WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
|
Original
|
PDF
|
11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
|
bcr20
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
|
Original
|
PDF
|
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
bcr20
|
Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.
|
Original
|
PDF
|
MIL-STD-883,
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
|
Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
|
Original
|
PDF
|
11-Mar-11
|
WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
|
Original
|
PDF
|
18-Jul-08
WBCR02750000F
BCR50000FKAHWS
|
