BST-BMM150-DS001-01
BMM150
BST-BMM150-DS001-01
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jtag samsung
Abstract: CQ 20.000 K7D321874A K7D323674A U/25/20/TN26/15/850/SAMSUNG SRAM
Text: K7D323674A K7D321874A 1Mx36 & 2Mx18 SRAM 32Mb A-die DDR SRAM Specification 153FCBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
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K7D323674A
K7D321874A
1Mx36
2Mx18
153FCBGA
jtag samsung
CQ 20.000
K7D321874A
K7D323674A
U/25/20/TN26/15/850/SAMSUNG SRAM
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ARM926
Abstract: DDR PHY ASIC LSI gigablaze serdes RC1800 LSI Rapidchip DDR1 RAM drawing rc1870 LSI Logic G12
Text: ADVANCE DATASHEET RC1800 Foundation Slice Family October 2003 DB14-000253-03 This document is advance. As such, it describes a product under development. This information is intended to help you evaluate the product. LSI Logic reserves the right to change or discontinue this proposed product without notice.
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RC1800
DB14-000253-03
DB14-000253-03,
RC1800
ARM926
DDR PHY ASIC
LSI gigablaze serdes
LSI Rapidchip
DDR1 RAM drawing
rc1870
LSI Logic G12
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gigablaze
Abstract: 11-G02 TRANSISTOR A98 0.18-um CMOS technology multiplexer data sheet LSI gigablaze LSI gigablaze serdes MIPS32 RC11XT404 lsi asic databook RC11XT432
Text: ADVANCE DATASHEET RapidChip Xtreme Platform ASIC Family July 2004 DB08-000245-00 This document is advance. As such, it describes a product under development. This information is intended to help you evaluate the product. LSI Logic reserves the right to change or discontinue this proposed product without notice.
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DB08-000245-00
DB08-000245-00,
672-Ball
896-Ball
gigablaze
11-G02
TRANSISTOR A98
0.18-um CMOS technology multiplexer data sheet
LSI gigablaze
LSI gigablaze serdes
MIPS32
RC11XT404
lsi asic databook
RC11XT432
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SMD 8PIN IC MARKING CODE 251
Abstract: No abstract text available
Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.2.00 Mar 2012 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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R50ZZ0003EJ0200
REJ11K0001-0900)
SMD 8PIN IC MARKING CODE 251
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LGA 2011 Socket diagram
Abstract: senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray
Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.1.01 Mar 2011 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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propert8175-9600,
R50ZZ0003EJ0101
REJ11K0001-0900)
LGA 2011 Socket diagram
senju laser solder wire
transistors catalog
HLQFP 176 Package drawing
FeNi42
national marking code
senju jet printer
smd transistor code 314 Weibull
SOP EIAJ TYPE II ED-7402-1
microfocus x-ray
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Untitled
Abstract: No abstract text available
Text: Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions UNIT A
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OT732-1
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underfill
Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.
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underfill
Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Text: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings
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AN-1050
AN-1035,
underfill
SILICON CONTROL RECTIFIER DETAILS
AN-1050
Aluminum alloys physical properties
Ablestik underfill
SN62 PB36 ag2 Copper
SN62 PB36 ag2
alsic 105
alsic
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Untitled
Abstract: No abstract text available
Text: IXD1602 1A, Low Input Voltage, High Speed LDO Regulator applications, which require high output current and very low power consumption at input voltages as low as 0.5 V. The IC consists of a reference voltage source, an error amplifier, a driver transistor, a soft start circuit,
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IXD1602
IXD1602
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Untitled
Abstract: No abstract text available
Text: IXD1602 1A, Low Input Voltage, High Speed LDO Regulator applications, which require high output current and very low power consumption at input voltages as low as 0.5 V. The IC consists of a reference voltage source, an error amplifier, a driver transistor, a soft start circuit,
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IXD1602
IXD1602
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201654C
Abstract: Loctite hysol
Text: DATA SHEET SE2600S: 2.4 GHz WLAN Switch/Low-Noise Amplifier Front-End Applications • IEEE802.11b DSSS WLAN • IEEE802.11g/n OFDM WLAN • Embedded systems Features • Integrates an SP3T switch and LNA with bypass mode • Gain: 12 dB • Noise Figure: 1.8 dB
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SE2600S:
IEEE802
11g/n
11-bump,
JEDEC-J-STD-020)
SE2600S
201654C
201654C
Loctite hysol
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CTX12
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET SKY85202-11: 2.4 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End Applications VBATT BT • WiFi-enabled handsets, tablets, and mobile systems System-in-Package SiP modules for embedded systems 802.11n/ac smartphones and tablets
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SKY85202-11:
11n/ac
15-bump,
JEDEC-J-STD-020)
SQ04-0074.
202933B
CTX12
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SE4110S: GPS Receiver IC Applications Product Description • The SE4110S is a highly integrated GPS receiver offering high performance and low power operation in a wide range of low-cost applications. It is particularly well suited to cellphone and high sensitivity L1-band GPS /
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SE4110S:
SE4110S
DST-00065
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor MPC8560EC Rev. 3, 07/2004 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 contains a PowerPC processor core. The MPC8560 integrates a processor that implements the PowerPC architecture with system logic required for networking, storage,
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MPC8560EC
MPC8560
MPC8560
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Bandpass filter SAW 2.4 GHz 50 Ohm
Abstract: No abstract text available
Text: DATA SHEET SE4110S: GPS Receiver IC Applications • • Product Description High sensitivity / low power GPS and A-GPS applications Portable navigation devices, mobile phones and GPS peripheral devices Telematics equipment Features
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SE4110S:
SE4110S
DST-00065
Bandpass filter SAW 2.4 GHz 50 Ohm
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Untitled
Abstract: No abstract text available
Text: MPC105EC/D Motorola Order Number 5/95 Advance Information MPC105 PCI Bridge/Memory Controller Hardware Specifications The MPC105 provides a PowerPC™ reference platform compliant-bridge between the PowerPC microprocessor family and the Peripheral Component Interconnect (PCI) bus.
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MPC105EC/D
MPC105
MPC105.
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MPC105
Abstract: DL0-DL31 DH0-DH31 Nippon capacitors "Lookaside Cache"
Text: MPC105EC/D Motorola Order Number 5/95 Advance Information MPC105 PCI Bridge/Memory Controller Hardware Specifications The MPC105 provides a PowerPC reference platform compliant-bridge between the PowerPC microprocessor family and the Peripheral Component Interconnect (PCI) bus.
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MPC105EC/D
MPC105
MPC105.
DL0-DL31
DH0-DH31
Nippon capacitors
"Lookaside Cache"
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BGA 256 PACKAGE power dissipation
Abstract: motorola transistor t75 PPC604E
Text: SA14-2054-00 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 7/96 TM Advance Information PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced
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SA14-2054-00
MPC604E9VEC/D
604eTM
PID9v-604e
604TM
MPC604e
PPC604e.
Topic20.
BGA 256 PACKAGE power dissipation
motorola transistor t75
PPC604E
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