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    TSOP-48 PACKAGE FOOTPRINT Search Results

    TSOP-48 PACKAGE FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TSOP-48 PACKAGE FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via


    Original     		PDF PA29F-S4-TS Socket/32 29Fx00 29F200 29F400 29F0x0.

    A6 TSOP-6 MARKING

    Abstract: No abstract text available
    Text: S29AL016D 16 Megabit 2 M x 8-Bit/1 M x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Datasheet ADVANCE INFORMATION Distinctive Characteristics Architectural Advantages Package Options „ Single power supply operation „ 48-ball FBGA „ 48-pin TSOP — Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications


    Original     		PDF S29AL016D 16-Bit) 48-ball 48-pin 200nm Am29LV160D MBM29LV160E S29AL016D A6 TSOP-6 MARKING

    Untitled

    Abstract: No abstract text available
    Text: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64359// 6169#97.ð49#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA


    Original     		PDF 44-pin 48-ball AS7C181026LL) AS7C251026LL) AS7C31026LL-100TI AS7C31026LL-55BC AS7C31026LL-70BC AS7C31026LL-100BC AS7C31026LL-55BI AS7C31026LL-70BI

    CQM1-ID212

    Abstract: No abstract text available
    Text: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA • Center power and ground pins for low noise • ESD protection ≥ 2000 volts


    Original     		PDF 44-pin 48-ball AS7C251026LL) AS7C31026LL) AS7C181026LL-55BC AS7C181026LL-70BC AS7C181026LL-100BC AS7C181026LL-55BI AS7C181026LL-70BI AS7C181026LL-100BI CQM1-ID212

    Untitled

    Abstract: No abstract text available
    Text: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • JEDEC registered packaging - 32-pin TSOP package - 48-ball 8mm x 6mm CSP BGA • ESD protection ≥ 2000 volts


    Original     		PDF 32-pin 48-ball AS7C181024LL) AS7C31024LL) AS7C251024LL-55TC AS7C251024LL-70TC AS7C251024LL-100TC AS7C251024LL-55TI AS7C251024LL-100TI AS7C251024LL-70BC

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA


    Original     		PDF 44-pin 48-ball AS7C181026LL) AS7C31026LL) 026LL-100TC AS7C251026LL-55TI AS7C251026LL-70TI AS7C251026LL-100TI AS7C251026LL-55BC AS7C251026LL-70BC

    Untitled

    Abstract: No abstract text available
    Text: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.


    Original     		PDF PA48-40-1TS socket/40 E28F200CV/400CV E28F200CR/ 40DIP E28F400CR/ E28F800CR/

    29f800 29f400

    Abstract: No abstract text available
    Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP


    Original     		PDF PA48TS29F socket/44 29F100 29F200 29F400 29F800 29f800 29f400

    29F800 equivalent

    Abstract: No abstract text available
    Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP


    Original     		PDF PA48TS29F-800 socket/44 PA48TS29F 29F800 29F800 29F100, 29F800 equivalent

    ddr 3 tsop

    Abstract: TSOP 56 LAYOUT TSOP 66 Package
    Text: 128 Megabit CMOS DDR SDRAM DPDD16MX8RSBY5 DESCRIPTION: The 128 Megabit LP-StackTM module DPDD16MX8RSBY5, based on 64 Mbit devices, has been designed to fit the same footprint as the 8 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or


    Original     		PDF DPDD16MX8RSBY5 DPDD16MX8RSBY5, A0-A11 30A223-10 53A001-00 ddr 3 tsop TSOP 56 LAYOUT TSOP 66 Package

    udqs

    Abstract: No abstract text available
    Text: 512 Megabit CMOS DDR SDRAM DPDD32MX16WSCY5 ADVANCED INFORMATION DESCRIPTION: The 512 Megabit LP-Stack modules DPDD32MX16WSCY5, based on 256 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 16 DDR SDRAM TSOP monolithic. This allows for


    Original     		PDF DPDD32MX16WSCY5 DPDD32MX16WSCY5, 53A001-00 30A249-00 udqs

    Untitled

    Abstract: No abstract text available
    Text: 512 Megabit CMOS DDR SDRAM DPDD64MX8WSBY5 DESCRIPTION: The 512 Megabit LP-StackTM module DPDD64MX8WSBY5, based on 256 Mbit devices, has been designed to fit the same footprint as the 32 Meg x 8 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or


    Original     		PDF DPDD64MX8WSBY5 DPDD64MX8WSBY5, 53A001-00 30A249-00

    Untitled

    Abstract: No abstract text available
    Text: 256 Megabit CMOS DDR SDRAM DPDD16MX16TSBY5 PIN-OUT DIAGRAM DESCRIPTION: The 256 Megabit LP-Stack modules DPDD16MX16TSBY5, based on 128 Megabit devices, has been designed to fit in the same footprint as the 16 Meg x 8 DDR SDRAM TSOP monolithic. This allows for


    Original     		PDF DPDD16MX16TSBY5 A10/AP 53A001-00 30A245-00

    Untitled

    Abstract: No abstract text available
    Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and


    Original     		PDF

    TSOP

    Abstract: tsop 48 PIN SOCKET TSOP 56 socket TSOP 48 socket weller soldering tip TSOP 44 Pattern TSOP 54 SOCKETS weller MT1500 TSOP 32 socket TSOP 50 socket
    Text: TSOP. SSOP. PSOP. PLCC. microBGA. BGA. Extenders. C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com


    Original     		PDF 923724-XX 40TSOP 56TSOP 923724-XX 041598B TSOP tsop 48 PIN SOCKET TSOP 56 socket TSOP 48 socket weller soldering tip TSOP 44 Pattern TSOP 54 SOCKETS weller MT1500 TSOP 32 socket TSOP 50 socket

    TSOP 48 Pattern

    Abstract: 980020 TSOP 54 SOCKETS TSOP 54 SOCKETS smt mount ALPTEX 32TSOP 56TSOP SOCKET p PINOUT 980020-XX-XX TSOP 48 socket
    Text: C O N T E N T S Probes For Fine Pitch Connections TSOP FlexProbes 0,50mm .0197" Pitch Inc. • P.O. Box 476 • Orwell, Ohio • 44076 • (440)437-5570 • (440)437-5571 FAX • www.alptex.com Copyright ALPTEX, Inc. 1998 TSOP FlexProbes 0,50mm (.0197") Pitch


    Original     		PDF 923724-XX 041598B TSOP 48 Pattern 980020 TSOP 54 SOCKETS TSOP 54 SOCKETS smt mount ALPTEX 32TSOP 56TSOP SOCKET p PINOUT 980020-XX-XX TSOP 48 socket

    SOP 8 200MIL

    Abstract: serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash
    Text: Renesas Memory General Catalog 2003.11 Renesas Memory General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with


    Original     		PDF D-85622 REJ01C0001-0100Z SOP 8 200MIL serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash

    tsop 0038

    Abstract: TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package C7025
    Text: TSOP: THIN SMALL OUTLINE PACKAGE DRAWING A2 Z e SEE DETAIL B E Y A1 D1 D SEATING PLANE SEE DETAIL A A DETAIL A DETAIL B c b φ L Thin Small Outline Package TSOP Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch


    Original     		PDF 56-Lead 48-Lead C7025 40-lead, 40lead 32-lead tsop 0038 TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package

    AMD AM28F010 ca

    Abstract: AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002
    Text: Flash Memory Quick Reference Guide Summer ’98 Package Migration Low-Voltage Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B 2 Mb 4 Mb 8 Mb 16 Mb Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B Am29LV104B 1 Mb 2 Mb 4 Mb Am29LV200 Am29DL400B Am29LV400


    Original     		PDF Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B AMD AM28F010 ca AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002

    QFN11T040-006

    Abstract: WA200 QFN11T032-003 QFN11T048-008 IC51-1284-1433 QFN11T024-002 IC189-0282-042 IC189 IC51-0804-819-2 IC51-0242-367-1
    Text: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.


    Original     		PDF

    QFN11T048-008

    Abstract: NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148
    Text: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.


    Original     		PDF WA51-0162-911-XXX WA51-0202-779-XXX WA51-0202-912-XXX WA51-0242-913-XXX WA51-0242-761-XXX WA51-0282-673-1-XXX WA51-0302-914-XXX WA51-0302-755-XXX WA51-0322-910-XXX QFN11T048-008 NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    Zn107

    Abstract: No abstract text available
    Text: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA


    OCR Scan     		PDF 48-ball AS7C18 1-20017-A. Zn107