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    TRAY MPPO Search Results

    TRAY MPPO Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    TRAY MPPO Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


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    K660

    Abstract: material content amd AMD chemical content 9002-86-2
    Text: u Chapter 14 Chemical Content of Product Carriers and Packing Materials CHAPTER 14 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Tray Recycling Program Recyclability of Packing Materials and Product Carriers


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    PEAK MPPO PP6

    Abstract: TRAY MPPO DAEWON tray drawing CABGA-208 daewon PEAK tray drawing IDT70V659S10BFG idt89h DAEWON drawing IDT70V657S12BFI
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0812-03 DATE: 1/27/2009 Product Affected: 15 mm x 15 mm CABGA-196 & 208 shipped in tray Date Effective: Contact: Title: Phone #:


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    TB0812-03 CABGA-196 1515BF IDT70V658S15BFG IDT70V658S15BFI IDT70V659S10BF IDT70V659S10BFG IDT70V659S12BF IDT70V659S12BFG PEAK MPPO PP6 TRAY MPPO DAEWON tray drawing CABGA-208 daewon PEAK tray drawing IDT70V659S10BFG idt89h DAEWON drawing IDT70V657S12BFI PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


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    60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    PEAK tray drawing

    Abstract: 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0908-03 DATE: 9/16/2009 Product Affected: 13 mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144 Date Effective: Contact: Title: Phone #:


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    TB0908-03 PBGA-144 CABGA-144 72V36110L7-5BB 72V36110L7-5BBG 72V36110L7-5BBGI 72V36110L7-5BBI 72V3640L6BB 72V3640L6BBG 72V3640L7-5BB PEAK tray drawing 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144 PDF

    DAEWON tray 48

    Abstract: daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FAA 064 322.6 315.0 * 2.54 R. 4 PLACES VACUUM PICKUP CELLS 10 PLACES (6 CENTER CELLS, 4 SIDE CELLS) 5.62* X 7.62 SEE DETAIL "D" Z Y SEE DETAIL "E" X X 112.0 135.9* ±0.25 92.1 * 16.00 B 12.7 * 11.95 CHAMFER


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    3417-1a 27458b 3467b 26040h DAEWON tray 48 daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8 PDF

    daewon

    Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1


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    26048i 3412-2a 26396f FBD63 12F-0814-D19 3412-2b daewon TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19 PDF

    daewon

    Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"


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    3472b 26946h f27839b-opt2 daewon 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11 PDF

    daewon tray

    Abstract: daewon TRAY MPPO 56LD MPPO DAEWON 100 3468B
    Text: ‹ Chapter 5 Trays Shrink Small Outline Package: SSO 056 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 8 PLACES 6.35 * X Y 7.62 Z (4 CENTER CELLS, 4 SIDE CELLS) SEE DETAIL "E" X X 105.90 ±0.25 135.9* 92.1 * 21.18 B 12.7 * 25.70 15.00 16.15 CHAMFER


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    3468b 26254d daewon tray daewon TRAY MPPO 56LD MPPO DAEWON 100 PDF

    12B-0608-F19

    Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
    Text: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X


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    0X45M 3466b 26022i 12B-0608-F19 DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A PDF

    daewon

    Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook


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    f27326 3474b 27327d daewon DAEWON FBGA LAA064 FBGA 137 DAEWON LAA PDF

    daewon

    Abstract: FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: TLD 064, FEA 084, FED 084, FMC 084, TLD 084, TSD 084, FWA 084, FMC 107, FMC 115, FOA 115, FWA 115, FEA 137, FMC 137, FTF 137, TLD 137, TSD 137 322.6 315.0 * 2.54 R. 4 PLACES 5.62 * X SEE DETAIL "D" VACUUM PICKUP CELLS


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    31ext 28391a 28806a daewon FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084 PDF

    daewon

    Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044


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    f28384b VDJ044 28805c 3477b 27776c daewon VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA PDF

    daewon

    Abstract: DAEWON tray 48 3471A daewon tray DAEWON FBGA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLA 048, NSA 048, VDC 048, NLA 060, MTA 133, NLC 133 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 10 PLACES BUMPS 8 PLACES Y (2 CENTER CELLS, 8 SIDE CELLS) 6.35 * SEE DETAIL "D" X 7.62 Z SEE DETAIL "E"


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    29718b 29716a daewon DAEWON tray 48 3471A daewon tray DAEWON FBGA PDF

    Untitled

    Abstract: No abstract text available
    Text: Midas Ultrasonic Sensors Part Number System MC US T 16 1 2 3 4 P 5 1 = MC: Midas Components 2 = US: Ultrasonic Sensor 3 = T: Transmitter 4 = Diameter e.g. 16 = 16mm 5 = P: Plastic 6 = Frequency 40KHz) Frreq e ue uen ncy (e.g. nc (e e.g g. 4 40 0 = 40K 0KHzz)


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    40KHz) PDF

    poly aluminum chloride

    Abstract: rubidium radioactive
    Text: ‹ Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials


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    mhb576

    Abstract: 79lc smd code marking 27H SAA7129Hb secam encoder
    Text: INTEGRATED CIRCUITS DATA SHEET SAA7128H; SAA7129H Digital video encoder Product specification File under Integrated Circuits, IC22 2000 Mar 08 Philips Semiconductors Product specification Digital video encoder SAA7128H; SAA7129H CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION


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    SAA7128H; SAA7129H OT307 mhb576 79lc smd code marking 27H SAA7129Hb secam encoder PDF

    Panduit - CMDSAQLCZBL

    Abstract: manual legrand 037 71 schematic diagram RCA to HDMI project 24 fiber mtp array polarity Thomas & Betts colored - keyed terminals
    Text: PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems SECTION INDEX Click on any section below to go to that portion for a detailed Table of Contents Table of Contents Click on the logo above to go to www.panduit.com up to date product information find a local distributor


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    SA-ELCB10 Panduit - CMDSAQLCZBL manual legrand 037 71 schematic diagram RCA to HDMI project 24 fiber mtp array polarity Thomas & Betts colored - keyed terminals PDF

    S5 100 B112 MT RELAY

    Abstract: CK 66 UL 94V-0 LCD sh 0357 94v-0 c225t F8212 panduit standoff RF based remote control robot circuit diagram of incubator D1148 burndy Y35 crimping tool manual
    Text: ELECTRICAL SOLUTIONS A. System Overview Click on the logo above to go to www.panduit.com up to date product information find a local distributor technical information Section Index B1. Cable Ties A. System Overview B2. Cable Accessories B. Bundle B3. Stainless


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    SA-NCCB51 S5 100 B112 MT RELAY CK 66 UL 94V-0 LCD sh 0357 94v-0 c225t F8212 panduit standoff RF based remote control robot circuit diagram of incubator D1148 burndy Y35 crimping tool manual PDF

    DAEWON tray drawing

    Abstract: TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261
    Text: R E V IS IO N S REV 01 02 DESCRIPTION MPPO 150‘C TRAY ADDED NEW PACKAGE, AC/ACG 100 & NOTES DATE 0 2 /2 1 /0 5 0 6 /0 1 /0 6 APPRO VED K K Thee KK Thee 6.35 S E E D ETA IL 'D ' !-»! 0.20 »3=DIAfzWI -10.20 M IAI X (M 7.62 m 311.15 - • +0.25 -0.13


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    11x11 MSC17011 P7-134- MSC-1702 DAEWON tray drawing TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261 PDF

    CABGA 8X8

    Abstract: DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon
    Text: REVISIONS REV 00 01 DESCRIPTION IN IT IA L R ELEASE A DDED NEW PAC KA G E - — 6,35 DATE 0 1 /1 4 /0 5 APPROVED QUAN LUU 0 4 /2 2 /0 9 KK Thee B F /B F G 81 h0-l Q.gQ H I aTxWI — 7,62 -|Q.gQ(H)|A|Z(l 311.15- +0.25 -0.13 -1 3 2 .0 8 • +0.25 -0.13


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    83-lOVS P7-176-000 MSC-1777 MSC17011 CABGA 8X8 DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon PDF

    DAEWON tray drawing

    Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
    Text: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I


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    P7-246-000) 15X15 -30VS MSC17011 P7-139- MSC-1707 DAEWON tray drawing TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032 PDF