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    WED3C750A Search Results

    WED3C750A Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    WED3C750A8M-200BI White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M200BM White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M-200BM White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M-200BX White Electronic Designs Processor = Motorola Powerpctm 750 Speed (MHz) = 200 Density = 8Mb Org = 128Kx72 Core Volt (V) = 2.5 Package = 255 Cbga Original PDF
    WED3C750A8M200CI White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M-200CI White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M200CM White Electronic Designs RISC Microprocessor Module Original PDF
    WED3C750A8M-200CM White Electronic Designs RISC Microprocessor Module Original PDF

    WED3C750A Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    WED3C750A8M-200BX

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C750A8M-200BX WED3C750A8M-200BX 750/SSRAM

    SN46

    Abstract: PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX
    Text: White Electronic Designs WED3C750A8M-200-BX WED3C7558M-300-BX POWER PC™ MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPCÔ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ Final Electrical Test - 100% at maximum and


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    PDF WED3C750A8M-200-BX WED3C7558M-300-BX Sn46/Pb46/Bi8 835mm EIA/JESD22 200A0004-4 200A0004-5 SN46 PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX

    Untitled

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C750A8M-200BX WED3C750A8M-200BX 750/SSRAM

    WED3C7508M-200BX

    Abstract: WED3C750A8M-200BX WEDPN8M72V-XBX
    Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package WED3C750A8M Product Sheet Rev. 1 5/01 Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache


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    PDF 750TM/8Mbit WED3C750A8M WED3C7508M-200BX 128Kx72 25x21mm, 525mm WED3C750A 625mm2 352mm2 1329mm2 WED3C750A8M-200BX WEDPN8M72V-XBX

    C1B4

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C750A8M-200BX WED3C750A8M-200BX 750/SSRAM C1B4

    WED3C750A8M-200BX

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C750A8M-200BX RISC Microprocessor Module OVERVIEW • Maximum L2 Cache frequency = 100MHz The WEDC 750/SSRAM module is targeted for high performance, space sensitive, low power systems and supports the following power management features:


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    PDF WED3C750A8M-200BX 100MHz 750/SSRAM 66MHz WED3C750A8M-200BX

    WED3C750A8M

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX RISC Microprocessor Module OVERVIEW The WEDC 750/SSRAM module is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C750A8M-200BX is offered in industrial -40°C to +85°C


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    PDF WED3C750A8M-200BX 750/SSRAM WED3C750A8M-200BX 128Kx72 21mmx25mm, 200MHz 100MHz 66MHz WED3C750A8M

    WED3C750A8M-200BX

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C750A8M-200BX WED3C750A8M-200BX 750/SSRAM

    Untitled

    Abstract: No abstract text available
    Text: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and


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    PDF WED3C7410E16MC-XBHX 7410E 7410E/SSRAM WED3C7410E16M-XBX, WED3C7558M-XBX WED3C750A8M-200BX WED3C7410E16MC-XBHX 63Pb/37SN) 63Sn/37Pb)

    WED3C7410E16MC-XBHX

    Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
    Text: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


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    PDF WED3C7410E16MC-XBHX 7410E WED3C7410E16MC-XBHX 7410E/SSRAM 16Mbits 200MHz 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC

    7410E

    Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
    Text: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


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    PDF WED3C7410E16M-XBHX 7410E WED3C7410E16M-XBHX 7410E/SSRAM 400MHz 450MHz 16Mbits 200MHz WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system

    7410 frequency divider

    Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
    Text: White Electronic Designs WED3C7410E16M-XBX RISC Microprocessor Multichip Package The WED3C7410E16M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace,


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    PDF WED3C7410E16M-XBX WED3C7410E16M-XBX 7410E/SSRAM 7410E 400MHz 450MHz 16Mbits 7410E 7410 frequency divider WED3C750A8M-200BX WED3C7558M-XBX

    MPC755

    Abstract: WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX
    Text: White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


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    PDF WED3C755E8M-XBX 755E/SSRAM WED3C755E8M-XBX MPC755 WED3C750A8M-200BX WED3C7558M-XBX

    Untitled

    Abstract: No abstract text available
    Text: WED3C7410E16M-400BX HI-RELIABILITY PRODUCT RISC Microprocessor Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles,


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    PDF WED3C7410E16M-400BX 7410E/SSRAM WED3C7410E16M-400BX 7410E 256Kx72 21mmx25mm, 400MHz 200MHz 83MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C7410E16M-400BX RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WED3C7410E16M-400BX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C7410E16M-400BX 7410E/SSRAM WED3C7410E16M-400BX 7410E 256Kx72 21mmx25mm, 400MHz 200MHz 100MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


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    PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz

    7410

    Abstract: 7410E WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola
    Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache


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    PDF 7410E WED3C7410E16M-XBHX* 256Kx72 25x21mm, 625mm2 352mm2 1329mm2 525mm2 x64/x72 7410 WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola

    Untitled

    Abstract: No abstract text available
    Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache


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    PDF 7410E WED3C7410E16M-XBHX* 256Kx72 625mm2 352mm2 1329mm2 525mm2 x64/x72 WED3C7410HITCE

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C7558M-XBX RISC Microprocessor Multichip Package OVERVIEW The WED3C7558M-XBX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems.


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    PDF 755/SSRAM WED3C7558M-XBX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz WED3C7558M-XBX

    Untitled

    Abstract: No abstract text available
    Text: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm


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    PDF WEDPNF8M722V-XBX 8Mx72 WEDPNF8M722V-XBX 16KByte, 32KByte, 64KBytes 100MHz 100ns

    l2-dp

    Abstract: N1G4
    Text: WED3C7410E16M-400BX RISC Microprocessor Multichip PPackage ackage *PRELIMINARY The WED3C7410E16M-400BX is offered in Commercial 0°C OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze,


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    PDF WED3C7410E16M-400BX WED3C7410E16M-400BX 7410E/SSRAM 7410E 256Kx72 21mmx25mm, 400MHz 200MHz 83MHz l2-dp N1G4

    3121

    Abstract: 441M 9601 WEDPN4M64V-XBX 54TSOP
    Text: 4M x 64 SDRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPN4M64V-XBX* Ideal for high performance processors and memory controllers see other side for typical application block diagrams • 58% space savings Compared to equivalvent TSOP solution


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    PDF WEDPN4M64V-XBX* 441mm2 125MHz) 100MHz) 75MHz) 265mm2 1060mm2 WEDPN8M65V/WEDPN8M65VR 3121 441M 9601 WEDPN4M64V-XBX 54TSOP

    Untitled

    Abstract: No abstract text available
    Text: WED3C755E8MC-XBHX 755E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and


    Original
    PDF WED3C755E8MC-XBHX 755E/SSRAM WED3C7558MC-XBX WED3C755E8MC-XBHX 128Kx72

    Untitled

    Abstract: No abstract text available
    Text: WED3C750A HI-REÜA8IUTY PBÛÔUCï RISC Microprocessor Module PRELIMINARY* OVERVIEW T h e W E D 3 C 7 5 0 A is offered in industrial - 4 0 ° C t o + 8 5 ° C and m ilitary T h e W E D C 7 5 0 / S S R A M m odule is ta rg e te d fo r high perfo rm ance,


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    PDF WED3C750A