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Abstract: No abstract text available
Text: FICHE SIGNALÉTIQUE SECTION 1 - PRODUIT ET IDENTIFICATION DE LA COMPAGNIE Nom / Identificateur du Produit: THERMALCOTE I I Usage du Produit: Le composé du transfert de chaleur Description du Produit: pâte bleu, l'odeur caractéristique tempérée Nom du Fabricant
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DCVF-5 Hoja de Datos
Abstract: No abstract text available
Text: HOJA DE DATOS DE SEGURIDAD DE LOS MATERIALES SECCIÓN 1 - IDENTIFICACIÓN DEL PRODUCTO Y DE LA EMPRESA NOMBRE DEL PRODUCTO: THERMALCOTE I USO GENERAL: Compuesto de transferencia de calor DESCRIPCIÓN DEL PRODUCTO: Pasta blanca de leve olor característico
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Untitled
Abstract: No abstract text available
Text: MATERIAL SAFETY DATA SHEET THERMALCOTE II SECTION 1 - PRODUCT AND COMPANY IDENTIFICATION PRODUCT NAME: THERMALCOTE II PRODUCT DESCRIPTION: Blue paste, mild characteristic odor GENERAL USE: Heat transfer compound MANUFACTURER'S NAME Aavid Thermalloy, LLC. DATE PREPARED: July 12, 2010
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Untitled
Abstract: No abstract text available
Text: Siete 1 von 4 MATERIALSICHERHEITSDATENBLATT ABSCHNITT 1 - PRODUKT - UND HERSTELLERIDENTIFIZIERUNG PRODUKTNAME: TEILENUMMER: THERMALCOTE I ALLGEMEINE VERWENDUNG: Wärmeübertragungmittel PRODUKTBESCHREIBUNG: Weiße Paste, Schwacher Geruch NAME D. HERSTELLERS:
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thermalcote
Abstract: No abstract text available
Text: FICHE SIGNALÉTIQUE SECTION 1 - PRODUIT ET IDENTIFICATION DE LA COMPAGNIE Nom / Identificateur du Produit: THERMALCOTE I Usage du Produit: Le composé du transfert de chaleur Description du Produit: pâte blanche, l'odeur caractéristique tempérée Nom du Fabricant
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Abstract: No abstract text available
Text: Page 1/9 Safety Data Sheet according to 1907/2006/EC REACH , 1272/2008/EC (CLP), and GHS Printing date 11.04.2012 Revision: 03.04.2012 1 Identification of the substance/mixture and of the company/undertaking • 1.1 Product identifier · Trade name: Thermalcote I
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1907/2006/EC
1272/2008/EC
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Untitled
Abstract: No abstract text available
Text: HOJA DE DATOS DE MATERIALES DE SEGURIDAD SECTION 1 - PRODUCTO / IDENTIFICACION DE COMPANIA NOMBRE DEL PRODUCTO: THERMALCOTE II USO GENERAL: Compuesto transporta caliente DESCRIPCION DEL PRODUCTO: Pasta azul, odor caracteristico suave NOMBRE DEL FABRICANTE
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ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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Aavid 251G
Abstract: MAX02NG MAX03-HNG MAX03H heat staking MAX01HNG Thermalcote THE 249 780101F00000
Text: 796-2012:QuarkCatalogTempNew 9/4/12 7:14 PM Page 796 POWER HEAT SINKS INTERCONNECT TEST & MEASUREMENT 7 IN-SIL-8 Pads, Extruded Heat Sinks, Epoxy and Adhesives Max Clip System™ Thermal Compound and Adhesives ᭤ Reduces Assembly and Labor Costs ᭤ Provides Mounting for Discrete Power Devices
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O-220
577002B00000G
577102B00000G
577102B04000G
577202B00000G
577002B04000G
577202B04000G
6021BG*
Aavid 251G
MAX02NG
MAX03-HNG
MAX03H
heat staking
MAX01HNG
Thermalcote THE 249
780101F00000
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PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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thermpath
Abstract: turpentine shelf life MINERAL SPIRITS THERMPATH 167 Thermal grease silicone grease turpentine 167-35ML SPECIFIC GRAVITY silicone
Text: HEATSINKS & MOUNTINGS HEATSINK ACCESSORIES HEATSINK COMPOUNDS Thermpath A silicone-based, metal oxide filled thermal interface grease offering high thermal conductivity characteristics. Designed to displace air and fill small imperfections between mating surfaces the grease is supplied in syringe form to give precise and economic
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18kV/mm
99W/m
PG0924
thermpath
turpentine shelf life
MINERAL SPIRITS
THERMPATH 167
Thermal grease
silicone grease
turpentine
167-35ML
SPECIFIC GRAVITY
silicone
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88 lead cpga
Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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CH13WIP
88 lead cpga
JEDEC Matrix Tray outlines
cpu Shipping Trays
outline of the heat slug for JEDEC
ceramic pin grid array package wire bond
I 6506
PLASTIC PIN GRID ARRAY PACKAGING
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D3PAK
Abstract: tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249
Text: APPLICATION NOTE APT9503 By Kenneth W. Dierberger and Denis R. Grafham INNOVATIVE MOUNTING TECHNIQUES ENHANCE THERMAL PERFORMANCE OF THE SURFACE-MOUNT D3 PAK PACKAGE PRESENTED AT POWERSYSTEMS WORLD INTERNATIONAL CONFERENCE & EXHIBIT SEPTEMBER 12, 1995 Page 1
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APT9503
B-1330
O-247,
D3PAK
tunnel diode application
to247 pcb footprint
FR4 substrate height and thickness
APT9503
APT4016SN
"tunnel diode" chip assembly
Thermalcote THE 249
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250G AAVID THERMALLOY
Abstract: Thermalcote THE 249 AAVID THERMALLOY 250G 101700F00000G AAVID THERMALLOY 102000F00000G AAVID 101700F00000G 101800F00000G thermalcote 100300F00000G 100500F00000
Text: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- / Interface Materials Products 6 / Greases Thermal Greases Search by part # » Sil - Free RoHS Compliant silicone - free synthetic thermal grease Check distributor part inventory
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cafs-220
Abstract: Seasonic ss series Seventeam power supply Thermotron ST-251HR SS-235PS teac fd 235hf testo anemometer teac FD 5.25 seasonic
Text: Thermal Considerations for the Pentium III processor at 550MHz Heatsinks & Airflow in ATX chassis May 1999 Order Number: 245184-001 Thermal Considerations for the Pentium® III processor Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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550MHz
cafs-220
Seasonic ss series
Seventeam power supply
Thermotron
ST-251HR
SS-235PS
teac fd 235hf
testo anemometer
teac FD 5.25
seasonic
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tucker
Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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AP-577
Box5200,
tucker
CPGA
AP-577
intel DOC
CPGA large cavity
ppga package
Robinson Nugent pga
QUAD Video Processor 208 pin ap
296-Pin
Socket1
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uc3854 3kw pfc
Abstract: uc3854 Application Note Power Factor Correction With the UC3854 2kw pfc uc3854 3kw PFC 3kw APT9901 UNITRODE Claudio de Sa e Silva 3.5kw pfc 3kw uc3854
Text: APPLICATION NOTE APT9901 By: Kenneth Dierberger Denis Grafham OPTIMIZING THE DESIGN OF 3.5kW SINGLE-MOSFET POWER FACTOR CORRECTORS 1 APT9901 Optimizing The Design of 3.5kW Single-MOSFET Power Factor Correctors Kenneth Dierberger, Technical Marketing Manager
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APT9901
B-1330
uc3854 3kw pfc
uc3854 Application Note
Power Factor Correction With the UC3854
2kw pfc
uc3854 3kw
PFC 3kw
APT9901
UNITRODE Claudio de Sa e Silva
3.5kw pfc
3kw uc3854
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uc3854 3kw pfc
Abstract: UNITRODE Claudio de Sa e Silva PFC 3kw Power Factor Correction with the UC3854 2kw pfc sc265 triac 2kw uc3854 3kw uc3854 UC3854 for PFC 3.5kw 3.5kw pfc
Text: APT9901 By Kenneth Dierberger and Denis Grafham OPTIMIZING THE DESIGN OF 3.5KW SINGLE-MOSFET POWER FACTOR CORRECTORS OPTIMIZING THE DESIGN OF 3.5KW SINGLE-MOSFET POWER FACTOR CORRECTORS Kenneth Dierberger, Manager Technical Marketing, Advanced PowerTechnology, 405 S.W. Columbia St., Bend, OR 97702, USA
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APT9901
B-1330
UC3854"
NH03054.
D-90471
UC1854/UC2854/UC3854
pp171-177,
D90471N
uc3854 3kw pfc
UNITRODE Claudio de Sa e Silva
PFC 3kw
Power Factor Correction with the UC3854
2kw pfc
sc265 triac
2kw uc3854
3kw uc3854
UC3854 for PFC 3.5kw
3.5kw pfc
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APT5010LVR
Abstract: TO264 footprint APT5010B2VR 072K barco APT9902 094k SIL-PAD to-247 Orcus
Text: APPLICATION NOTE By: APT9902 Denis Grafham CUTTING-EDGE MOUNT DOWN METHODS BOOST POWER SEMICONDUCTOR PERFORMANCE 1 APT9902 Cutting-Edge Mount Down Methods Boost Power Semiconductor Performance and Cut System Costs Denis Grafham, European Applications Advanced Power Technology
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APT9902
B-1330
O-264
APT5010LVR
TO264 footprint
APT5010B2VR
072K
barco
APT9902
094k
SIL-PAD to-247
Orcus
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smd diode K10
Abstract: switching transformer 300w fuse 6.3A 250v IR1150 800V dc to dc boost converter 019-4119-00 C8100 10BQ040N SIL-PAD to-247 330uf 450v
Text: Computing & Communications SBU - AC-DC APPLICATIONS GROUP 101 N.Sepulveda Blvd., EL Segundo 90245 CALIFORNIA, USA IRAC1150-300W Demo Board User’s Guide Rev.2.2 3/29/2005 Rev. 2.2 3/29/2005 International Rectifier Page 1 of 17 Table of Contents 1
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IRAC1150-300W
CISPR-22
115VAC
smd diode K10
switching transformer 300w
fuse 6.3A 250v
IR1150
800V dc to dc boost converter
019-4119-00
C8100
10BQ040N
SIL-PAD to-247
330uf 450v
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cafs-220
Abstract: Thermotron WP-499-THCM2-705 FD-235HF CAFS-220-5M TEAC FLOPPY ST39140A testo anemometer thermalcote ST39140
Text: Thermal Airflow Considerations SECC2 OLGA HEAT SINK COOLING IN AN ATX CHASSIS February 1999 Order Number: 245139-001 Thermal Airflow Considerations Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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thermpath
Abstract: turpentine shelf life THERMPATH 167 thermstrate thermal conductivity Thermally conductive compounds MINERAL SPIRITS THERMALCOTE ACTIVATOR MESS
Text: PRODUCTION AIDS ADHESIVES/COMPOUNDS THERMALLY CONDUCTIVE ADHESIVE HEATSINK COMPOUNDS Output 315 Thermstrate ® TC A thermally conductive adhesive designed for bonding electronic components to heatsinks or PCBs, eliminating the need for mechanical retention. The high thermal conductivity ensures excellent heat transfer.
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99W/m
PG/0417
thermpath
turpentine shelf life
THERMPATH 167
thermstrate
thermal conductivity
Thermally conductive compounds
MINERAL SPIRITS
THERMALCOTE
ACTIVATOR
MESS
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TT 2222 Horizontal Output Transistor pins out dia
Abstract: bgs2 7130D MS35649-264 TRANSISTOR REPLACEMENT GUIDE d882 D882 TRANSISTOR circuit example ASTM D2520 PF434 6032B-TT 579103C
Text: General information How to use this standard part catalog. 2
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transistor cross reference
Abstract: MPT3N40 Westinghouse SCR handbook LT 8224 ZENER DIODE sje389 N9602N npn transistor RCA 467 TFK 7 segment displays PUT 2N6027 delco 466
Text: C K TBD DOLLY LIST LOGO LIST SAFETY & RELIABLTY TEK PN SYSTEM II DIGITAL IC's MEMORIES. MOS. CM OS.ECL. TTL MICROPROCESSOR SPECIAL FUNCTION IC's DIGITAL / LINEAR ARRAYS LINEAR IC'S (PURCH) TEK-MADE IC’s 3 IC's INDEX (COLORED PGS) INCL PRGMD. SCRND.ETC
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