Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TQFP 14X20 LAND Search Results

    TQFP 14X20 LAND Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy

    TQFP 14X20 LAND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


    Original     		PDF

    strapack s-669

    Abstract: strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1
    Text: 1999年 1 月 ver. 4 イントロダク ション Application Note 71 現在表面実装用のJリード・パッケージ、クワッド・フラット・パック （QFP）パッケージ、およびFineLine BGATMを含むボール・グリッド・ア


    Original     		PDF -AN-071-04/J strapack s-669 strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1

    AS7C33232-15QC

    Abstract: datasheet CI 556 ats 2300 intel 8282 AS7C33232-15TQC nt 407 f AS7C33232 MO-108 NT 407 F transistor
    Text: High Performance 32Kx32 CMOS SRAM AS7C33232 AS7C33232F 32K×32 Synchronous burst SRAM Features • Organization: 32,768 words × 32 bits • Fully synchronous pipelined operation • Flow-through option F version • Fast clocking speed: 100/75/66/60 MHz


    Original     		PDF AS7C33232 AS7C33232F AS7C33232-15QC datasheet CI 556 ats 2300 intel 8282 AS7C33232-15TQC nt 407 f AS7C33232 MO-108 NT 407 F transistor

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    AA 12025

    Abstract: Z0 607 MN 64K32 J-Squared Technologies
    Text: High Performance 64Kx32 CMOS SRAM AS7C36432 64K×32 Synchronous burst SRAM Preliminary information Features • Organization: 65,536 words × 32 bits • Fully synchronous pipelined operation • Flow-through option • Fast clocking speed: 100/75/66 MHz


    Original     		PDF AS7C36432 AA 12025 Z0 607 MN 64K32 J-Squared Technologies

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


    Original     		PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    apple ipad 2 circuit schematic

    Abstract: SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing smd code marking NEC tantalum capacitor marking w25 SMD 32 pin eprom to eprom copier circuit pin DIAGRAM OF IC 7400 smd TRANSISTOR code marking bu TRANSISTOR SMD MARKING CODE W25
    Text: Data Book The Programmable Logic Data Book Success made simple Click anywhere on this page to continue 1996 On behalf of the employees of Xilinx, our sales representatives, our distributors, and our manufacturing partners, welcome to our 1996 Data Book, and thank you for your interest in


    Original     		PDF CH-4450 2-765-1488w apple ipad 2 circuit schematic SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing smd code marking NEC tantalum capacitor marking w25 SMD 32 pin eprom to eprom copier circuit pin DIAGRAM OF IC 7400 smd TRANSISTOR code marking bu TRANSISTOR SMD MARKING CODE W25

    8 pin ic sdc 3733

    Abstract: SIEMENS BST h45 100 Prestigio MAP17 XTAL 14.7456MHZ 20ppm 18pF 1210 Hannstar c550 30-pin connector for LVDS hannstar atx 400 pnf R580
    Text: PRESTIGIO SIGNORE 154 TECHNICAL SERVICE MANUAL Prestigio Signore 154 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification -1.1 Introduction -1.2 System Overview -1.3 System Hardware -1.4 Electrical Characteristic -2. System View & Disassembly -2.1 System View -2.2 System Disassembly -


    Original     		PDF SIS650/645DX SIS962 3437S) CB1410 map17 8 pin ic sdc 3733 SIEMENS BST h45 100 Prestigio XTAL 14.7456MHZ 20ppm 18pF 1210 Hannstar c550 30-pin connector for LVDS hannstar atx 400 pnf R580

    Untitled

    Abstract: No abstract text available
    Text: A Advance information •■ Il AS7C3256K36P AS7C3256K32P 3.3V 256Kx32/36 pipeline burst synchronous SRAM Features • Organization: 262,144 words x 32 or 36 bits • Fast clock speeds to 166 MHz in LVTTL/LVCMOS • Fast clock to data access: 3 .5 /3 .8 /4 /5 ns


    OCR Scan     		PDF AS7C3256K36P AS7C3256K32P 256Kx32/36 100-pin 5M-1982. IPC-SM-782

    ADA17

    Abstract: No abstract text available
    Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 100-pin 00000DID1DDDD 5M-1982. IPC-SM-782 ADA17

    AS7C36432-7QC

    Abstract: 2227S
    Text: Features 1 A sy n c h ro n o u s o u tp u t e n a b le c o n tro l • O rg a n iz a tio n : 6 5 ,5 3 6 w o r d s x 32 b its ADSP, ADSC, ADV, M O DE b u rst c o n tro l p in s • Fully s y n c h ro n o u s p ip e lin e d o p e ra tio n • F lo w -th ro u g h o p tio n


    OCR Scan     		PDF AS7C36432 512KB W57C36432-6QC \S7C36432-6TQ AS7C36432-7QC AS7C36432-7TQC 1-20001-A. 2227S

    Untitled

    Abstract: No abstract text available
    Text: H ig h P e rf o rm a n c e 32K x32 C M O S SRA M •■ A S7C 33232F II 3 2 K x 3 2 Synchronous bu rst SRAM Prelim inary information • O rganization: 32,768 w ords x 32 bits • Fully synchronous pipelined operation • F low -through o r pipelined • Fast clocking speed: 1 0 0 /7 5 /6 6 MHz


    OCR Scan     		PDF 33232F S7C33232F 256KB 512KB i003M4, 33232F 3232F

    Untitled

    Abstract: No abstract text available
    Text: H ig h P e r f o r m a n c e 64K X 32 C M O S SRA M n II A S7C 36432 6 4 K X 3 2 Synchronous burst SRAM Preliminary information • O r g a n iz a tio n : 6 5 , 5 3 6 w o r d s x 3 2 b its • A s y n c h r o n o u s o u t p u t e n a b le c o n tr o l • F u lly s y n c h r o n o u s p ip e lin e d o p e r a tio n


    OCR Scan     		PDF c1DD344c 0fic13 S7C36432 AS7C36432 AS7C36432-5QC AS7C36432-6QC AS7C36 32-7QC AS7C36432-STQC AS7C36432-6TQC

    Untitled

    Abstract: No abstract text available
    Text: H igh Perform ance 32KX32 CM O S SRAM AS7C33232F A 3 2 K X 3 2 Synchronous burst SRAM Preliminary information Features • • • • • • • • • • • • • • • • Organization: 3 2 ,7 6 8 w ords x 32 bits Fully synchronous pipelined operation


    OCR Scan     		PDF 32KX32 AS7C33232F AS7C3323 512KB 33232F AS7C332 21-6QC AS7CJ3232F-7TQC AS7C33 3232F

    AM32L

    Abstract: 10 35L W8 LODA 64KX32 as7c36432-6qc CYC10
    Text: H ig h P e r fo r m a n c e 64K X 32 C M O S SR A M » II A S7C 36432 64 K X 3 2 Synchronous burst SRAM Preliminary information • O r g a n iz a tio n : 6 5 ,5 3 6 w o r d s x 3 2 b its • A sy n c h r o n o u s o u t p u t e n a b le c o n tr o l • F u lly s y n c h r o n o u s p ip e lin e d o p e r a tio n


    OCR Scan     		PDF 64KX32 AS7C36432 512KB AS7C36432 AS7C36432-5QC AS7C36432-6QC AM32L 10 35L W8 LODA CYC10

    Untitled

    Abstract: No abstract text available
    Text: II High p e rfo rm an c e 6 4 K x 52 » A S7CÌ643 2 CM O S SRAM A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh op tion • Fast clo ckin g sp e ed : 1 0 0 / 8 3 / 6 6 M H z • Fast clock to d ata access: 5 / 6 / 7 ns • Self-tim ed w rite cycle


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: H ig h P e rfo rm a n ce •■ 32K X 32 ü AS7C33232 A S7C 33232F CMOS SRAM 3 2 K x j ¿ S y n c h ro n o u s burst SRAM Features • Organization: 3 2 ,7 6 8 w o rd s x 32 bits • A synchronou s ou tp u t enable control • Fully syn ch ron ou s p ip e lin ed op eration


    OCR Scan     		PDF AS7C33232 33232F