Untitled
Abstract: No abstract text available
Text: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via
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PA29F-S4-TS
Socket/32
29Fx00
29F200
29F400
29F0x0.
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A6 TSOP-6 MARKING
Abstract: No abstract text available
Text: S29AL016D 16 Megabit 2 M x 8-Bit/1 M x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Datasheet ADVANCE INFORMATION Distinctive Characteristics Architectural Advantages Package Options Single power supply operation 48-ball FBGA 48-pin TSOP — Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications
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S29AL016D
16-Bit)
48-ball
48-pin
200nm
Am29LV160D
MBM29LV160E
S29AL016D
A6 TSOP-6 MARKING
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Untitled
Abstract: No abstract text available
Text: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64359// 6169#97.ð49#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA
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44-pin
48-ball
AS7C181026LL)
AS7C251026LL)
AS7C31026LL-100TI
AS7C31026LL-55BC
AS7C31026LL-70BC
AS7C31026LL-100BC
AS7C31026LL-55BI
AS7C31026LL-70BI
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CQM1-ID212
Abstract: No abstract text available
Text: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWORZSRZHU&02665$0 HDWXUHV • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA • Center power and ground pins for low noise • ESD protection ≥ 2000 volts
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44-pin
48-ball
AS7C251026LL)
AS7C31026LL)
AS7C181026LL-55BC
AS7C181026LL-70BC
AS7C181026LL-100BC
AS7C181026LL-55BI
AS7C181026LL-70BI
AS7C181026LL-100BI
CQM1-ID212
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Untitled
Abstract: No abstract text available
Text: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • JEDEC registered packaging - 32-pin TSOP package - 48-ball 8mm x 6mm CSP BGA • ESD protection ≥ 2000 volts
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32-pin
48-ball
AS7C181024LL)
AS7C31024LL)
AS7C251024LL-55TC
AS7C251024LL-70TC
AS7C251024LL-100TC
AS7C251024LL-55TI
AS7C251024LL-100TI
AS7C251024LL-70BC
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Untitled
Abstract: No abstract text available
Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA
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44-pin
48-ball
AS7C181026LL)
AS7C31026LL)
026LL-100TC
AS7C251026LL-55TI
AS7C251026LL-70TI
AS7C251026LL-100TI
AS7C251026LL-55BC
AS7C251026LL-70BC
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Untitled
Abstract: No abstract text available
Text: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.
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PA48-40-1TS
socket/40
E28F200CV/400CV
E28F200CR/
40DIP
E28F400CR/
E28F800CR/
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29f800 29f400
Abstract: No abstract text available
Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP
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PA48TS29F
socket/44
29F100
29F200
29F400
29F800
29f800 29f400
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29F800 equivalent
Abstract: No abstract text available
Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP
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PA48TS29F-800
socket/44
PA48TS29F
29F800
29F800
29F100,
29F800 equivalent
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ddr 3 tsop
Abstract: TSOP 56 LAYOUT TSOP 66 Package
Text: 128 Megabit CMOS DDR SDRAM DPDD16MX8RSBY5 DESCRIPTION: The 128 Megabit LP-StackTM module DPDD16MX8RSBY5, based on 64 Mbit devices, has been designed to fit the same footprint as the 8 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or
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DPDD16MX8RSBY5
DPDD16MX8RSBY5,
A0-A11
30A223-10
53A001-00
ddr 3 tsop
TSOP 56 LAYOUT
TSOP 66 Package
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udqs
Abstract: No abstract text available
Text: 512 Megabit CMOS DDR SDRAM DPDD32MX16WSCY5 ADVANCED INFORMATION DESCRIPTION: The 512 Megabit LP-Stack modules DPDD32MX16WSCY5, based on 256 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 16 DDR SDRAM TSOP monolithic. This allows for
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DPDD32MX16WSCY5
DPDD32MX16WSCY5,
53A001-00
30A249-00
udqs
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Untitled
Abstract: No abstract text available
Text: 512 Megabit CMOS DDR SDRAM DPDD64MX8WSBY5 DESCRIPTION: The 512 Megabit LP-StackTM module DPDD64MX8WSBY5, based on 256 Mbit devices, has been designed to fit the same footprint as the 32 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or
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DPDD64MX8WSBY5
DPDD64MX8WSBY5,
53A001-00
30A249-00
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Untitled
Abstract: No abstract text available
Text: 256 Megabit CMOS DDR SDRAM DPDD16MX16TSBY5 PIN-OUT DIAGRAM DESCRIPTION: The 256 Megabit LP-Stack modules DPDD16MX16TSBY5, based on 128 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 8 DDR SDRAM TSOP monolithic. This allows for
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DPDD16MX16TSBY5
A10/AP
53A001-00
30A245-00
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Untitled
Abstract: No abstract text available
Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and
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TSOP
Abstract: tsop 48 PIN SOCKET TSOP 56 socket TSOP 48 socket weller soldering tip TSOP 44 Pattern TSOP 54 SOCKETS weller MT1500 TSOP 32 socket TSOP 50 socket
Text: TSOP. SSOP. PSOP. PLCC. microBGA. BGA. Extenders. C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com
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923724-XX
40TSOP
56TSOP
923724-XX
041598B
TSOP
tsop 48 PIN SOCKET
TSOP 56 socket
TSOP 48 socket
weller soldering tip
TSOP 44 Pattern
TSOP 54 SOCKETS
weller MT1500
TSOP 32 socket
TSOP 50 socket
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TSOP 48 Pattern
Abstract: 980020 TSOP 54 SOCKETS TSOP 54 SOCKETS smt mount ALPTEX 32TSOP 56TSOP SOCKET p PINOUT 980020-XX-XX TSOP 48 socket
Text: C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com Copyright ALPTEX, Inc. 1998 TSOP FlexProbes 0,50mm (.0197") Pitch
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923724-XX
041598B
TSOP 48 Pattern
980020
TSOP 54 SOCKETS
TSOP 54 SOCKETS smt mount
ALPTEX
32TSOP
56TSOP
SOCKET p PINOUT
980020-XX-XX
TSOP 48 socket
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SOP 8 200MIL
Abstract: serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash
Text: Renesas Memory General Catalog 2003.11 Renesas Memory General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with
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D-85622
REJ01C0001-0100Z
SOP 8 200MIL
serial flash 256Mb fast erase spi
TM 1628 IC SOP
Micron 512MB NOR FLASH
HN29V1G91T-30
HN58C1001FPI-15
M5M51008DFP-70HI
256mb EEPROM Memory
CSP-48
TSOP 28 SPI memory Package flash
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AMD AM28F010 ca
Abstract: AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002
Text: Flash Memory Quick Reference Guide Summer ’98 Package Migration Low-Voltage Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B 2 Mb 4 Mb 8 Mb 16 Mb Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B Am29LV104B 1 Mb 2 Mb 4 Mb Am29LV200 Am29DL400B Am29LV400
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Am29LV004
Am29LV008B
Am29LV081
Am29LV116B
Am29LV017B
Am29LV010B
Am29LV001B
Am29LV020B
Am29LV102B
Am29LV040B
AMD AM28F010 ca
AM29 flash
48-pin TSOP package tray
tsop 48 PIN SOCKET pin identification
AMD 2m flash memory
Meritec
Am29LV033B
AM29F010
Am29F002N
AM29F002
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QFN11T040-006
Abstract: WA200 QFN11T032-003 QFN11T048-008 IC51-1284-1433 QFN11T024-002 IC189-0282-042 IC189 IC51-0804-819-2 IC51-0242-367-1
Text: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.
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QFN11T048-008
Abstract: NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148
Text: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.
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WA51-0162-911-XXX
WA51-0202-779-XXX
WA51-0202-912-XXX
WA51-0242-913-XXX
WA51-0242-761-XXX
WA51-0282-673-1-XXX
WA51-0302-914-XXX
WA51-0302-755-XXX
WA51-0322-910-XXX
QFN11T048-008
NP445-064-002
QFN11T032-003
NP445-048-001
ic191-0482-004 pin details
IC51-0202-912
IC51-0282-165
WA200
IC51-0302-914
IC51-1844-1148
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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Zn107
Abstract: No abstract text available
Text: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA
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OCR Scan
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48-ball
AS7C18
1-20017-A.
Zn107
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