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    Vishay Dale CW00110R00JE70

    RES 10 OHM 5% AXIAL
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    DigiKey CW00110R00JE70 Cut Tape 1,958 1
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    Vishay Dale CW001100R0JE70

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    CW001100R0JE70 Cut Tape 953 1
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    New Advantage Corporation CW001100R0JE70 2,000 1
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    Vishay Dale CW00110R00JE12

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    DigiKey CW00110R00JE12 Bulk 298 1
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    NEXCOM 10W00110009X0

    Fanless Edge Computing System
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    Vishay Dale CW00115R00JE70

    RES 15 OHM 5% AXIAL
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    W0011 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz


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    PDF 66AK2E05, 66AK2E02 SPRS865Bâ 66AK2E05/02 Cortex-A15 Cortex-A15 TMS320C66xâ

    Untitled

    Abstract: No abstract text available
    Text: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15


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    PDF AM5K2E04, AM5K2E02 SPRS864Bâ AM5K2E04/02 Cortex-A15 Cortex-A15

    Untitled

    Abstract: No abstract text available
    Text: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15


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    PDF AM5K2E04, AM5K2E02 SPRS864Bâ AM5K2E04/02 Cortex-A15 Cortex-A15

    SPRS836D

    Abstract: No abstract text available
    Text: TCI6638K2K SPRS836D—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6638K2K Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core


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    PDF TCI6638K2K SPRS836Dâ TCI6638K2K TMS320C66xâ 1024K SPRS836D

    W0901

    Abstract: W0914 W0915 W090E W0011 W000A w0006 CA850 ID850QB RX850
    Text: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社


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    PDF CA850 U18515JJ1V0UM001 U18515JJ1V0UM U18515JJ1. W0901 W0914 W0915 W090E W0011 W000A w0006 ID850QB RX850

    U18515EJ1V0UM00

    Abstract: W0005 CA850 ID850QB RX850 SM850 W0901 ld850 W090D
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF

    60K6

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


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    PDF 66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 60K6

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


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    PDF 66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15

    Untitled

    Abstract: No abstract text available
    Text: TCI6636K2H SPRS835F—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6636K2H Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core


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    PDF TCI6636K2H SPRS835Fâ TCI6636K2H TMS320C66xâ 1024K

    Untitled

    Abstract: No abstract text available
    Text: TCI6630K2L SPRS893B—June 2013—Revised March 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6630K2L Features and Description 1.1 Features • ARM CorePac – Two ARM Cortex -A15 MPCore™ Processors at Up To 1.4 GHz – 1MB L2 Cache Memory Shared by Two ARM Cores


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    PDF TCI6630K2L SPRS893Bâ TCI6630K2L

    MRF24XA

    Abstract: PCB Antenna matching carrier frequency offset estimation
    Text: MRF24XA Low-Power, 2.4 GHz ISM-Band IEEE 802.15.4 RF Transceiver with Extended Proprietary Features Features Low-Power • IEEE 802.15.4™-2003 and IEEE 802.15.4-2006 Standard Compliant RF transceiver • Multiple air data rates: - 250 kbps IEEE 802.15.4


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    PDF MRF24XA 4TM-2003 DS70005023B-page MRF24XA PCB Antenna matching carrier frequency offset estimation

    I211

    Abstract: transistor manual substitution sl 100 zilog 1648 intel 4040 Z380 W0005 w0006 Z180 Z893XX Z89C00
    Text: Zilog Macro Cross Assembler User’s Manual UM003601-COR1299 1999 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A


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    PDF UM003601-COR1299 95/98/NT. Glossary-11 Glossary-12 Glossary-13 I211 transistor manual substitution sl 100 zilog 1648 intel 4040 Z380 W0005 w0006 Z180 Z893XX Z89C00

    w001-0411-00x-z

    Abstract: No abstract text available
    Text: P.C.B LAYOUT ELECTRICAL: CURRENT RATING: 1.0 AC/DC VOLTAGE RATING: AC 250V R.M.S. INSULATION RESISTANCE: 1000 MEGOHMS MIN. DIELECTRIC WITHSTANDING VOLTAGE: AC 500V (R.M.S) MATERIAL: INSULATOR: NYLON 66 (UL94V-2) CONTACT: COPPER ALLOY PLATING: 100u" MIN. TIN/LEAD OVER NICKEL ALL OVER


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    PDF UL94V-2) W001-1 W001-0411-00X-Z w001-0411-00x-z

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H12/06 SPRS866D—November 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H12/06 Features and Description 1.1 Features • Eight (66AK2H12) or Four (66AK2H06) TMS320C66x


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    PDF 66AK2H12/06 SPRS866Dâ 66AK2H12/06 66AK2H12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original
    PDF 66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15

    w001-0412-00x-z

    Abstract: W0011
    Text: ELECTRICAL: CURRENT RATING: 1.0 AC/DC VOLTAGE RATING: AC 250V R.M.S. INSULATION RESISTANCE: 1000 MEGOHMS MIN. DIELECTRIC WITHSTANDING VOLTAGE: AC 500V (R.M.S) MATERIAL: INSULATOR: NYLON 66 (UL94V-2) CONTACT: COPPER ALLOY PLATING: 100u" MIN. TIN/LEAD OVER NICKEL ALL OVER


    Original
    PDF UL94V-2) W001-1 W001-0412-00X-Z w001-0412-00x-z W0011

    Untitled

    Abstract: No abstract text available
    Text: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz


    Original
    PDF 66AK2E05, 66AK2E02 SPRS865Bâ 66AK2E05/02 Cortex-A15 Cortex-A15 TMS320C66xâ

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original
    PDF 66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


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    PDF 66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15

    automotive ecu manual

    Abstract: mpc 2907 osek standard 05H12 HC12 MC68HC MC68HC16 A5S30 HC12D60
    Text: User’s Manual Rev. 1.2 May 19, 1999 A G R E E M E N T OSEK Operating System N O N - D I S C L O S U R E HC12 R E Q U I R E D OSEK Operating System Rev. 1.2 N O N - D I S C L O S U R E A G R E E M E N T R E Q U I R E D User’s Manual Motorola reserves the right to make changes without further notice to


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    PDF

    e0052

    Abstract: zilog zds 3.68 z8 zilog F0009 E0053 E0094 E0078 w0006 E0000 zconvert
    Text: ZILOG MACRO CROSS ASSEMBLER APPENDIX B UTILITIES DESCRIPTION ZFIXUP The ZFIXUP utility is a simple DOS-based program that does ‘address fixups’ on assembly language listing files generated by relocatable assemblers such as ZMASM. The normal listing file contains relative addresses base zero only, since the final execution address is not determined until


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    PDF 95/98/NT. UM003601-COR1299 Glossary-11 Glossary-12 Glossary-13 e0052 zilog zds 3.68 z8 zilog F0009 E0053 E0094 E0078 w0006 E0000 zconvert

    HY5116100B

    Abstract: 1AD41-00-MAY95 HY5116100
    Text: ' • H Y U N D A H Y 5 1 1 6 1 0 0 B S e r ie s 16Mx 1-bit CMOS DRAM I DESCRIPTION The H Y 5116100B is the new generation and fast dynam ic R A M organized 16,777,216 x 1-bit. T h e H Y 5 1 1 6 1 0 0 B utilizes H yundai’s C M O S silicon gate process technology a s well a s advanced circuit techniques to provide w ide


    OCR Scan
    PDF HY5116100B 16Mx1 HY5116100Bis TheHY5116100B 4b750Ã 300435b 1AD41-00-MAY9S HY5116100BJ 1AD41-00-MAY95 HY5116100