tray datasheet bga
Abstract: BGA35
Text: Mounting Pad Packing Name JEDEC Tray T-657 352 pin BGA 35 x 35 A S B C D P J H R K L φM F E I G M NOTE Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 35.00±0.15
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T-657
P352S1-F6
tray datasheet bga
BGA35
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Teradyne connector
Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight
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TB-2082
Teradyne connector
470-2075-100
470-2105-100
337 BGA footprint
471-2045-100
471-1045-100
471-1025-100
470-2235-100
BGA PROFILING
Teradyne
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tray datasheet bga
Abstract: S 657 A S352S1-F6-1
Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B S C D P Index mark J R I H F K L φM E G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S352S1-F6-1
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T-657
S352S1-F6-1
tray datasheet bga
S 657 A
S352S1-F6-1
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tray datasheet bga
Abstract: F5 MARK S313S1-F5-1
Text: Packing Name Mounting Pad JEDEC Tray T-657 313 pin BGA 35 x 35 A B S C D P Index mark J R I H T K L φM M NOTE E G F Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S313S1-F5-1
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T-657
S313S1-F5-1
tray datasheet bga
F5 MARK
S313S1-F5-1
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trays
Abstract: QFN Shipping Trays PEAK TRAY bga
Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad
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tray datasheet bga
Abstract: F5 MARK
Text: Mounting Pad Packing Name JEDEC Tray T-657 313 pin BGA 35 x 35 A S B B A C D P Index mark J I R A H S T E G F L φM φN M S A B M S *1 *2 detail of A part ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 B 30.0 1.181 C 30.0 1.181 D E 35.00±0.20 2.26
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T-657
Y313S1-F5
tray datasheet bga
F5 MARK
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tray datasheet bga
Abstract: No abstract text available
Text: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.
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S500N7-H6
tray datasheet bga
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hsp35
Abstract: C0016
Text: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008
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S352N7-F6-1
hsp35
C0016
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h 033
Abstract: P119S1-R4 bga 84
Text: Packing Name Mounting Pad JEDEC Tray NX BG1422 2.0 119 pin BGA 14 x 22 A S B T C 7 6 5 4 3 2 1 D U T R P NM L K J HG F E DC B A P J I R H K F E G L ITEM MILLIMETERS INCHES A B 22.0±0.2 19.5 0.866±0.008 0.768 C 12.0 0.472 D E 14.0±0.2 0.84 0.551±0.008
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BG1422
P119S1-R4
h 033
P119S1-R4
bga 84
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hsp35
Abstract: 1362 597G
Text: Mounting Pad Packing Name JEDEC Tray TBGA 35x35 420 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T B W A2 D X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 35.00±0.20 INCHES 1.378±0.008 A1 20.50 MAX. 0.807 MAX. A2 20.50 MAX. 0.807 MAX.
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S420N7-F6
hsp35
1362
597G
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BGA 8 x 8 tray
Abstract: tray datasheet bga S576N7
Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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S576N7-H6
BGA 8 x 8 tray
tray datasheet bga
S576N7
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256-pin
Abstract: No abstract text available
Text: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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25MIN.
S256N7-B6
256-pin
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transistor h9
Abstract: No abstract text available
Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 696 pin T-BGA H/Sp (40 × 40) A U B A1 A Q R S T BW V D A2 X C Index mark J H S A G B K φM φP L S M M detail of A part F S A B S ∗2 ∗1 E detail of B part Z N NOTE ∗1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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S696N7-H9
transistor h9
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WY transistor
Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
Text: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of
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T-651
S256S1-B6-1
WY transistor
tray datasheet bga
256-pin BGA
S256S1-B6-1
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tray datasheet bga
Abstract: 256-pin BGA BGA L WY transistor
Text: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of
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T-651
Y256S1-B6
tray datasheet bga
256-pin BGA
BGA L
WY transistor
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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S146
Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,
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15mmH
misali6-2-2557-7351
S146
S514
S144
200POS
IT3D-200S-BGA37
IT3D-100S-BGA
BGA reflow guide
S142
PEAK TRAY bga
hirose it3
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BGA package tray 40 x 40
Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09
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BGA-484P-M07
BGA-484P-M09
BGA-496P-M02
BGA-543P-M01
BGA-320P-M06
BGA-544P-M01
BGA-352P-M36
BGA-544P-M02
BGA-352P-M41
BGA-544P-M04
BGA package tray 40 x 40
ST-BG272720TJ-1-1-Y-1
676 BGA package tray
tray datasheet bga
TRAY JEDEC BGA 5 6
BGA-544P-M04
tray bga
PBGA 484P
SDP91-PS,PBGA,496P
BGA-676P-M07
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BGA PACKAGE TOP MARK intel
Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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28F160F3
US048641
RD33708SW
RD33716SW
12B-1013-G13
BGA PACKAGE TOP MARK intel
144 bga
12B-1013-G13
BGA PACKAGE TOP MARK
28F160F3
BGA package tray 64
tray bga 17
intel Easy BGA TOP MARK
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JEDEC TRAY DIMENSIONS
Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
Text: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.
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FBGA17
256-pin
SSD-A-H7511
JEDEC TRAY DIMENSIONS
PACKAGE TRAY
jedec bga tray
tray jedec BGA
tray bga
JEDEC tray standard
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tray datasheet bga
Abstract: jedec tray BGA
Text: TRAY CONTAINER UNIT : mm A' 7 150° C MAX. 41.45 BGA50 x 50A 50.15 53.00 51.50 50.15 NEC 53.00 135.9 2 × 5=10 PPE A 212.0 315.0 322.6 SECTION A-A' 8.10 8.50 11.50 50.15 Applied Package Quantity (pcs) 2209-pin Plastic BGA (50×50) (FLIP CHIP TYPE) 10 MAX.
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BGA50
2209-pin
BGA50
SSD-A-H7711
tray datasheet bga
jedec tray BGA
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nec 2565
Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
Text: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray
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324-pin
BGA19
SSD-A-H7599
nec 2565
NEC C 324 C
2565 nec
nec 1026
JEDEC TRAY DIMENSIONS
BGA package tray
tray bga
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nec 575
Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)
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BGA23
23ESP
324-pin
352-pin
484-pin
575-pin
SSD-A-H7317-4
nec 575
484-pin BGA
NEC C 324 C
jedec tray BGA
tray datasheet bga
JEDEC tray standard
tray bga
TRAY DIMENSIONS
TRAY CONTAINER
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nec 2565
Abstract: tray bga 576 tray datasheet bga
Text: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40
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500-pin
576-pin
SSD-A-H6757-1
nec 2565
tray bga 576
tray datasheet bga
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