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    TSOP-48 FOOTPRINT Search Results

    TSOP-48 FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5ADNE#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#10 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5AGNH#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    TSOP-48 FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PA48TS20-OT

    Abstract: 48TS20-1
    Text: PA48TS20- 1 OT Data Sheet 48 pin TSOP socket/48 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect the pins of a 48 pin TSOP device to a 48 pin DIP equivalent. They accept a TSOP device and plug into a DIP socket. The adapter is made up of 2 sub-assemblies. They assemble via


    Original     		PDF PA48TS20- socket/48 PA48TS20-OT 48TSJ-W20 48TS20 PA48TS20-1OT 48TS20-1 PA48TS20-OT PA48TS20-1OT 48TS20-1

    29f800 29f400

    Abstract: No abstract text available
    Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP


    Original     		PDF PA48TS29F socket/44 29F100 29F200 29F400 29F800 29f800 29f400

    Untitled

    Abstract: No abstract text available
    Text: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.


    Original     		PDF PA48-40-1TS socket/40 E28F200CV/400CV E28F200CR/ 40DIP E28F400CR/ E28F800CR/

    29F800 equivalent

    Abstract: No abstract text available
    Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP


    Original     		PDF PA48TS29F-800 socket/44 PA48TS29F 29F800 29F800 29F100, 29F800 equivalent

    Untitled

    Abstract: No abstract text available
    Text: PA29F-S4-TS Data Sheet 48 pin TSOP Socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter converts the AMD 29Fx00 in its 48 pin TSOP package to a 32 pin DIP programming footprint for the Dataman S4 programmer. The adapter is made up of 3 sub-assemblies. They assemble via


    Original     		PDF PA29F-S4-TS Socket/32 29Fx00 29F200 29F400 29F0x0.

    A6 TSOP-6 MARKING

    Abstract: No abstract text available
    Text: S29AL016D 16 Megabit 2 M x 8-Bit/1 M x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Datasheet ADVANCE INFORMATION Distinctive Characteristics Architectural Advantages Package Options „ Single power supply operation „ 48-ball FBGA „ 48-pin TSOP — Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications


    Original     		PDF S29AL016D 16-Bit) 48-ball 48-pin 200nm Am29LV160D MBM29LV160E S29AL016D A6 TSOP-6 MARKING

    5189

    Abstract: AS7C1
    Text: $GYDQFH#LQIRUPDWLRQ $6:&5873<;// 5189#589.[49#,QWHOOLZDW#ORZ#SRZHU#&026#65$0 HDWXUHV • • • • • Smallest footprint packages - 48 ball FBGA - 400 mil TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


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    Untitled

    Abstract: No abstract text available
    Text: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64359// 6169#97.ð49#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA


    Original     		PDF 44-pin 48-ball AS7C181026LL) AS7C251026LL) AS7C31026LL-100TI AS7C31026LL-55BC AS7C31026LL-70BC AS7C31026LL-100BC AS7C31026LL-55BI AS7C31026LL-70BI

    AS7C31024LL-55BC

    Abstract: AS7C31024LL-55TC AS7C31024LL-55TI
    Text: 3UHOLPLQDU\#LQIRUPDWLRQ $6:&64357// 6169#45;.ð;#,QWHOOLZDWWŒ#ORZ#SRZHU#&026#65$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • TTL/LVTTL-compatible, three-state I/O • JEDEC registered packaging - 32-pin TSOP packag - 48-ball 8mm x 6mm CSP BGA


    Original     		PDF 32-pin 48-ball AS7C181024LL) AS7C251024LL) AS7C31024LL-70TC AS7C31024LL-100TC AS7C31024LL-55TI AS7C31024LL-70TI AS7C31024LL-100TI AS7C31024LL-55BC AS7C31024LL-55BC AS7C31024LL-55TC AS7C31024LL-55TI

    AS7C1

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


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    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ &// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


    Original     		PDF 44-pin 7C254096LL-25TC 7C254096LL-35TC 7C254096LL-55TC 7C254096LL-70TC 7C254096LL-100TC 7C254096LL-25TI 7C254096LL-35TI 7C254096LL-55TI 7C254096LL-70TI

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


    Original     		PDF 44-pin AS7C184096LL-35TC AS7C184096LL-55TC AS7C184096LL-70TC AS7C184096LL-100TC AS7C184096LL-35TI AS7C184096LL-70TI AS7C184096LL-100TI AS7C184096LL-55BC AS7C184096LL-70BC

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


    Original     		PDF 44-pin AS7C34096LL-25TC AS7C34096LL-35TC AS7C34096LL-55TC AS7C34096LL-70TC AS7C34096LL-100TC AS7C34096LL-25TI AS7C34096LL-35TI AS7C34096LL-55TI AS7C34096LL-70TI

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Smallest footprint packages - 48 ball FBGA - 400 mil TSOP II • Center power and ground pins for low noise • ESD protection ≥ 2000 volts • Latch-up current ≥ 200 mA


    Original     		PDF I/O15 AS7C34098LL) AS7C254098LL 098LL-55TC AS7C184098LL-70TC AS7C184098LL-100TC AS7C184098LL-70TI AS7C184098LL-100TI AS7C184098LL-70BC AS7C184098LL-100BC

    Untitled

    Abstract: No abstract text available
    Text: 3UHOLPLQDU\LQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE1, CE2, OE inputs • JEDEC registered packaging - 32-pin TSOP package - 48-ball 8mm x 6mm CSP BGA • ESD protection ≥ 2000 volts


    Original     		PDF 32-pin 48-ball AS7C181024LL) AS7C31024LL) AS7C251024LL-55TC AS7C251024LL-70TC AS7C251024LL-100TC AS7C251024LL-55TI AS7C251024LL-100TI AS7C251024LL-70BC

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&// 9.ð,QWHOOLZDWWŒORZSRZHU&02665$0 HDWXUHV • Easy memory expansion with CE, OE inputs • LVTTL/LVCMOS-compatible, three-state I/O • JEDEC registered packaging - 44-pin TSOP II package - 48-ball csp 8mm x 6mm BGA


    Original     		PDF 44-pin 48-ball AS7C181026LL) AS7C31026LL) 026LL-100TC AS7C251026LL-55TI AS7C251026LL-70TI AS7C251026LL-100TI AS7C251026LL-55BC AS7C251026LL-70BC

    K4S280432

    Abstract: tsop sensor 8291 tsop sensors samsung NAND FLASH BGA micron BGA SDRAM 48 tsop flash pinout
    Text: Data Sheet Part No. ISSD32M8STB Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 32M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


    Original     		PDF ISSD32M8STB K4S280432 tsop sensor 8291 tsop sensors samsung NAND FLASH BGA micron BGA SDRAM 48 tsop flash pinout

    8291

    Abstract: tsop sensor tsop sensors K4S560832
    Text: Data Sheet Part No. ISSD32M16STC Irvine Sensors Corporation Microelectronics Products Division 512 Mbit 32M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


    Original     		PDF ISSD32M16STC 256Mbit 8291 tsop sensor tsop sensors K4S560832

    tsop sensor

    Abstract: tsop sensors K4S640832 BGA 48 "8 x 8" memory micron
    Text: Data Sheet Part No. ISSD8M16STC Irvine Sensors Corporation Microelectronics Products Division 128 Mbit 8M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


    Original     		PDF ISSD8M16STC tsop sensor tsop sensors K4S640832 BGA 48 "8 x 8" memory micron

    tsop sensor

    Abstract: TSOP 54 PIN footprint K4S280832 ISSD16M16STC tsop sensors 256 pin bga pinout Irvine Sensors
    Text: Data Sheet Part No. ISSD16M16STC Irvine Sensors Corporation Microelectronics Products Division 256 Mbit 16M x 16 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


    Original     		PDF ISSD16M16STC tsop sensor TSOP 54 PIN footprint K4S280832 ISSD16M16STC tsop sensors 256 pin bga pinout Irvine Sensors

    tsop sensor

    Abstract: tsop sensors Mitsubishi part numbering micron nor Flash
    Text: Data Sheet Part No. ISSD16M8STB Irvine Sensors Corporation Microelectronics Products Division 128 Mbit 16M x 8 Synchronous DRAM Memory Stack Features: q Low Profile: same PCB footprint as a


    Original     		PDF ISSD16M8STB tsop sensor tsop sensors Mitsubishi part numbering micron nor Flash

    Irvine Sensors Corporation

    Abstract: No abstract text available
    Text: Data Sheet Part No. ISDD64M8STC Irvine Sensors Corporation Microelectronics Products Division 512Mbit 64M x 8 DDR DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a


    Original     		PDF ISDD64M8STC 512Mbit Irvine Sensors Corporation

    TSOP 54 PIN footprint

    Abstract: 256MBIT NOR FLASH tsop sensors Micron NAND DQS ddr 3 tsop k4h280838 stc 3001 256-MBIT
    Text: Data Sheet Part No. ISDD32M8STC Irvine Sensors Corporation Microelectronics Products Division 256Mbit 32M x 8 DDR DRAM Memory Stack Features: q q Low Profile: same PCB footprint as a


    Original     		PDF ISDD32M8STC 256Mbit a256Mbit TSOP 54 PIN footprint 256MBIT NOR FLASH tsop sensors Micron NAND DQS ddr 3 tsop k4h280838 stc 3001 256-MBIT

    Zn107

    Abstract: No abstract text available
    Text: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA


    OCR Scan     		PDF 48-ball AS7C18 1-20017-A. Zn107