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    ULTRA FINE PITCH BGA Search Results

    ULTRA FINE PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LBUA5QJ2AB-828 Murata Manufacturing Co Ltd QORVO UWB MODULE Visit Murata Manufacturing Co Ltd
    LBUA5QJ2AB-828EVB Murata Manufacturing Co Ltd QORVO UWB MODULE EVALUATION KIT Visit Murata Manufacturing Co Ltd
    LXMSJZNCMH-225 Murata Manufacturing Co Ltd Ultra small RAIN RFID chip tag Visit Murata Manufacturing Co Ltd
    LXMS21NCMH-230 Murata Manufacturing Co Ltd Ultra small RAIN RFID chip tag Visit Murata Manufacturing Co Ltd
    CO-213UHFMX20-005 Amphenol Cables on Demand Amphenol CO-213UHFMX20-005 UHF (PL-259) Male to UHF (PL-259) Male (RG213) 50 Ohm Coaxial Cable Assembly (High-Power / Low-Loss) 5 ft Datasheet

    ULTRA FINE PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ultra fine pitch BGA

    Abstract: C49B 22-N-4
    Text: HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawinski graduated from Worcester Polytechnic Institute with a BSEE in 1978 and


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    TN1074

    Abstract: solder mask FTBGA FPBGA ultra fine pitch BGA ball grid array image BGA NSMD ball pcb design 0,5 mm pitch Ultra Chip
    Text: PCB Layout Recommendations for BGA Packages May 2009 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular, it is important to understand how they are affected by various board layout techniques. This document provides a brief overview of PCB layout considerations


    Original     		PDF TN1074 TN1074 solder mask FTBGA FPBGA ultra fine pitch BGA ball grid array image BGA NSMD ball pcb design 0,5 mm pitch Ultra Chip

    IPC-9701

    Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
    Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the


    Original     		PDF MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701"

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    toshiba laptop battery pack pinout

    Abstract: GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM
    Text: 4 volume 4 A publication of IBM Microelectronics IBM Helps Juniper Networks Produce Revolutionary Internet Backbone Router Nancy Adinolfe, R. K. Anand, and Alison Seaman In This Issue Introduction Fourth Quarter 1998, Vol. 4, No.4 1 IBM Helps Juniper Networks Produce


    Original     		PDF 64-bit S/390TM 256-Mb 60-micron 10-mil toshiba laptop battery pack pinout GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM

    Untitled

    Abstract: No abstract text available
    Text: iCE40 HX-Series Ultra Low-Power mobileFPGA™ Family R SiliconBlue December 15, 2011 1.1 Preliminary Data Sheet Figure 1: iCE40 HX-Series Family Architectural Features  HX-Series - Tablet targeted series optimized for high performance Low cost package offerings


    Original     		PDF iCE40â iCE40 iCE65 iCEman40HX iCE40HX 15-DEC-2011)

    FtBGA

    Abstract: 256-FTBGA 132csBGA ispMACH 4A5 132-ucBGA 1048E 484-fpBGA TQFP 132 PACKAGE ispMACH 4A3 POWR607
    Text: LEAD-FREE AND HALOGEN-FREE PACKAGING FROM LATTICE RoHS Compliant Packaging Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment.


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    TXS0108

    Abstract: CSB703 CCIR656 OMAP3530 S29GL512N CSB909
    Text: Cogent Computer Systems, Inc. COGENT 17 Industrial Drive, Smithfield RI 02917 tel: 401-349-3999, fax: 401-349-3998, web: www.cogcomp.com "ALWAYS COMPLETE" CSB740 ­ 600Mhz OMAP3530 SODIMM SOM The CSB740, designed, developed and manufactured by Cogent Computer Systems, Inc., is a


    Original     		PDF CSB740 600Mhz OMAP3530 CSB740, CSB740 ICache/16KB 256KB CSB703 TXS0108 CCIR656 S29GL512N CSB909

    Xilinx usb cable Schematic

    Abstract: DS-KIT-95XL SPARTAN-II xc2s200 pq208 DS-KIT-95XL-XPLA3-PAK COOLRUNNER-II examples DS-KIT-2S300E XC9572XL DS-KIT-95XL-PAK DS-KIT-2C64 XcxxX
    Text: Xilinx IQ Solutions – Architecting Automotive Intelligence In-car electronics content is increasing at a phenomenal rate and includes such applications as navigation systems, entertainment systems, and communications devices. To address the needs of telematic designers


    Original     		PDF QS9000 Xilinx usb cable Schematic DS-KIT-95XL SPARTAN-II xc2s200 pq208 DS-KIT-95XL-XPLA3-PAK COOLRUNNER-II examples DS-KIT-2S300E XC9572XL DS-KIT-95XL-PAK DS-KIT-2C64 XcxxX

    CY62157CV18

    Abstract: CY62157DV20 CY62157DV20L-55BVI ultra fine pitch BGA
    Text: CY62157DV20 MoBL2 8M 512K x 16 Static RAM Features • • • • • • • • • Very high speed: 55 ns Wide voltage range: 1.65V to 2.2V Pin compatible with CY62157CV18 Ultra low active power — Typical active current: 1 mA @ f = 1 MHz — Typical active current: 10 mA @ f = fmax


    Original     		PDF CY62157DV20 CY62157CV18 48-ball CY62157DV20 CY62157CV18 CY62157DV20L-55BVI ultra fine pitch BGA

    CY62148DV30LL-70BVXI

    Abstract: CY62148DV30L-55ZSXI CY62148CV25 CY62148CV30 CY62148CV33 CY62148DV30 CY62148DV30L CY62148DV30LL
    Text: CY62148DV30 4-Mb 512K x 8 MoBL Static RAM Functional Description[1] Features • Very high speed: 55 ns — Wide voltage range: 2.20V – 3.60V • Pin-compatible with CY62148CV25, CY62148CV30 and CY62148CV33 • Ultra low active power — Typical active current: 1.5 mA @ f = 1 MHz


    Original     		PDF CY62148DV30 CY62148CV25, CY62148CV30 CY62148CV33 55-ns 36-ball 32-pin CY62148DV30 CY62148DV30LL-70BVXI CY62148DV30L-55ZSXI CY62148CV25 CY62148CV33 CY62148DV30L CY62148DV30LL

    CY62157CV18

    Abstract: CY62157DV20 CY62157DV20L-55BVI ultra fine pitch BGA BV48A
    Text: CY62157DV20 MoBL2 8M 512K x 16 Static RAM Features • • • • • • • • • Very high speed: 55 ns Wide voltage range: 1.65V to 2.2V Pin compatible with CY62157CV18 Ultra low active power — Typical active current: 1 mA @ f = 1 MHz — Typical active current: 10 mA @ f = fmax


    Original     		PDF CY62157DV20 CY62157CV18 48-ball CY62157DV20 CY62157CV18 CY62157DV20L-55BVI ultra fine pitch BGA BV48A

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


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    CY62138CV25

    Abstract: CY62138CV30 CY62138CV33 CY62138V
    Text: MoBL CY62138CV25/30/33 MoBL 2M 256K x 8 Static RAM Features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has an automatic power-down feature that significantly reduces power consumption


    Original     		PDF CY62138CV25/30/33 CY62138CV25: CY62138CV30: CY62138CV33: CY62138V CY62138CV25/30/33 CY62138CV25 CY62138CV30 CY62138CV33 CY62138V

    CY62148CV25

    Abstract: CY62148CV30 CY62148CV33 CY62148V BA36B
    Text: CY62148CV25/30/33 MoBL 512K x 8 MoBL Static RAM Features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ MoBL™ in portable applications such as cellular telephones. The device also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can be put into standby mode when deselected (CE HIGH).


    Original     		PDF CY62148CV25/30/33 CY62148CV25: CY62148CV30: CY62148CV25/30/33 CY62148CV25 CY62148CV30 CY62148CV33 CY62148V BA36B

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V
    Text: 38CV25/30/3 CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


    Original     		PDF 38CV25/30/3 CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: EnablY62138CV CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V ultra fine pitch BGA
    Text: CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


    Original     		PDF CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V ultra fine pitch BGA

    CY62138CV

    Abstract: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V
    Text: CY62138CV25/30/33 MoBL CY62138CV MoBL® 2M 256K x 8 Static RAM Features bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL®) in portable applications. The device also has


    Original     		PDF CY62138CV25/30/33 CY62138CV CY62138CV25: CY62138CV30: CY62138CV33: CY62138CV25 CY62138CV25LL CY62138CV30 CY62138CV30LL CY62138CV33 CY62138V

    siliconblue

    Abstract: ice40lp 245KB sublvds lvds ICE65 sub-lvds iCE40LP8K-CM225 ICE40LP1K
    Text: iCE40 LP Series Ultra Low-Power mobileFPGA™ Family R SiliconBlue December 15, 2011 1.1 Preliminary Data Sheet Figure 1: iCE40 LP-Series Family Architectural Features  LP-Series - Smartphone targeted series Programmable Logic Block (PLB) optimized for low power


    Original     		PDF iCE40TM iCE65 iCE40 15-DEC-2011) siliconblue ice40lp 245KB sublvds lvds sub-lvds iCE40LP8K-CM225 ICE40LP1K

    Untitled

    Abstract: No abstract text available
    Text: CY62147DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH or both BLE and BHE are HIGH). The


    Original     		PDF CY62147DV30 I/O15) CY62147CV25, CY62147CV30, CY62147CV33 70-ns 45-ns 44-lead

    CY62146CV30

    Abstract: CY62146DV30 CY62146DV30L
    Text: CY62146DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through


    Original     		PDF CY62146DV30 I/O15) CY62146CV30 CY62146DV30 45-ns 44-lead CY62146CV30 CY62146DV30L

    CY62146CV30

    Abstract: CY62146DV30 CY62146DV30L
    Text: CY62146DV30 4-Mbit 256K x 16 Static RAM Features an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through


    Original     		PDF CY62146DV30 I/O15) CY62146CV30 CY62146DV30 45-ns 44-lead CY62146CV30 CY62146DV30L

    Untitled

    Abstract: No abstract text available
    Text: THIS SPEC IS OBSOLETE Spec No: 38-05339 Spec Title: CY62146DV30 MoBL R 4-Mbit (256K x 16) Static RAM Sunset Owner: Anuj Chakrapani (AJU) Replaced by: None CY62146DV30 MoBL 4-Mbit (256K x 16) Static RAM Features an automatic power-down feature that significantly reduces


    Original     		PDF CY62146DV30 I/O15)

    SSOP16

    Abstract: UDA1324TS
    Text: INTEGRATED CIRCUITS DATA SHEET UDA1324TS Ultra low-voltage stereo filter DAC Product specification Supersedes data of 2000 Jan 20 File under Integrated Circuits, IC01 2001 Mar 27 Philips Semiconductors Product specification Ultra low-voltage stereo filter DAC


    Original     		PDF UDA1324TS 256fs, 384fs 512fs 256fs 753503/04/pp20 SSOP16 UDA1324TS