WED3C750A8M-200BX
Abstract: No abstract text available
Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight
|
Original
|
PDF
|
WED3C750A8M-200BX
WED3C750A8M-200BX
750/SSRAM
|
SN46
Abstract: PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX
Text: White Electronic Designs WED3C750A8M-200-BX WED3C7558M-300-BX POWER PC MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPCÔ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ Final Electrical Test - 100% at maximum and
|
Original
|
PDF
|
WED3C750A8M-200-BX
WED3C7558M-300-BX
Sn46/Pb46/Bi8
835mm
EIA/JESD22
200A0004-4
200A0004-5
SN46
PB46
JESD22
A104
A108
A113
WED3C750A8M-200BX
|
Untitled
Abstract: No abstract text available
Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight
|
Original
|
PDF
|
WED3C750A8M-200BX
WED3C750A8M-200BX
750/SSRAM
|
WED3C7508M-200BX
Abstract: WED3C750A8M-200BX WEDPN8M72V-XBX
Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package WED3C750A8M Product Sheet Rev. 1 5/01 Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache
|
Original
|
PDF
|
750TM/8Mbit
WED3C750A8M
WED3C7508M-200BX
128Kx72
25x21mm,
525mm
WED3C750A
625mm2
352mm2
1329mm2
WED3C750A8M-200BX
WEDPN8M72V-XBX
|
C1B4
Abstract: No abstract text available
Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight
|
Original
|
PDF
|
WED3C750A8M-200BX
WED3C750A8M-200BX
750/SSRAM
C1B4
|
WED3C750A8M-200BX
Abstract: No abstract text available
Text: White Electronic Designs WED3C750A8M-200BX RISC Microprocessor Module OVERVIEW Maximum L2 Cache frequency = 100MHz The WEDC 750/SSRAM module is targeted for high performance, space sensitive, low power systems and supports the following power management features:
|
Original
|
PDF
|
WED3C750A8M-200BX
100MHz
750/SSRAM
66MHz
WED3C750A8M-200BX
|
WED3C750A8M
Abstract: No abstract text available
Text: WED3C750A8M-200BX RISC Microprocessor Module OVERVIEW The WEDC 750/SSRAM module is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C750A8M-200BX is offered in industrial -40°C to +85°C
|
Original
|
PDF
|
WED3C750A8M-200BX
750/SSRAM
WED3C750A8M-200BX
128Kx72
21mmx25mm,
200MHz
100MHz
66MHz
WED3C750A8M
|
WED3C750A8M-200BX
Abstract: No abstract text available
Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight
|
Original
|
PDF
|
WED3C750A8M-200BX
WED3C750A8M-200BX
750/SSRAM
|
Untitled
Abstract: No abstract text available
Text: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and
|
Original
|
PDF
|
WED3C7410E16MC-XBHX
7410E
7410E/SSRAM
WED3C7410E16M-XBX,
WED3C7558M-XBX
WED3C750A8M-200BX
WED3C7410E16MC-XBHX
63Pb/37SN)
63Sn/37Pb)
|
WED3C7410E16MC-XBHX
Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
Text: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited
|
Original
|
PDF
|
WED3C7410E16MC-XBHX
7410E
WED3C7410E16MC-XBHX
7410E/SSRAM
16Mbits
200MHz
7410E
WED3C7410E16M-XBX
WED3C750A8M-200BX
WED3C7558M-XBX
90Pb
WED3C7410E16MC
|
7410E
Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
Text: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited
|
Original
|
PDF
|
WED3C7410E16M-XBHX
7410E
WED3C7410E16M-XBHX
7410E/SSRAM
400MHz
450MHz
16Mbits
200MHz
WED3C7410E16M-XBX
WED3C750A8M-200BX
WED3C7558M-XBX
90Pb10Sn
block diagram of automatic flush system
|
7410 frequency divider
Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
Text: White Electronic Designs WED3C7410E16M-XBX RISC Microprocessor Multichip Package The WED3C7410E16M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace,
|
Original
|
PDF
|
WED3C7410E16M-XBX
WED3C7410E16M-XBX
7410E/SSRAM
7410E
400MHz
450MHz
16Mbits
7410E
7410 frequency divider
WED3C750A8M-200BX
WED3C7558M-XBX
|
MPC755
Abstract: WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX
Text: White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:
|
Original
|
PDF
|
WED3C755E8M-XBX
755E/SSRAM
WED3C755E8M-XBX
MPC755
WED3C750A8M-200BX
WED3C7558M-XBX
|
Untitled
Abstract: No abstract text available
Text: WED3C7410E16M-400BX HI-RELIABILITY PRODUCT RISC Microprocessor Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,
|
Original
|
PDF
|
WED3C7410E16M-400BX
7410E/SSRAM
WED3C7410E16M-400BX
7410E
256Kx72
21mmx25mm,
400MHz
200MHz
83MHz
|
|
|
Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C7410E16M-400BX RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight
|
Original
|
PDF
|
WED3C7410E16M-400BX
7410E/SSRAM
WED3C7410E16M-400BX
7410E
256Kx72
21mmx25mm,
400MHz
200MHz
100MHz
|
Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:
|
Original
|
PDF
|
WED3C755E8M-XBHX
755E/SSRAM
WED3C755E8M-XBHX
128Kx72
21mmx25mm,
300MHz/
150MHz,
350MHz/175MHz)
66MHz
|
7410
Abstract: 7410E WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola
Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache
|
Original
|
PDF
|
7410E
WED3C7410E16M-XBHX*
256Kx72
25x21mm,
625mm2
352mm2
1329mm2
525mm2
x64/x72
7410
WED3C7410E16M-XBHX
WED3C750A8M-200BX
WED3C7558M-XBX
90Sn10Pb
63SN 37PB
CBGA 255 motorola
|
Untitled
Abstract: No abstract text available
Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache
|
Original
|
PDF
|
7410E
WED3C7410E16M-XBHX*
256Kx72
625mm2
352mm2
1329mm2
525mm2
x64/x72
WED3C7410HITCE
|
Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3C7558M-XBX RISC Microprocessor Multichip Package OVERVIEW The WED3C7558M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems.
|
Original
|
PDF
|
755/SSRAM
WED3C7558M-XBX
128Kx72
21mmx25mm,
300MHz/
150MHz,
350MHz/175MHz)
66MHz
WED3C7558M-XBX
|
Untitled
Abstract: No abstract text available
Text: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm
|
Original
|
PDF
|
WEDPNF8M722V-XBX
8Mx72
WEDPNF8M722V-XBX
16KByte,
32KByte,
64KBytes
100MHz
100ns
|
l2-dp
Abstract: N1G4
Text: WED3C7410E16M-400BX RISC Microprocessor Multichip PPackage ackage *PRELIMINARY The WED3C7410E16M-400BX is offered in Commercial 0°C OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze,
|
Original
|
PDF
|
WED3C7410E16M-400BX
WED3C7410E16M-400BX
7410E/SSRAM
7410E
256Kx72
21mmx25mm,
400MHz
200MHz
83MHz
l2-dp
N1G4
|
3121
Abstract: 441M 9601 WEDPN4M64V-XBX 54TSOP
Text: 4M x 64 SDRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPN4M64V-XBX* Ideal for high performance processors and memory controllers see other side for typical application block diagrams • 58% space savings Compared to equivalvent TSOP solution
|
Original
|
PDF
|
WEDPN4M64V-XBX*
441mm2
125MHz)
100MHz)
75MHz)
265mm2
1060mm2
WEDPN8M65V/WEDPN8M65VR
3121
441M
9601
WEDPN4M64V-XBX
54TSOP
|
Untitled
Abstract: No abstract text available
Text: WED3C755E8MC-XBHX 755E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and
|
Original
|
PDF
|
WED3C755E8MC-XBHX
755E/SSRAM
WED3C7558MC-XBX
WED3C755E8MC-XBHX
128Kx72
|
Untitled
Abstract: No abstract text available
Text: WED3C7558M-300BX HI-RELIABILITY PRODUCT RISC Microprocessor Module ADVANCED* OVERVIEW The WED3C7558M-300BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,
|
Original
|
PDF
|
WED3C7558M-300BX
WED3C7558M-300BX
755/SSRAM
|
