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    Microchip Technology Inc A42MX36-FPQ208

    IC FPGA 176 I/O 208QFP
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    Microchip Technology Inc A42MX16-FPQ208

    IC FPGA 140 I/O 208QFP
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    Microchip Technology Inc A42MX24-FPQ208

    IC FPGA 176 I/O 208QFP
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    Microchip Technology Inc A54SX72A-FPQ208

    IC FPGA 171 I/O 208QFP
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    Microchip Technology Inc A2F200M3F-PQ208

    IC SOC CORTEX-M3 80MHZ 208QFP
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    FPQ20 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transformer 100 kW

    Abstract: NC-2H NC-2h ferrite material nc-2h transformer
    Text: NEW Material ver.1 BM40 Material ※RoHS compliance High Saturation Flux Density Power Ferrite Material No use of Lead, cadmium, mercury, hexavalent chromium, specific bromine flame retardant material such as PBB and PBDE State of the art high saturation magnetic flux density power material!


    Original     		PDF 10kHz 194A/m 100kHz FPQ-20/20 at100 transformer 100 kW NC-2H NC-2h ferrite material nc-2h transformer

    FPQ 208 0.5 10

    Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
    Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch


    Original     		PDF AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    enplas

    Abstract: CA-QFE208SB1-L-Z-T-01 SF-QFE208SB-L-01
    Text: 2.650" 0.100" typ. 0.575" Top View 1 3.600" 2.500" Enplas socket: part number determined from package dimensions 0.819" 3 0.229" 0.229" 2 0.250" assembled SF-QFE208SB-L-01 sub assembly (included) Side View 0.5mm 1.165" Carrier adapter part # Enplas socket part #


    Original     		PDF SF-QFE208SB-L-01 CA-QFE208SB1-L-Z-T-01 FPQ-208-0 FR4/G10 finish10µ CA-QFE208SB1-L-Z-T-01 enplas

    IC51-2084-1052-36

    Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
    Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。


    Original     		PDF IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC37NRB-2003-G4 IC37NRB-2203-G4 IC37NRB-2204-G4 IC37NRB-2406-G4 IC37NRB-2806-G4 IC8620-3206-G4 IC51-2084-1052-36 FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    IC354

    Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
    Text: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8


    Original     		PDF 300mil 400mil 600mil 750mil IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC354 IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4

    FPQ-208-0.5-10

    Abstract: qfp 20x20 package P1112A IC51-2084-1052-4 fpq-208-0.5-02 IC51-2084-1052 FPQ Package P1114A FPQ-208 FPQ-208-0.5-06
    Text: 0.250" 0.175" P1112A 0.250" P1114A QF XMG/20PGA240 SB 2.050" 1993 I.E. © 1993 I.E. 0.100" typ. 0.033" 2.508" Top View Bottom View 2.400" DUT Adaptor Part # 0.972" 0.757" DT-QFE208SA1-P-Z-01 0.080" 1 DT-QFE208SB1-P-Z-01 DT-QFE208SC1-P-Z-01 0.124" ZIF socket used*


    Original     		PDF P1112A P1114A XMG/20PGA240 DT-QFE208SA1-P-Z-01 DT-QFE208SB1-P-Z-01 DT-QFE208SC1-P-Z-01 QP1-208050-125 FPQ-208-0 IC51-2084-1052-4 FPQ-208-0.5-10 qfp 20x20 package P1112A IC51-2084-1052-4 fpq-208-0.5-02 IC51-2084-1052 FPQ Package P1114A FPQ-208 FPQ-208-0.5-06

    NC-2H

    Abstract: 100kHz-200mT
    Text: NEW Material ver.1.1 BM40 Material ※RoHS指令対応 High Saturation Flux Density Power Ferrite Material 鉛カドミウム、水銀、六価クロム及び特定臭素系難燃材PBB及びPBDEを使用しておりません。 高温度域における更なる高飽和磁束密度材開発に成功！（BM30材比）トランス容積の削減を実現し、周辺部材を含め


    Original     		PDF 10kHz 194A/m 100kHz 100kHz-200mT 140ty f100kHz NC-2H 100kHz-200mT

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    enplas

    Abstract: CA-QFE208SB1-G-Z-T-01 SF-QFE208SB-G-01 FPQ-208-0 TO-208
    Text: 2.650" 0.100" typ. 0.575" Top View 1 3.600" 2.500" Enplas socket: part number determined from package dimensions 0.819" 3 0.229" 0.229" 2 0.3" assembled SF-QFE208SB-G-01 sub assembly (included) Side View 0.5mm 1.165" Carrier adapter part # Enplas socket part #


    Original     		PDF SF-QFE208SB-G-01 CA-QFE208SB1-G-Z-T-01 FPQ-208-0 FR4/G10 finish10µ CA-QFE208SB1-G-Z-T-01 enplas TO-208

    bobbin

    Abstract: No abstract text available
    Text: List of Core Set Shapes Ordering Code System EB 40 - P 12 12 - F ቢ ባ ቤ ብ ቦ ቧ ቢ Series EB . Bobbins for FEI and FEE Cores ERB . Bobbins for FEER Cores PQB . Bobbins for FPQ Cores ባ Size of Core ቤ Type of Pin ብ Type of Placing 11: Horizontal Type, 12: Vertical Type


    Original     		PDF PQB3535-P1212-FA FPQ3535-T-22 bobbin

    BPQ26

    Abstract: 25-1112CP BPQ32 PC44PQ50 PC44PQ32 BPQ50/50 FPQ-26 FPQ-35 FPQ-50 16-1114CP
    Text: Ferrite Cores PQ Series For Power Supply PQ Cores A2 Type PQ20/16 PQ20/20 PQ26/20 PQ26/25 PQ32/20 PQ32/30 PQ35/35 PQ40/40 PQ50/50 2D Dimensions mm A1 20.5±0.4 20.5±0.4 26.5±0.45 26.5±0.45 32±0.5 32±0.5 35.1±0.6 40.5±0.9 50±0.7 A2 14±0.4 14±0.4


    Original     		PDF PQ20/16 PQ20/20 PQ26/20 PQ26/25 PQ32/20 PQ32/30 PQ35/35 PQ40/40 PQ50/50 PC44PQ20/16Z-12 BPQ26 25-1112CP BPQ32 PC44PQ50 PC44PQ32 BPQ50/50 FPQ-26 FPQ-35 FPQ-50 16-1114CP

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
    Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3


    Original     		PDF LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P

    Untitled

    Abstract: No abstract text available
    Text: Transformers/Choke Coils Series Series FEI•FEE Shape of Core FEI12.5 FEI16 Output Wattage Forward Method Flyback Method 50kHz W 100kHz(W) 50kHz(W) 100kHz(W) 3 to 8 4 to 10 2 to 5 3 to 6 10 to 15 13 to 19 3 to 8 4 to 10 12 to 18 15 to 23 5 to 10 6 to 13


    Original     		PDF FEI12 FEI16 50kHz 100kHz FEI25 FEI28 FEI35S FEI40

    Untitled

    Abstract: No abstract text available
    Text: article name FEI12.5 Core Ae 0.15 Bobbin W 1.9 EB12.5-P1210-F 14 max. 10 - ø1.1 7.5 14 max. 11 max. Recommended pin pattern dimensions 2.5 5.0 7.5 10.0 article name FEI16 FEE16 Core Ae 0.19 0.19 Tolerance ȗ 0.1 Bobbin W 3.2 3.3 EB16-P1206-F 17.5 max. 6 - ø1.1


    Original     		PDF FEI12 5-P1210-F FEI16 FEE16 EB16-P1206-F EB19-P1208-F FEI19 FEE19 EB19-P1205-F FPQ3220-T-22

    NC-2H

    Abstract: 2HM5 FPQ 240
    Text: NEW Material ver.1.1 BM30 Material ※RoHS指令対応 High Saturation Flux Density & Low Loss Power Ferrite Material 鉛カドミウム、水銀、六価クロム及び特定臭素系難燃材PBB及びPBDEを使用しておりません。 過酷な環境下において実現が困難であった高飽和磁束密度材開発に成功！更に損失を最小限に抑制しトランス容積


    Original     		PDF 10kHz 194A/m 100kHz 100kHz-200mT f10kHz Hm1194A/m NC-2H 2HM5 FPQ 240

    FPQ-50

    Abstract: FPQ-35 fpq32 FPQ26 NC-2h ferrite material 2HM5 NC-2H FPQ-26 FPQ20 LE 3516
    Text: PQ - Type Ferrite Cores •Ordering Code System [ Cores ] F PQ ① - 20/20 - M ② ③ NC-7 ④ ①Type of Core ②Size of Core ③Mirror Lapping ④Material − 69 − I1 C I2 A PQ-Type Cores H B Cores F Dimensions mm Weight A B C F H φI1 I2 (g/Set) FPQ-20/16


    Original     		PDF FPQ-20/16 FPQ-20/20 FPQ-26/20 FPQ-26/25 FPQ-356 FPQ-50/50 FPQ-40/40 FPQ-35/35 FPQ-32/30 FPQ-32/20 FPQ-50 FPQ-35 fpq32 FPQ26 NC-2h ferrite material 2HM5 NC-2H FPQ-26 FPQ20 LE 3516

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION


    Original     		PDF MIL-M-38510 MIL-STD-883 Yamaichi ic354 IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240