photolithography
Abstract: No abstract text available
Text: Wafer Fab Capability Wafer Loading: Automated wafer loading throughout the Fab prevents handling-induced mechanical damage. Ion Implant: State-of-the-art high current implanter capable of the full range of dose requirements. Wafer Cleaning: Semi-automated wafer
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AMS130-2
150mm
ISO9000
QS9000
photolithography
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TGC3000
Abstract: wafer fab control plan ASIC TGC2000 Qual wafer fab control TEXAS INSTRUMENTS, die attach TGB2000 F642790
Text: ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time “GENERIC” QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer Fab Locations Wafer Fab Processes Texas Instruments - ASIC CQE Qual By Similarity
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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PI6CV857A
Ablebond 84-1*SR4
z9925
EIAJ ED-4701
MARK A48
857L
TSMC 0.35um
Volt, SPDM, CMOS
98068A
0.6 um cmos process
ablebond 84-1lmisr4
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TSMC 0.35um
Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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Precon
Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication
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150mm
125mm
DiH20Rn
260deg
Precon
857916
ACT245
EN-4088Z
SN74ACT245N
EPIC-1S
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EPIC-1S
Abstract: WAFER SN74ACT245 wafer fab control plan
Text: TEXAS INSTRUMENTS Initial Notification for the Planned 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab December 8, 1998 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB plans to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication technology. The product
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150mm
125mm
SN74ACT245
60sec
EPIC-1S
WAFER
wafer fab control plan
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508 531 02 48
Abstract: SN74ABT2245
Text: TEXAS INSTRUMENTS Final Notification for the 200mm Diameter Wafer Qualification of the Freising, Germany Wafer Fab June 27, 1997 Abstract As previously notified in May by PCN 5300, the Texas Instruments Wafer Fabrication Facility in Freising, Germany FFAB has qualified the convertion of the wafer diameter from 150mm to 200mm
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200mm
150mm
200mm
150mm,
508 531 02 48
SN74ABT2245
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CARSEM
Abstract: 225E-01 0.5um ICC03290 MP8000C 84-1-lmis-r4 tsmc cmos model tsmc Activation Energy HRS100
Text: Reliability Engineering Tucson Corporation Analytical Services Qualification Description: Qualify new model. Model: RA: PA: Date: Die Name: Die Size: Mask Revision: Wafer Fab Site: Process: Technology: Metal 1: Metal 2: Metal 3: Passivation: HTOL assem/wafer/lot :
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TMP121AIDBV
ICC03290
CARSEM
225E-01
0.5um
ICC03290
MP8000C
84-1-lmis-r4
tsmc cmos model
tsmc Activation Energy
HRS100
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triac phase control motor
Abstract: versatile power supply applications U211B triac control pir sensor 3-phase motor triac DC permanent magnet motors Phase Control Circuit for Industrial Applications zero crossing switch Industrial DC Motor U211B
Text: TEMIC Semiconductors Industrial Segment Battery Charge Phase Control Identification Zero Crossing Switches Industrial S More than 15 years of industrial expertise S State-of-the-art wafer fab and packaging facilities S Rugged 30 V and high-density 16 V technology
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U217B
U2102B
triac phase control motor
versatile power supply applications
U211B triac control
pir sensor
3-phase motor triac
DC permanent magnet motors
Phase Control Circuit for Industrial Applications
zero crossing switch
Industrial DC Motor
U211B
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mems
Abstract: biomedical medical mems
Text: Investor Contacts: Geraldine Hench Vice President - Finance 408 432-8888 For Immediate Release Michele Katz/Michael Polyviou/ Elric Martinez Morgen-Walke Associates 212-850-5600 XICOR SIGNS DEFINITIVE AGREEMENT WITH STANDARD MEMS TO SELL MILPITAS WAFER FAB
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toshiba mcp nand
Abstract: toshiba mcp GBNAND 2Gb NAND FLASH Toshiba MEP core MCP Technology Trend toshiba psram MCP 1Gb toshiba 512Mb TOSHIBA flash memory -NAND sd controller
Text: EYE 07 July 2006 TOSHIBA SEMICONDUCTOR BULLETIN EYE VOLUME 168 CONTENTS INFORMATION Kaga Toshiba to Build New 200mm Wafer-based Production Fab 2 Toshiba and ARC Collaborate to Grow Industry Adoption of Configurable Processor Technology Worldwide .3
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200mm
toshiba mcp nand
toshiba mcp
GBNAND
2Gb NAND FLASH Toshiba
MEP core
MCP Technology Trend
toshiba psram
MCP 1Gb toshiba 512Mb
TOSHIBA flash memory -NAND
sd controller
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MS-6G
Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :
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Z200-PCN-PA20070101
14X20MM
14X14MM
G600F)
48LQFP
SB5627
W6694ACD
SB5627001
MS-6G
ms-7g
sa5522
SUMITOMO g600f
W83303D
w99682bcdg
W55U01-A2
ms 6g
w89c35d
g600f
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Zener Diode SOT-23 929b
Abstract: 13.8 8w zener diode zener diode t5 MMSZ4V7T1 MOTOROLA 929B 953b X2 diode zener zener diode T3 Marking diodes zener de 3.5 volts 938B
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL DATA 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona
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OT-23
03A-03
Zener Diode SOT-23 929b
13.8 8w zener diode
zener diode t5
MMSZ4V7T1
MOTOROLA 929B
953b
X2 diode zener
zener diode T3 Marking
diodes zener de 3.5 volts
938B
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SOT-23 marking 77
Abstract: SOT-23 marking Z1 zener y21 zener y11 BZX84C2V4LT1 BZX84C2V7LT1 BZX84C3V0LT1 BZX84C3V3LT1 BZX84C30LT1 motorola BZX84C3V9LT1
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA BZX84C2V4LT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona
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BZX84C2V4LT1
OT-23
OT-23
SOT-23 marking 77
SOT-23 marking Z1
zener y21
zener y11
BZX84C2V4LT1
BZX84C2V7LT1
BZX84C3V0LT1
BZX84C3V3LT1
BZX84C30LT1 motorola
BZX84C3V9LT1
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biomedical
Abstract: biomedical sensors mems
Text: Investor Contacts: Geraldine Hench Vice President - Finance 408 432-8888 For Immediate Release Michele Katz/Michael Polyviou/ Elric Martinez Morgen-Walke Associates 212-850-5600 XICOR COMPLETES SALE OF MILPITAS WAFER FAB TO STANDARD MEMS * Xicor now a fabless semiconductor company
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Y1 SOT-23
Abstract: 338 sot-23 SOT-23 marking 77 y6 sot-23 BZX84C12LT1 SOT-23 marking y1 z7 sot-23 marking 638 sot-23 marking Z2 sot23 Z16 SOT23
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL DATA 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona
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OT-23
OT-23
Y1 SOT-23
338 sot-23
SOT-23 marking 77
y6 sot-23
BZX84C12LT1
SOT-23 marking y1
z7 sot-23 marking
638 sot-23
marking Z2 sot23
Z16 SOT23
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Untitled
Abstract: No abstract text available
Text: For Immediate Release CYPRESS EXPANDS MINNESOTA WAFER FAB TO MEET INCREASING DEMAND Ramp Of 0.21- and 0.16-Micron Lines, Addition of 150 People Geared to Double Capacity, Boost Revenues Beyond $1 Billion Mark BLOOMINGTON, Minnesota…February 25, 2000 - Cypress Semiconductor Minnesota Inc. CMI
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16-Micron
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plc siemens
Abstract: tyne
Text: Manufacturing Welcome to North Tyneside Siemens’ long-term strategy of globalizing semiconductor production will reach a new milestone on May 23 with the royal opening of its £1.1 billion wafer fab near Newcastle-upon-Tyne in northeast England. lobalization in the semiconductor
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320F2812PGFA
Abstract: tms dsp 320F2812PGFA 320f2811pbka 320F2810PBKA TI TMS F2812 ti part naming convention TMS320F281x TMS320F2812 CC BGA 320F2811PBKQ 1833c05
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20040226002 Title: TMS320F281X Digital Controller Additional Wafer Fab and Silicon Revision Change Final Change Notification / Sample Request Dear Customer: This is an initial announcement of change to a device that is currently offered by Texas Instruments. The
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TMS320F281X
320F2811PBKA
320F2811PBKS
320F2811PBKQ
320F2812PGFA
320F2812PGFQ
320F2812GHHA
320F2812GHHQ
320F2810PBKA
320F2810PBKQ
320F2812PGFA
tms dsp 320F2812PGFA
320f2811pbka
320F2810PBKA
TI TMS F2812
ti part naming convention
TMS320F2812 CC BGA
320F2811PBKQ
1833c05
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resistor 1k
Abstract: 30X30
Text: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 1.2µm CMOS Process Standard Features ❖ ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters UT1X Stepper Single or double poly
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30X30)
resistor 1k
30X30
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44CR80S
Abstract: Smart 700 SIEMENS ford siemens 1120 siemens relays Siemens SLE "electronic purse"
Text: SPECTRUM North Tyneside wafer fab forges ahead: From ships to chips The new £1.1 billion $1.8 billion microchip plant being built by Siemens Microelectronics Ltd at North Tyneside in northeast England reached a new milestone on February 15 with the first integrated run on
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44CR80S
Smart 700 SIEMENS
ford
siemens 1120
siemens relays
Siemens SLE
"electronic purse"
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404-011
Abstract: dmb2856 404002
Text: Silicon Beam-Lead and Chip EHAlpha Schottky Barrier Mixer Diodes DMB, DME, DMF and DMJ Series Features • Ideal for MIC ■ Low 1/f Noise ■ Low Intermodulation Distortion ■ Low Turn On ■ Hermetically Sealed Packages ■ SPC Controlled Wafer Fab Description
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DMB2853
DMB2854
DMB2855
DMB2856
404-011
404002
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MARKING ZE SOT-23
Abstract: LTA 703 S marking ar sot-23 212 s sot-23 Y1 SOT-23 TVS marking LZ ON
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA BZX84C2V4LT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes u Manufacturing Locations: 3 1 Cathode Anode WAFER FAB: Phoenix, Arizona
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OT-23
BZX84C2V4LT1
OT-23
MARKING ZE SOT-23
LTA 703 S
marking ar sot-23
212 s sot-23
Y1 SOT-23
TVS marking LZ ON
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MARKING 43 SOT23 REGULATOR
Abstract: MARKING ZE SOT-23 TVS in SOT-23 marking 8A sot-23 8k sot 23 marking 8Y SOT23 8J SOT23 8C SOT-23 8c SOT 23 marking 46 sot-23
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MMBZ5221BLT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes u Manufacturing Locations: 3 1 Cathode Anode WAFER FAB: Phoenix, Arizona
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OT-23
MMBZ5221BLT1
OT-23
MARKING 43 SOT23 REGULATOR
MARKING ZE SOT-23
TVS in SOT-23
marking 8A sot-23
8k sot 23 marking
8Y SOT23
8J SOT23
8C SOT-23
8c SOT 23
marking 46 sot-23
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